SQMS HELIUM FRIDGE SPEC ED0044143---SPEC.pdf

SQMS DILUTION REFRIGERATOR #9 SPECIFICATION, ED0044143, Rev. -

Form Revised January1, 2013 Page 1

Fermilab Engineering Specification

SQMS DILUTION REFRIGERATOR #9 SPECIFICATION

ED0044143, Rev. -

Rev. Date Description Originated By Checked By Approved By

- 28 JAN 2026 Initial Release

M. Dubiel

J. Delgado

G. Tatkowski

C. James S. Zorzetti

Fermi National Accelerator Laboratory

P.O. Box 500 - Batavia, Illinois - 60510

Form Revised January1, 2013 Page 2

1. Table of contents

1. Table of contents

2. Introduction

3. Definitions

4. Procurement Specification Requirements

5. Description of work

6. Drawing, Code and Documentation Requirements

7. Materials Requirements

8. Thermal Performance Requirements

9. Mechanical Interface Requirements

10. Electrical Requirements

11. Thermometry, Heater and Wiring Requirements

12. Other Requirements

13. Required Testing

14. Design Verification and Approval Requirements

15. Quality Control Requirements

16. Shipping Requirements

17. Required Documentation

Fermi National Accelerator Laboratory

P.O. Box 500 - Batavia, Illinois - 60510

Form Revised January1, 2013 Page 3

2. Introduction

The Superconducting Quantum Materials and Systems Center (SQMS) led by Fermi National

Accelerator Laboratory (Fermilab) seeks to procure a dilution refrigerator capable of continuously maintaining temperatures below 30mK. This refrigerator will be featured in the new Training

Platform at SQMS to provide dedicated cryogenic infrastructure supporting workforce development and research in superconducting radiofrequency systems, optical device measurement, and quantum device design and development.

The refrigerator is intended to support rapid cooldown and turnaround cycles, enabling frequent sample and device exchange to facilitate high-throughput training, experimentation, and measurement programs. This system will position Fermilab as a leader in training the next generation of the quantum science and engineering workforce, along with contributing to other research and development areas such as superconducting materials, cavities, quantum systems and entanglement-enhanced sensing. Because of this, Fermilab desires a refrigerator with smaller capacity and quicker cooldown time compared to alternative large dilution refrigerator solutions enabling faster experimental turnaround times and device measurements, and accessibility for training and instructional use.

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3. Definitions

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Text used in this document Definition

Base temperature See definition in Section 8.4

BIDDER Any entity submitting a response to this RFP

BUYER Fermi National Accelerator Laboratory, Batavia IL.

BUYER SITE See definition in Section 5.1.1

CC Cryocooler

CCP1

DEVICE thermal stage cooled by the first stage of the cryocooler

CCP2

DEVICE thermal stage cooled by the second stage of the cryocooler

Continuously See definition in Section 8.1

DEVICE The dilution refrigerator the subject of this specification

DEVICE ASSEMBLY

All equipment necessary for the successful operation of the dilution refrigerator (includes the DEVICE itself, pumps, gas handling equipment, support electronics etc.)

FESHM

Fermilab Environment, Safety and Health Manual. FESHM chapters are available at:

https://eshq.fnal.gov/manuals/feshm/

FFDG Fermi Forward Discovery Group, LLC

Fully configured See definition in Section 8.2

Hold point See definition within Section 4.5.1

MIP See definition in Section 15.2

MRR Manufacturing Readiness Review

MXC

Dilution refrigerator mixing chamber plate (lowest temperature stage of the DEVICE)

NRTL

Nationally Recognized Testing Laboratory; an organization recognized by the U.S. Occupational Safety and Health

Administration (OSHA) as meeting the legal requirements in 29 CFR 1910.7 to perform testing and certification of products using consensus based test standards.

OVC Outer-most vacuum chamber

P&ID Piping and Instrumentation Diagram

PID Proportional Integral Derivative

PLC Programmable Logic Controller

PO Purchase Order

QA Quality Assurance

QC Quality Control

QAP QA Plan

QCP QC Plan

RFP Request for Proposal

Safe state See definition in Section 12.16.1.1

SELLER The provider of the DEVICE ASSEMBLY

SQMS Superconducting Quantum Materials and Systems Center https://eshq.fnal.gov/manuals/feshm/

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ST Dilution refrigerator still plate

Steady-state operation See definition in Section 8.3

Table 1. Definitions of text used in this specification document.

Additionally, for the purposes of this document, the following terms indicate the following:

3.1. May: A term which indicates that a provision is neither required nor prohibited.

3.2. Shall: A term which indicates that a provision is a requirement.

3.3. Should: A term which indicates that a provision is recommended as good practice but is not a requirement.

3.4. Any written correspondences between the SELLER and the BUYER, initiated by the SELLER, shall include the individuals given below in Table 2:

BUYER-side contact person E-mail

Yvette Torres ytorres@fnal.gov

Greg Tatkowski gtatkows@fnal.gov

Matt Dubiel mdubiel@fnal.gov

Julian Delgado jdelgado@fnal.gov

Jemila Adetunji jemila@fnal.gov

Table 2. Individuals whom the SELLER shall include in any written correspondences.

4. Procurement Specification Requirements

4.1. The PO will be owned and managed by FFDG.

4.2. The BUYER requests the purchase of one DEVICE ASSEMBLY.

4.3. The BIDDER shall provide a quotation, including all costs to deliver the quantity of DEVICE

ASSEMBLY(S) specified in Section 4.2 to the BUYER SITE. The quotation shall comply with all specifications and documentation requirements set forth herein and shall explicitly include the following:

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4.3.1. A schedule that does not extend beyond 15 calendar months after the award of the

FFDG PO. Within this period, the SELLER shall complete all obligations related to the delivery of the DEVICE ASSEMBLY(S).

4.3.2. BIDDER past experience, including examples of past projects (within the last five years) similar in scope, complexity, and value which best illustrate the bidder’s capability, experience and performance.

4.3.3. A QAP which outlines the quality program which the BIDDER has established.

4.3.4. A technical proposal demonstrating the BIDDERS ability to deliver the quantity of

DEVICE ASSEMBLY(S) specified in Section 4.2 complying with all specifications and documentation requirements set forth herein.

4.3.4.1. BIDDERS are encouraged to submit a quotation for the DEVICE ASSEMBLY even if the proposal does not fully conform to all specifications set forth herein. In such cases, the BIDDER shall provide a detailed, itemized list identifying each deviation from this specification, together with a technical justification or rationale supporting each deviation.

4.3.5. All documentation required by this specification shall be written in English and submitted electronically.

4.4. A FFDG PO will be awarded to a single successful BIDDER following BUYER evaluation of bids. Further information concerning the BUYER’s bid evaluation process may be provided to a BIDDER upon request to the personnel specified in Table 2.

4.5. Hold Points:

4.5.1. A “hold point” is defined herein as a point in the design, fabrication, assembly, testing, or shipping process at which work shall cease until the specified verification, inspection, or approval has been completed and formally documented. Work shall not proceed beyond a given “hold point” without explicit written authorization from the BUYER. The

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SELLER shall be responsible for any costs that occur as a result of prematurely advancing beyond a hold point. Table 3 identifies all hold points and the associated mandatory submittals required to be met prior to work continuation.

4.5.2. The BUYER shall not, under any circumstances, accept delivery of the DEVICE, DEVICE

ASSEMBLY, or any of their subassemblies as part of any shipment unless a “Shipping

Readiness Review” (as specified in Table 3) applicable only to that specific shipment has been successfully completed. Any shipment made without explicit written authorization from the BUYER per Section 4.5.1 shall be deemed unauthorized and shall be returned to the SELLER at the SELLER’s sole cost and risk, including, but not limited to, all transportation, handling, and associated fees. Completion of a “Shipping Readiness

Review” for one shipment shall not constitute authorization for any other shipment.

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Hold point Description Submittals Required timeline

0 Proposal Review Documentation required per Section 4.3.

Determined by

BUYER.

A Kick-off Meeting

Documentation approved by the BUYER and SELLER acknowledging that the SELLER shall comply with this specification, except for those SELLER non-compliances and deviations expressly identified in a written list as set forth in Section 4.3.4.1. Any deviation, exception, or non-compliance not disclosed in accordance with Section

4.3.4.1 shall be subject to BUYER remedies in accordance with the PO and governing contract terms.

Within 2 weeks from PO award.

B Manufacturing

Readiness Review

The SELLER shall provide all documents required within Section 14, fully completed and in accordance with the specifications set forth therein. Fabrication of the DEVICE ASSEMBLY cannot commence until written BUYER authorization has been granted for all such documents per Section 14.1.

As specified in Section 14.1.

C Shipping

Readiness Review

The SELLER shall provide all documents required within Section 17, fully completed and in accordance with the specifications set forth therein. Additionally, the SELLER shall share with the BUYER the details of the shock and vibration monitoring system(s) on the shipping crates per

Section 16.3.4. Lastly, where applicable, the SELLER shall provide all documents required within Section 10.3, fully completed and in accordance with the specifications set forth therein.

Prior to any shipments of the

DEVICE

ASSEMBLY from

SELLER to BUYER.

D

BUYER SITE

Acceptance

Testing Review

Documentation approved by the BUYER and SELLER acknowledging that the DEVICE

ASSEMBLY, installed at the BUYER SITE, meets the requirements set forth within the documentation approved by the BUYER and SELLER in the “Submittals” of the “Kick-off Meeting” of this Table.

As specified within Section

13.3.

Table 3. Hold points and documentation submittals for fabrication phase.

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5. Description of work

5.1. The SELLER shall furnish or subcontract all facilities, equipment, special tooling, consumables and material, except where explicitly excluded in this specification and perform all work and services necessary to generate fabrication drawings, fabricate, assemble, test and deliver to the BUYER SITE the quantity of DEVICE ASSEMBLIES specified in Section 4.2, fully functional and in strict accordance with this specification.

5.1.1. Specifically, the BUYER SITE referenced in 5.1 is located at:

Fermi National Accelerator Laboratory Wilson Street and Kirk Road

Batavia, IL 60510

5.2. The SELLER shall provide any and all documentation required within Section 4.5 in accordance with any timelines specified therein.

6. Drawing, Code and Documentation Requirements

6.1. In any and all instances where work being performed on the DEVICE ASSEMBLY, including, but not limited to design, analysis, engineering, fabrication, assembly, examination, testing and inspection, falls within the scope of a below listed code or standard, that code or standard shall apply:

6.1.1. ASME BPVC-VIII, latest edition, for any vessels over 6 inches in diameter and containing 15 psig or more.

6.1.2. ASTM E498 standard methods of testing for leaks using the mass spectrometer leak detector or residual gas analyzer in the tracer probe mode, latest edition, or equivalent.

6.1.3. ASTM E499 standard methods of testing for leaks using the mass spectrometer leak detector in the detector probe mode, latest edition, or equivalent.

6.1.4. NFPA 101, Life Safety Code, latest edition.

6.1.5. International Building Code, latest edition.

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6.2. If the SELLER deems it necessary to observe any additional governing codes or regulations, the BUYER shall be notified in writing prior to the “Manufacturing Readiness Review” as specified in Table 3.

7. Materials Requirements

7.1. All materials and components used in the construction of the DEVICE ASSEMBLY shall be new and suitable for the use for which they are intended.

7.2. The following materials shall be used for the fabrication of the plates (e.g. CCP1, CCP2, ST, and MXC) and thermal radiation shields of the DEVICE:

7.2.1. CCP1 and CCP2 shall be fabricated from either UNS C10100, UNS C10200 or equivalent copper alloy, or UNS A96061, UNS A91050, UNS A91100, UNS A96063, or equivalent aluminum alloy.

7.2.2. Any plate which operates at a temperature at or below the ST, including the ST through MXC plates, shall be fabricated from gold-plated UNS C10100, UNS C10200 or equivalent copper alloy.

7.2.3. The OVC plate shall be fabricated from UNS A96061, A97075, or equivalent aluminum alloy or UNS S30400, UNS S30403, UNS S31600, UNS S31603, or equivalent stainless steel.

8. Thermal Performance Requirements

8.1. “Continuously” is defined herein as an uninterrupted duration lasting at minimum 336 hours.

8.2. “Fully configured” is defined herein as a DEVICE ASSEMBLY in which all items specified in

Sections 7 through and including Section 12 of this specification are installed, integrated, and fully operational in their intended configurations, and in full compliance with all functional, electrical, optical, mechanical, interface and any other requirements specified therein.

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8.3. “Steady-state operation” is defined herein as the ability of the DEVICE to “continuously” (as defined in Section 8.1) attain and maintain temperatures at or below each of the temperatures specified in Table 4 while simultaneously providing the corresponding cooling power(s).

8.4. “Base temperature” is defined herein as the MXC temperature achieved by the DEVICE under “steady-state operation” (as defined in Section 8.3) at or below the lowest temperature value specified in Table 4, while sustaining the heat load associated with the lowest temperature value specified in Table 4.

MXC

temperature

Cooling power available at MXC during steady-state operation (as defined in Section 8.3) at specified MXC temperature

30 mK 0 µW 50 mK 15 µW

100 mK 250 µW

Table 4. Thermal performance requirements of the DEVICE.

8.5. The DEVICE shall be capable of “continuously” (as defined in Section 8.1) maintaining

“steady-state operation” (as defined in Section 8.3) without the use of an external liquid nitrogen cold trap.

8.6. The DEVICE shall be capable of cooling from ambient room temperature to “base temperature” (as defined in Section 8.4) in under 32 hours when all wiring described within

Section 11 is installed in the DEVICE.

9. Mechanical Interface Requirements

9.1. Any threaded holes which are utilized during regular operations of the DEVICE (including holes for mounting thermal shields, etc.) shall contain threaded inserts manufactured from

Nitronic 60 stainless steel or equivalent material specifically selected to prevent galling with stainless steel or brass fasteners.

9.2. A square array of threaded holes shall be provided on both sides of the MXC for mounting of experimental equipment and shall use M4 x 0.7 threading with 20 mm grid spacing.

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9.3. The DEVICE shall be designed to accommodate, at minimum, an experimental equipment mass of 12 kg attached to the MXC with an experimental equipment mass of 3 kg simultaneously attached to the ST.

9.4. When fully closed and assembled, the DEVICE shall provide:

9.4.1. A minimum of 280 mm of vertical clearance in the experimental space attached to the

MXC; and

9.4.2. A minimum of 140 mm of radial clearance measured perpendicular to the MXC centerline from the MXC center point to the innermost radiation shield.

9.5. The DEVICE ASSEMBLY shall include a mounting frame suitable for operation of the DEVICE.

In addition, the mounting frame shall satisfy the following requirements:

9.5.1. The frame shall comply with the International Building Code (IBC), latest edition.

9.5.2. Suitable passive vibration isolation shall be installed in the interface between the support frame of the DEVICE ASSEMBLY and the DEVICE. This passive vibration isolation shall have vibration isolation comparable to the configuration specified in Section 12.6.1, or better.

9.5.3. Provision for installation of active vibration isolation equipment shall be included in the frame.

9.5.3.1. If possible, the BIDDER quotation shall include an active vibration isolation system as an option and a description of the differences in performance on the

MXC stage.

9.6. The final installed size of the DEVICE ASSEMBLY shall be such that it fits into a room of dimensions 161-inch width by 147-inch depth with 101-inch celling height with appropriate egress for operations, maintenance and assembly of the DEVICE in compliance with NFPA

101, latest edition. Minimum corridor or aisle width within the room containing the fully

Form Revised January1, 2013 Page 14 installed DEVICE ASSEMBLY, clear of any obstructions, cannot be less than 36-inches. BUYER will provide a sketch of room layout and dimensions.

10. Electrical Requirements

10.1. The CC compressors shall operate on 208 VAC 60 Hz 3-phase power.

10.2. All other components of the assembled DEVICE ASSEMBLY shall operate on 208 VAC 60

Hz 1-phase, 208 VAC 60 Hz 3-phase, or 120 VAC 60 Hz 1-phase power.

10.3. All electrical equipment, components, conductors, and other electrical material shall be of a type that is listed, labeled, or tested by a NRTL. Any SELLER-provided equipment or systems which are not listed, labeled or tested by a NRTL shall be evaluated, certified, and documented, at the expense of the SELLER, by one of the following methods:

10.3.1. A NRTL panel shop label on any industrial control panel confirming its conformance with UL Standard 508A, latest edition.

10.3.2. A successful NRTL laboratory field inspection. The equipment shall have the NRTL laboratory’s field inspection approval seal applied on the equipment, and the field inspection report shall be submitted to the BUYER.

10.3.3. For any equipment for which no UL safety standard applies and a NRTL field inspection cannot be obtained, the SELLER shall furnish a report demonstrating that the components used and that the construction of such equipment provides an equivalent level of safety to NRTL listed products. This report shall be submitted to the BUYER for review by the BUYER’s Electrical Authority Having Jurisdiction.

10.3.4. Some equipment operates at non-hazardous levels of voltage and current and there may not be applicable safety standards, such as devices supplied by Power over Ethernet

(PoE) or ones which receive power from a converter or adapter powered from a convenience receptacle. Any such equipment which receives such non-hazardous levels

Form Revised January1, 2013 Page 15 of voltage and current need not be NRTL listed or field inspected, however, all converters and adapters shall be NRTL listed.

10.4. All control panels and enclosures shall have a minimum Short Circuit Current

Withstand Rating of not less than 10,000 Amperes.

10.5. Grounding lugs (or other ports that can be connected to an external ground) shall be available on the top plate of the DEVICE and on the support stand of the DEVICE ASSEMBLY.

10.6. No sensors and/or heaters used inside of the DEVICE shall be grounded to the chassis of the DEVICE.

10.7. Dielectric breaks shall be installed in the ST, condenser and CC piping connecting to the

DEVICE.

10.8. Any vendor supplied cabling shall be constructed in such a way as to electrically isolate the DEVICE ASSEMBLY from other equipment.

11. Thermometry, Heater and Wiring Requirements

11.1. All plates within the DEVICE with nominal operating temperatures between 1 K and

250 K shall be outfitted with thermometry. All such thermometry shall be calibrated over the full temperature range encountered during each plate’s operation and the absolute accuracy of any such sensors shall meet the requirements of Table 5.

11.2. At minimum, the ST and MXC of the DEVICE shall be outfitted with thermometry. All such thermometry shall be calibrated from the corresponding lowest achievable plate temperature while the DEVICE is running “continuously” (as defined in Section 8.1) to 80 K and the absolute accuracy of any such sensors shall meet the requirements of Table 5.

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Location Required sensor absolute accuracy while the DEVICE is operating

“continuously” (as defined in Section 8.1) at “base temperature” (as defined in Section 8.4)

CCP1 0.75 K

CCP2 0.25 K

ST 15 mK

MXC

If “base temperature” is greater than 20 mK but less than 30 mK, 3 mK;

If “base temperature” is greater than 10 mK but less than 20 mK, 2 mK;

If “base temperature” is lower than 10 mK, 1 mK

Table 5. Absolute accuracy requirements for temperature sensors within the DEVICE.

11.3. All thermometry within the DEVICE shall be capable of simultaneous connection to a single readout instrument.

11.4. The DEVICE ASSEMBLY shall include all ambient room temperature cables and readout electronics suitable for operation of the installed thermometers specified within Section 11.

11.5. The MXC shall be equipped with a heater for temperature control over the range from the “base temperature” (as defined in Section 8.4) to 30 K.

11.5.1. The temperature of the MXC shall be controllable via a SELLER-supplied PID controller acting on the MXC heater of Section 11.5. The combination of the MXC heater and PID controller shall be such that MXC temperatures remain “continuously” (as defined in

Section 8.1) within the temperature stability limits given in Table 6.

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Minimum setpoint temperature greater than or equal to:

Maximum setpoint temperature less than:

Required MXC temperature stability

“Base Temperature” (as defined in Section 8.1)

50 mK ±5 mK

50 mK 150 mK ±10 mK 150 mK 300 mK ±15 mK 300 mK 500 mK ±20 mK 500 mK 750 mK ±25 mK 750 mK 1.5 K ±50 mK

1.5 K 3.0 K ±75 mK

3.0 K

Maximum controllable temperature from Section 11.5 ±150 mK

Table 6. Setpoint stability requirements at the MXC during DEVICE “continuous” operation.

11.6. The “fully configured” (as defined in Section 8.2) DEVICE shall be capable of warming from “steady-state operation” (as defined in Section 8.3) at “base temperature” (as defined in Section 8.4) to a temperature exceeding 285 K for each plate within the DEVICE (e.g.

CCP1, CCP2, ST, MXC, etc.) in less than 24 hours and without the use of externally supplied process gasses (e.g., nitrogen).

11.6.1. The DEVICE ASSEMBLY shall include any and all ambient temperature cables and power supplies required for operation of any heaters installed to meet the specifications of Section 11.

11.7. All heaters within the DEVICE shall be capable of simultaneous operation.

11.8. Additional wiring requirements:

11.8.1. At least four RF coaxial lines shall be installed within the DEVICE. The following requirements shall apply to these lines:

11.8.1.1. All bulkhead and cable connectors shall be standard SMA per MIL-STD-348, latest edition.

11.8.1.2. Hermetic feedthroughs shall be used on the OVC plate.

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11.8.1.3. All RF coaxial lines shall terminate on the MXC plate.

11.8.1.4. Suitable bulkhead feedthroughs or equivalent thermalized RF transitions shall be used at all other stages (e.g. CCP1, CCP2, ST, MXC, etc.).

11.8.1.5. All coaxial cables shall be of low conductivity material (e.g. CuNi) for both inner and outer conductors.

11.8.1.6. Two (2) of the coaxial cables shall be provided in a superconducting material such as NbTi below the CCP2 stage.

11.8.1.7. Each coaxial cable shall have an impedance of 50 Ohms.

11.8.1.8. All connector interfaces below the OVC plate should have fixed attenuators installed, with values and materials being approved in writing by the BUYER during the “Manufacturing Readiness Review” of Table 3.

11.8.2. At least forty-eight lines of DC wiring shall be installed within the DEVICE. The following requirements shall apply to these wires:

11.8.2.1. All DC wiring shall be low-ohmic shielded twisted pairs and shall include a defined connectorized break (such as a micro-D connector) at the CCP2 stage.

11.8.2.2. All DC wiring shall be of copper above the CCP2 plate. 24 of the DC lines (12 twisted pairs) below the CCP2 plate all the way to the MXC shall be provided in a superconducting material such as NbTi.

11.8.2.3. All DC lines (24 twisted pairs) shall terminate on the MXC, on the side of the

MXC between the MXC and the ST. Each wire shall terminate on one or more suitable connectors, such as micro-D. This terminating connector shall be mechanically attached to the MXC.

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11.8.2.4. All wiring shall be thermally anchored at every stage (e.g. CCP1, CCP2, ST, MXC, etc.) between the OVC plate and the location of the lowest temperature terminating connector.

11.8.3. At least 2 optical fibers shall be installed in the DEVICE. The following requirements shall apply to these optical fibers:

11.8.3.1. All optical fibers shall terminate on the MXC, on the side of the MXC between the MXC and the ST.

11.8.3.1.1. Note: BUYER possesses hermetic feedthroughs, cryogenic-rated patch cords, and fiber clamp holders for thermalization at every stage. The BUYER prefers to use these BUYER-furnished items and shall provide relevant drawings upon request. The SELLER may elect to use these BUYER-furnished items or supply their own.

11.8.3.2. All optical fibers shall be single-mode fibers designed for transmission at a wavelength of 1550 nanometers (C-band) equivalent to ITU-T G.652 (SMF-28 or equivalent) and shall be fully compatible with the DEVICE’s optical interfaces.

11.8.3.3. All optical fibers shall be terminated with FC/APC narrow key connectors per

IEC 61754 or TIA-604 (FOCIS-4) at the MXC.

11.8.3.4. Hermetic feedthroughs shall be used on the OVC plate.

11.8.3.5. All optical fibers shall be thermally anchored at the CCP1 and CCP2.

11.9. At least one port, with a minimum internal diameter of 40 mm, shall extend unobstructed from the OVC plate to the MXC. All other intermediate plate openings along this path shall be fitted with blanks to minimize radiative heat transfer.

11.9.1. The SELLER shall provide drawings for all intermediate plate blanks or ensure a mechanism exists for the BUYER to obtain replacements from the SELLER if needed.

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12. Other Requirements

12.1. The DEVICE, excluding BUYER customizations, shall be based on a previously built design implemented in a commercially offered system and demonstrated in operation to meet the published performance specifications for that system.

12.2. Any Helium-3 required for operation of the DEVICE shall NOT be provided by the

SELLER.

12.2.1. The SELLER shall be responsible for supplying any Helium-3 required for the testing of the DEVICE ASSEMBLY at the SELLER facility as described in Section 13.1. Any Helium-3 added to the DEVICE ASSEMBLY for the purposes of such testing shall be removed by the

SELLER prior to shipment of the DEVICE ASSEMBLY to the BUYER SITE.

12.3. The DEVICE ASSEMBLY shall be capable of being fully operated and monitored through a BUYER-supplied computer running a Windows 11 operating system using SELLER-provided control software. The SELLER-provided control software shall communicate with PLC(s) supplied as part of the DEVICE ASSEMBLY. The PLC(s) shall act as the sole interface to all equipment within the DEVICE ASSEMBLY, including, but not limited to valves, heaters, pumps, cryocoolers, heat switches, compressors, and sensors. Any such combination of computer and control software shall be able to:

12.3.1. Command the PLC(s) to actuate all automated or semi-automated valves, as well as all pumps, cryocoolers, heat-switches and compressors.

12.3.2. Command the PLC(s) to control all installed heaters within the DEVICE including adjustable power control of heaters used for temperature control.

12.3.3. Readout, log and plot, via the PLC(s), the position, state, and/or status of all items within Section 12.3.1 and Section 12.3.2, including, but not limited to:

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12.3.3.1. CC status, CC cooling water inlet and outlet temperatures, CC helium temperatures, CC low and high side helium pressures, CC oil temperatures and any produced errors.

12.3.3.2. Any turbomolecular pump rotational frequencies, drive power and produced errors.

12.3.4. Readout, log and plot, via the PLC(s), any and all temperature, pressure and flow sensors installed within the DEVICE ASSEMBLY.

12.3.5. Access a scripting environment allowing for automated operation of the DEVICE

ASSEMBLY using SELLER-supplied and BUYER-written scripts. This scripting environment shall communicate bidirectionally with the PLC(s) and, through the PLC(s), with all components described within Section 12.3.

12.4. Pumps within the DEVICE ASSEMBLY shall meet the following requirements:

12.4.1. Pumps shall be commercially available, with designs not being specific to the SELLER or to the DEVICE ASSEMBLY.

12.4.2. Pumps shall be sealed and appropriate for use with the working fluid.

12.4.3. Pump installation shall be compliant with Section 12.20.

12.5. Filters shall be installed downstream of each pump (excluding turbomolecular pumps) and shall satisfy the following:

12.5.1. Filters shall be installed such that the working fluid will pass through the filtration element(s) before passing through any other component (i.e. valve, gauge, etc.)

12.5.2. Filters shall be commercially available, with designs not being specific to the SELLER or to the DEVICE ASSEMBLY.

12.5.3. Filters installation shall be compliant with Section 12.20.

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12.6. The DEVICE shall feature one or more CC. Each CC shall comply with the following:

12.6.1. CC performance shall be comparable to that of a pulse-tube style CC with external valve motor, a bellows interface between the CC and the DEVICE, and flexible copper braided straps between the CC and CCP1 and CCP2 stages of the DEVICE.

12.6.2. The BUYER prefers the use of air-cooled CC compressors. If possible, the BIDDER quotation shall include options for air and water-cooled CC compressors and a description of the differences in performance on the CCP1, CCP2 and MXC stages.

12.7. The gas handling system and any of its sub-components shall meet the following requirements:

12.7.1. Any and all valves used within the gas handling system shall be commercially available models whose successful previous usage can be demonstrated.

12.7.2. Any and all valves used in the working fluid streams of the DEVICE ASSEMBLY shall be of the “bellows sealed” or “diaphragm sealed” variety. Additionally, these valves shall be maintainable (meaning that items such as valve seats and O-rings are replaceable) and shall be installed per the requirements of Section 12.20.

12.7.3. The gas handling system shall include provisions for storing, at sub-atmospheric pressure, the entire volume of the working fluid required for successful operation of the

DEVICE.

12.7.3.1. Any fluid storage reservoir(s) provided to satisfy Section 12.7.3 shall include a manual valve installed between the fluid storage reservoir(s) and the first automated or semi-automated valve(s).

12.7.4. The gas handling system (including the working fluid storage reservoir of Section

12.7.3) shall abide by the leak-rate requirements of Section 12.11.

12.8. The DEVICE ASSEMBLY shall include an auxiliary (i.e. not used for circulating the helium working fluid) turbo molecular pump and backing pump combination for evacuation of the

Form Revised January1, 2013 Page 23

OVC space. This pump combination shall be suitable for indefinite operation without overheating.

12.9. The OVC of the DEVICE shall be equipped with a relief device meeting the requirements of Section 14.1.15.

12.10. O-rings used to seal the OVC of the DEVICE shall be made from a fluorocarbon material such as Viton.

12.11. All SELLER fabricated fluid handling components within the DEVICE ASSEMBLY shall be leak checked and certified to be leak-free at a level of 10-9 mbar L/sec .

12.12. Any flexible hoses used within the DEVICE or DEVICE ASSEMBLY shall be installed below their dynamic bend radius as specified their manufacturer’s literature.

12.12.1. Any tubing, hoses, flexible joints, expansion joints, vibration isolators, bellows, or similar compliant components utilized in the helium working fluid circulation path of the DEVICE ASSEMBLY shall be made from metal.

12.13. The BUYER prefers minimal use of rubber and KF seals within components used in any working fluid circulation path of the DEVICE ASSEMBLY.

12.14. The DEVICE shall not contain any vacuum chambers other than the OVC.

12.15. Any and all KF flanges which can be subjected to pressures exceeding 0 psig in any operating condition, including those of Section 14.1.15, shall be installed with appropriately rated centering ring and chain clamp combinations.

12.16. The DEVICE ASSEMBLY shall be designed to tolerate unexpected electrical power interruptions or brownout conditions without damage to its components.

12.16.1. The DEVICE ASSEMBLY shall transition to a “safe state” after the restoration of power.

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12.16.1.1. A “safe state” shall be defined as a state where, without the manual intervention of an operator, the DEVICE ASSEMBLY poses no reasonable safety risk to bystanders, potential damage to the DEVICE ASSEMBLY or any of its subcomponents, or potential loss of the working fluid.

12.17. The DEVICE ASSEMBLY shall be designed to tolerate unexpected cooling water interruption without damage to its components.

12.18. The DEVICE ASSEMBLY shall be designed to tolerate unexpected instrument air interruption without damage to its components.

12.19. The DEVICE ASSEMBLY shall be designed to tolerate unexpected controls/ communication interruptions or failures without damage to its components.

12.20. All items likely to require maintenance, repair, replacement or regular assembly and disassembly shall be easily and quickly accessible with a minimum of 3 sides access without cutting or welding.

13. Required Testing

13.1. The SELLER shall demonstrate that the DEVICE ASSEMBLY meets the specifications set forth within Section 8 and within Section 11.1 through and including Section 11.7 by means of a full-scale DEVICE ASSEMBLY test at the SELLER facility. Such demonstration shall meet the following requirements:

13.1.1. For this demonstration only, the SELLER may use a shorter testing duration than that defined in Section 8.1, but no less than one hour at “base temperature” (as defined in

Section 8.4).

13.1.2. For this demonstration only, the SELLER shall demonstrate that, at minimum, any two selected temperatures from Table 6 meet the required MXC temperature stability criteria of Table 6 for a time duration specified in Section 13.1.1.

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13.1.3. The BUYER reserves the right to be present during this demonstration and shall be notified at least three calendar weeks prior to the scheduled demonstration.

13.2. All wiring, thermometers and electrical connections shall be tested by the SELLER for electrical continuity and RF loss as appropriate.

13.3. The DEVICE ASSEMBLY shall undergo an independent, full-scale acceptance test at the

BUYER SITE.

13.3.1. If the DEVICE ASSEMBLY fails to meet the requirements set forth within the documentation approved by the BUYER and SELLER in the “Submittals” of the “Kick-off

Meeting” of Table 3, the SELLER shall provide on-site technical support at the BUYER SITE at no additional cost to the BUYER until the DEVICE ASSEMBLY passes the testing required therein or a period of three calendar months has elapsed from the date of the first attempted full-scale DEVICE ASSEMBLY acceptance test at the BUYER SITE. If the

DEVICE ASSEMBLY has not successfully met the acceptance criteria at the conclusion of this three-month period, the DEVICE ASSEMBLY shall be returned to the SELLER for modification, repair, or rework at no cost to the BUYER, except in cases where failure or damage is directly attributable to BUYER-caused damage.

14. Design Verification and Approval Requirements

14.1. The following SELLER-supplied items are subject to written approval by the BUYER.

Only submittals meeting the requirements set forth herein shall be considered complete. A four-calendar-week review period shall commence upon receipt of all complete submittals for the items listed below; partial or incomplete submittals shall not trigger the review period. Fabrication of the DEVICE ASSEMBLY shall not commence until written BUYER authorization has been granted.

14.1.1. Voltage, current, frequency, phase, and SELLER-provided connection method for any electrical connections required for successful “steady-state operation” (as defined in

Section 8.3) of the DEVICE ASSEMBLY at the BUYER SITE.

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14.1.2. Detailed specifications for any external fluid services required for “steady-state operation” (as defined in Section 8.3) of the DEVICE ASSEMBLY at the BUYER SITE, including, at minimum, fluid requirements, temperature, maximum pressure, flow rate and connection type/size.

14.1.3. Detailed P&ID, containing within it all cryocoolers, vacuum pumps, other pumps, valves, relief valves, temperature sensors, pressure sensors and like instrumentation/equipment for the DEVICE ASSEMBLY.

14.1.3.1. Note: A detailed diagram of piping and instrumentation components within the

OVC of the DEVICE is not required, however, the manufacturer, model number and installed location of any thermometers within the DEVICE, as specified in Sections

11.1 and 11.2, is still required.

14.1.4. Detailed list of all components within the P&ID described in Section 14.1.3 for the

DEVICE ASSEMBLY. This list shall have identification markers corresponding to the

SELLER-supplied P&ID of Section 14.1.3 and, at minimum, shall provide each item’s manufacturer, a brief description of each item, its full part number and, if applicable, key technical parameters including pressure rating, material, size and other relevant characteristics.

14.1.5. Valve actuation sequences, along with detailed descriptions of such sequences, for all valves and equipment subject to automated processes, including, but not limited to cooldown, normal operation, working fluid recovery/warmup and any other sequences subject to automated control.

14.1.6. Documentation stating the response of all valves and equipment in events including, but not limited to the loss of electrical power, power resumption, loss of instrument air, loss of cooling water, internal circuit rupture, loss of cryogens, loss of insulating vacuum, contamination, control system failure, software/programming errors, pumping failures, cryocooler failure(s), fire, improper setting of manual or user-controlled valves and any

Form Revised January1, 2013 Page 27 other circumstance which reasonably constitutes a hazard under the prevailing conditions.

14.1.7. Manufacturer and model number of any thermometer readout electronics.

14.1.8. Values and materials of fixed attenuators on RF lines as described in Section 11.8.1.8.

14.1.9. Outside dimensions of the DEVICE and DEVICE ASSEMBLY when fully assembled.

14.1.10. Clearances required for the disassembly and maintenance of the DEVICE and

DEVICE ASSEMBLY.

14.1.11. Major drawings and 3D models in .stp format of the DEVICE ASSEMBLY, including layouts and bolt hole patterns of the CCP1, CCP2 and MXC cold plates.

14.1.12. 3He volume requirements of the DEVICE.

14.1.13. QCP as described in Section 15.1.

14.1.14. MIP as described in Section 15.2.

14.1.15. A certificate of conformance affirming that the system, including its relief devices and the fluid flow paths upstream and downstream of such relief devices (from the pressurized equipment to the final point of discharge) are sized and installed to prevent pressures from exceeding design pressures for any circumstance that reasonably constitutes a hazard under the prevailing conditions including, but not limited to equipment failure, control failure, operator error, sustained heat loads, self-limiting heat loads and external sources of pressure, and, where applicable, loss of insulating vacuum to atmosphere or to the working fluid.

14.1.15.1. The BUYER strongly suggests that the SELLER reviews Chapter 4 of American

Petroleum Institute Standard 521, latest edition, for potential causes of overpressure.

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15. Quality Control Requirements

15.1. The SELLER shall prepare and implement a Quality Control Plan (QCP) covering the design, procurement, fabrication, testing and inspection of the DEVICE ASSEMBLY and its subassemblies.

15.1.1. The QCP shall provide for planning and execution of procurement activities in accordance with documented instructions and/or procedures.

15.1.2. The QCP shall provide for the qualification of personnel performing engineering design work in each instance where a code listed within Section 6.1 applies to the work being performed. Qualification shall include identification of the individual(s) and demonstration, documented in the QCP, of their education, training, experience, and/or certifications sufficient to perform the work in compliance with the aforementioned code(s).

15.1.3. The QCP shall provide for verification of conformance of purchased items to design specifications and procurement document requirements via mechanisms such as material certifications and/or material test reports.

15.1.4. The QCP shall provide for manufacturing planning, material and process control, inspection and testing, non-conformance control and objective evidence

(documentation) of the inspection function.

15.1.4.1. Material and equipment identification shall be maintained throughout the manufacturing process, either on the material or equipment or on records traceable to the material or equipment. Status of acceptability of materials and equipment with respect to inspections and tests shall be readily discernible through SELLER's use of tags, stamps, routing cards or other positive means.

15.1.4.2. The QCP shall provide for the identification, documentation, evaluation, and dispositioning of components that fail Quality Control test and inspections.

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15.1.5. The QCP shall provide for calibration procedures and schedules, status indication on measurement and test equipment, serialization of test equipment, traceability to NIST or other accepted standards and calibration records for any temperature sensors, pressure gauges, and other calibrated measurement instruments within the DEVICE ASSEMBLY.

15.1.6. The QCP shall provide for qualification of personnel and/or procedures for the performance of certain special processes. These include but are not limited to welding, heat treatment, non-destructive examination, helium mass spectrometer leak checking, or others as may be required by this specification or by the nature of the process or product.

15.2. The SELLER shall develop and implement a Manufacturing Inspection Plan (MIP) which identifies all required inspection and testing activities throughout the manufacturing process of the DEVICE ASSEMBLY.

16. Shipping Requirements

16.1. All components included with the DEVICE ASSEMBLY shall be packaged and shipped appropriately to avoid any damage during transit.

16.2. Any and all subassemblies of the DEVICE ASSEMBLY, or the DEVICE itself, shall be able to pass through a 35-inch wide and 84-inch-high doorway, either using built-in caster wheels (or similar) or with the use of a standard, BUYER-supplied pallet jack and a SELLER-supplied pallet.

16.3. All items shall be shipped within shipping crates. These crates shall meet the following requirements:

16.3.1. Shipping crates shall provide full enclosure on all sides of the cargo.

16.3.2. Shipping crates shall be furnished with sufficient interior restraint to prevent the contents from shifting during transit.

16.3.3. Shipping crates must be free of sharp edges.

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16.3.4. Shipping crates shall be furnished with a shock and vibration monitoring system(s). The details of these SELLER-supplied systems shall be shared with the BUYER prior to the successful completion of the “Shipping Readiness Review” as specified in Table 3.

16.3.5. Shipping crates shall be designed in such a way that they are readily handled with a fork-lift truck.

16.3.6. Shipping crates shall feature appropriate and clearly marked exterior features to allow for tie down during transport and lifting.

16.3.7. Shipping crates shall be clearly marked (in English) indicating the items of content, the contract number, the gross weight, the point of origin, the destination and the presence of shock recorders.

16.3.8. Where applicable, shipping crates shall be affixed with the following labels:

16.3.8.1.1. DO NOT STACK

16.3.8.1.2. FRAGILE

16.3.8.1.3. KEEP DRY

16.3.8.1.4. THIS END UP

16.4. All shipments shall be inspected by the BUYER upon arrival at the BUYER SITE. The

SELLER shall be responsible for ensuring the DEVICE ASSEMBLY and all its subcomponents arrive at the BUYER SITE undamaged. Any damage done to the DEVICE, DEVICE ASSEMBLY, or any subcomponent during shipping shall be remedied at the SELLER’s expense. The

BUYER strongly recommends the SELLER purchase shipping insurance.

17. Required Documentation

17.1. SELLER shall provide documentation that any testing within Section 13 has been successfully completed, along with the results of this testing.

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17.2. SELLER shall provide a report stating that any and all working fluid handling components of the DEVICE and DEVICE ASSEMBLY have been fully leak checked per the requirements of Section 12.8.

17.3. SELLER shall provide a detailed installation manual for the DEVICE ASSEMBLY.

17.4. SELLER shall provide a detailed operation manual for the DEVICE ASSEMBLY which shall specify amongst other things the cool-down procedure, the working fluid recovery procedure, any fault diagnosis procedures and service manuals.

17.5. SELLER shall provide any documentation required within Section 14.

17.6. SELLER and BUYER shall jointly prepare a fully completed “What-If analysis” document per Fermilab’s FESHM 5032 code, latest edition.

17.7. SELLER shall provide specifications and calibrations for all instrumentation within the

DEVICE ASSEMBLY.

17.7.1. SELLER shall provide all documents required for safe handling, transport and shipping of the DEVICE ASSEMBLY.

17.8. BUYER shall provide room sketch per Section 9.6.