Enclosure 2 - RFQ Qualifiers Assembly.pdf
PDF 25 KB Posted
- Solicitation number
- 467862
- Issued by
-
Department of Energy Office of Science
About this file
This document is a Qualification Requirements document for DUNE FD-VD FEMB IO-1865-1K PCB Assembly, dated 2025/07/29. The document outlines strict qualification criteria for manufacturers seeking to produce printed circuit board (PCB) assemblies for the DUNE (Deep Underground Neutrino Experiment) project. Key requirements include: (1) a minimum of 20 years of experience in complex PCB assemblies, and (2) demonstrated capability to manufacture cryogenic electronics assemblies with specific technical specifications.
The PCB assemblies must work at cryogenic temperatures (77 K), with no alterations allowed to the bill of materials. Manufacturers must prove experience with complex assemblies involving approximately 50 different component types, mixing surface mount and through-hole technologies, totaling around 1,500 components. They are required to provide detailed references documenting at least three successfully fabricated jobs, including specifics on board size, component types, mounting technologies, compliance certifications (IPC-A-610 Class II), ESD handling procedures, and evidence of board performance at cryogenic temperatures. Failure to provide comprehensive documentation will result in a non-responsive offer.
View the file
Other files
On GovTribe
Work with this file
- Download the original file
- Contacts named in this file
- Similar government files
- Ask GovTribe AI about this file
Text version
2025/07/29
DUNE FD-VD FEMB IO-1865-1K PCB Assembly Qualifiers
FEMB-VD IO-1865-1K assembly has to work at cryogenic temperature (77 K) in DUNE FD-VD detector, no alternation of bill of materials is allowed for the construction of these assemblies.
Only manufacturers which have experience of building cryogenic electronics assemblies with similar complexity should be considered. Otherwise, extended delay to qualify the manufacturer is expected, which is not compatible with DUNE project schedule.
Extensive evaluation tests have been carried out at BNL to qualify FEMB assemblies produced by the manufacturer at cryogenic temperature (77 K). Manufacturer submitting the bid must demonstrate that it has experience of building cryogenic electronics assemblies with similar complexity (~50 different types of components with mix of surface mount and through hole technologies, ~1,500 components, certificate of compliance per IPC-A-610 class II, stringent handling procedure for ESD sensitive components).
1. Offeror shall have a minimum of 20 years working experience in the areas of complex PCB assemblies.
The offeror shall provide reference documentation demonstrating 20 years or more of work experience in the areas of complex board assemblies.
2. Does the offeror have previous experience building cryogenic electronics assemblies with similar complexity (~50 different types of components with mix of surface mount and through hole technologies, ~1,500 components, certificate of compliance per IPC-A-610 class II, stringent handling procedure for ESD sensitive components) with reference to the assembly drawing package?
If YES, the offeror shall provide references for at least 3 successfully fabricated jobs with comparable complexity with key parameters listed below.
a. Board size
b. Number of different types of components
c. Number of components in surface mount technology
d. Number of components in through hole technology
e. Number of components mounted on board
f. Certificate of compliance per IPC-A-610 class II
g. Handling procedure for ESD sensitive components
h. Evidence of boards being used at cryogenic temperature (< 120 K)
The references shall include the name of the organization, contacts, phone numbers, and e-mail addresses.
Failure to provide the above information will render your offer non-responsive.
File details come from the government source that posted it. Updated .