467862 DUNE PCB Assembly Service Request for Quote (RFQ)

Brookhaven Science Associates, LLC, operating Brookhaven National Laboratory under a prime contract with the U.S. Department of Energy Office of Science, is soliciting quotes for printed circuit board assembly services under RFQ 467862. The procurement involves manufacturing PCB assemblies for the DUNE (Deep Underground Neutrino Experiment) project, specifically the FD-VD FEMB IO-1865-1K assemblies that must operate at cryogenic temperatures of 77 Kelvin. Potential contractors must demonstrate a minimum of 20 years of experience in complex PCB assemblies and proven capability in manufacturing cryogenic electronics assemblies involving approximately 50 different component types and 1,500 total components using both surface mount and through-hole technologies. The evaluation will be conducted on a lowest-priced, technically acceptable basis, requiring strict adherence to IPC-A-610 Class II standards and comprehensive documentation of previous cryogenic electronics experience. Quote submissions are due by 3:00 PM Eastern Time on October 17, 2025, with questions directed to Lisa Gonzales at lgonzales@bnl.gov.

This procurement does not utilize any small business set-aside designations, though BSA maintains overall small business participation goals of 50% including specific targets for various disadvantaged business categories. The contract structure includes two phases: a pre-production phase requiring 25 board assemblies to be delivered within one month of request, and an optional Phase 2 requiring 2,095 board assemblies delivered over 6 months in batches. The firm fixed price contract has a total performance period of 8 months after award, with BSA providing the PCBs and parts while the contractor performs assembly services offsite. All work will be performed at the contractor's facility, though the final delivery destination is Brookhaven National Laboratory in Upton, New York. The solicitation was updated on October 6, 2025, to include additional technical specifications including the Bill of Materials and Gerber files as part of Exhibit B.