A01_-_Salient_Characteristics.doc

Salient Characteristics

Commercial Availability Certification:

I have evaluated the commercial marketplace and determined that all of the salient characteristics documented below are available in products/services offered in the commercial marketplace.

Signature (typed name): Jerry C. LaSalvia Technical Point of Contact (TPOC) or Contracting Officer’s Representative (COR)

CLIN 0001:

Period of Performance/Delivery Date: Within eight (8) months after contract award (ACA) One (1) Focused Ion Beam – Field Emission Scanning Electron Microscope (FIB-FESEM) Dual-Beam System with the following minimum specifications:

(1A) Ion Beam Related Characteristics

1. Gallium (Ga) ion source.

2. Maximum ion accelerating voltage of 30 kilovolts (kV).

3. Minimum ion accelerating voltage of 500 volts (V).

4. Minimum ion probe current of one (1) picoamp (pA) or lower.

5. Maximum ion probe current of 50 nanoamp (nA) or higher.

6. Minimum ion source life of at least 1000 microamphours (Ahrs).

7. Minimum ion beam resolution(s) (selective edge method):

· at 30kV: three (3) nanometers (nm) or better

· at 500V: 500 nm or better

8.

Multi-gas injection system (GIS) unit capable of simultaneously housing at least five (5) deposition precursor chemicals and injecting them from a single nozzle allowing for the deposition of Tungsten (W), Platinum (Pt), Carbon (C), and Silica (SiOx), and at least 2 of the 6 chambers allowing external gas flow, for example Water (H2O), Carbon Tetrafluoride (CF4), and Xenon Difluoride (XeF2).

(1B) Electron Beam Related Characteristics

9. High-stability Schottky field-emission electron emitter.

10. Maximum electron accelerating voltage of 30 kV.

11. Minimum electron accelerating voltage of 200 V or lower.

12. Minimum electron probe current of one (1) pA or lower.

13. Maximum electron probe current of 100 nA or higher.

14. Minimum resolution(s):

· at 30kV: at least one (1) nm or better (in Scanning/Transmission Electron Microscopy (STEM) mode)

· at 15kV: at least one (1) nm or better

· at 1kV: at least two (2) nm or better

· at 0.5kV: at least two (2) nm or better

15. Beam deceleration capability allowing landing energies of 50 electron-volts (eV) or lower.

16. Maximum field-of-view of two (2) millimeters (mm) or higher.

17. Minimum scan speed of 25 nanoseconds (ns) or faster.

18. Minimum number of simultaneously scanned channels of four (4).

19. Scan features include at a minimum: line averaging, drift-compensated frame integration, standard frame integration, and frame averaging capabilities.

(1C) Specimen Chamber and Stage Related Characteristics

20. Large chamber with minimum width x depth x height dimensions of 300 x 300 x 300 mm.

21. Large chamber with a minimum of 15 ports.

22. Large chamber with integrated plasma cleaner.

23. Specimen stage with minimum: (1) X-Y-Z range of 130-130-10 mm; (2) continuous rotation of 360 degree (o), and tilt range of -10o to +60o.

24. Specimen stage with minimum specimen weight capability of 0.5 kilograms (kg) at 0o tilt.

25. Minimum XY stage movement repeatability at 0o tilt of at least one (1) micron (m).

26. Integrated column and chamber isolation for vibration damping.

(1D) Detector Related Characteristics

27. At a minimum, the following types of detectors or equivalent:

· Everhart-Thornley secondary electron (SE)

· In-lens secondary electron/backscattered electron (SE/BSE)

· In-column SE/BSE

· In-column backscattered electron (BSE)

· Retractable segmented back-scattered electron (BSE)

· Retractable segmented STEM with bright-field (BF), dark-field (DF), and high-angle dark-field (HADF) modes.

28. In-chamber navigation camera or low magnification capability equivalent.

29. Infrared (IR) chamber camera.

30. EDAX TEAM Pegasus Integrated EDS-EBSD with Octane Elite-70 and Hikari Super SEM interface for Hikari Camera integrated energy-dispersive X-ray spectroscopy/electron back-scattered detector (EDS/EBSD) system or most-current EDAX integrated EDS/EBSD system.

(1E) Vacuum Related Characteristics

31. Completely oil free vacuum system.

(1F) Additional Equipment Characteristics

32. Drift correction.

33. Auto transmission electron microscopy (TEM) specimen preparation capable.

34. Automated mosaic capturing and image stitching capable.

35. Uninterruptible power supply (UPS).

36. Programming (e.g. scripting) for automated specimen characterization and/or fabrication capable.

37. Graphical user interface that has 100% commonality with the dedicated FESEM (see Field Emission Scanning Electron Microscope (FESEM) System requirement below) with respect to the scanning electron microscopy controls, imaging, and software, excluding low vacuum control.

38. State-of-the-art technology (system and software) for FIB sample preparation (e.g. transmission electron microscope foil or atom-probe tips).

39. Automated serial sectioning, imaging, analytical characterization, and three dimensional (3D) tomography reconstruction (e.g. imaging, EDS, and EBSD) capable.

40. A minimum three (3) year extended warranty on all warrantied parts and components (non-consumable).

41. The Awardee shall conduct a site visit to Aberdeen Proving Ground (APG) within 30 days ACA to evaluate the installation location for the system and provide the technical point of contact (TPOC) with modification recommendations for the installation location based upon required system equipment. The Awardee shall coordinate the site visit directly with the TPOC and the site visit shall not exceed one (1) business day.

42. Environmental factors mitigation including, but not limited to: vibration, acoustic noise, temperature, and electromagnetic field interference (EMI) if required based upon awardee site survey.

43. The Contractor shall install the System at Aberdeen Proving Ground (APG), MD and conduct acceptance testing with Government personnel in attendance within eight (8) months ACA.

One (1) Field Emission Scanning Electron Microscope (FESEM) System with the following minimum specifications:

(2A) Electron Beam Related Characteristics

1. High-stability Schottky field-emission electron emitter.

2. Maximum electron accelerating voltage of 30 kV.

3. Minimum electron accelerating voltage of 200 V or lower.

4. Minimum electron probe current of 10 pA or lower.

5. Maximum electron probe current of 100 nA or higher.

6. High-vacuum minimum resolution:

· at 30kV: at least one (1) nm or better (including STEM mode)

· at 15kV: at least one (1) nm or better

· at 1kV: at least two (2) nm or better

· at 0.5kV: at least two (2) nm or better

7. Low-vacuum minimum resolution:

· at 30kV: at least two (2) nm or better

· at 3kV: at least two (2) nm or better

8. Maximum field-of-view of three (3) mm or higher.

9. Minimum scan speed of 25 ns or faster.

10. Minimum number of simultaneously scanned channels of four (4).

11. Scan features include at a minimum: line averaging, drift-compensated frame integration, standard frame integration, and frame averaging capabilities.

12. Beam deceleration capability allowing landing energies of 50 eV or lower.

13. Automated electron beam and aperture alignments.

(2B) Specimen Chamber and Stage Related Characteristics

14. Large chamber with minimum width x depth x height dimensions of 250 x 250 x 250 mm.

15. Large chamber with a minimum of nine (9) ports.

16. Large chamber with integrated plasma cleaner.

17. Specimen stage with minimum: (1) X-Y-Z range of 100-100-50 mm; (2) continuous rotation of 360o, and tilt range of -3o to +70o.

18. Specimen stage with minimum specimen weight capability of 0.5 kg at 0o tilt.

19. XY stage movement repeatability at 0o tilt equal to three (3) m or lower.

20. Integrated column and chamber isolation for vibration damping.

(2C) Detector Related Characteristics

21. At a minimum, the following types of high-vacuum detectors or equivalent:

i. Everhart-Thornley SE

ii. In-lens SE/BSE

iii. In-column SE

iv. Retractable segmented BSE

v. Retractable segmented STEM with bright-field (BF), dark-field (DF), and high-angle dark-field (HADF)modes.

22. At a minimum, the following types of low-vacuum detectors or equivalent:

i. SE

ii. BSE

23. In-chamber navigation camera or low magnification capability equivalent.

24. Infrared (IR) camera.

25. Transfer and integrate existing TEAM Pegasus Integrated EDS-EBSD with Octane Elite-70 and Hikari Super SEM interface for Hikari Camera from FEI Nova NanoSEM 600 to new FESEM system.

26. Simultaneous collection of EDS and EBSD data from the same planar region.

(2D) Vacuum Related Characteristics

27. Low vacuum capable with a maximum and minimum pressure of 500 Pascals (Pa) or higher and 10 Pa or lower, respectively.

28. Completely oil free vacuum system.

(2E) Additional Equipment Characteristics

29. Two (2) single-gas injection system (GIS) units for Platinum (Pt), Tungsten (W), and/or Carbon (C) depositions.

30. Drift correction.

31. Automated mosaic capturing and image stitching capable.

32. UPS

33. A minimum three (3) year extended warranty on all warrantied parts and components (non-consumable)

34. The Awardee shall conduct a site visit to Aberdeen Proving Ground (APG) within 30 days ACA to evaluate the installation location for the system and provide the technical point of contact (TPOC) with modification recommendations for the installation location based upon required system equipment. The Awardee shall coordinate the site visit directly with the TPOC and the site visit shall not exceed one (1) business day.

35. Environmental factors mitigation including: vibration, acoustic noise, temperature, and electromagnetic field interference (EMI) if required based upon awardee site survey.

36. The Contractor shall install the System at APG, MD and conduct acceptance testing with Government personnel in attendance within eight (8) months ACA.

AT-OPSEC Requirements:

Question 2

Access and general protection/security policy and procedures. This standard language is for contractor employees with an area of performance within Army controlled installation, facility, or area. Contractor and all associated sub-contractors employees shall provide all information required for background checks to meet installation access requirements to be accomplished by installation Provost Marshal Office, Director of Emergency Services or Security Office. Contractor workforce must comply with all personal identity verification requirements (FAR clause 52.204-9, Personal Identity Verification of Contractor Personnel) as directed by DOD, HQDA and/or local policy. In addition to the changes otherwise authorized by the changes clause of this contract, should the Force Protection Condition (FPCON) at any individual facility or installation change, the Government may require changes in contractor security matters or processes.

Question 2b.

For contractors that do not require CAC, but require access to a DoD facility or installation. Contractor and all associated sub-contractors employees shall comply with adjudication standards and procedures using the National Crime Information Center Interstate Identification Index (NCIC-III) and Terrorist Screening Database (TSDB) (Army Directive 2014-05/AR 190-13), applicable installation, facility and area commander installation/facility access and local security policies and procedures (provided by government representative), or, at OCONUS locations, in accordance with status of forces agreements and other theater regulations.

Contracting Officer:

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