SOW.pdf

STATEMENT OF WORK

1. Objective/Requirements

• Manufacture printed circuit boards (PCBs) for use in the Simulation Engineering

Branch for hardware upgrades of next generation of simulation computers.

• Assemble PCBs per IPC-A-610 Class 3 assembly standards.

2. Characteristics, Scope, and Specs

The contractor shall perform the following duties:

• Dimensions: 10.1 x 5.5 inches.

• Layers: 8

• Finished copper weight: 1 ounce.

• Fabricate or acquire PCBs from a domestic manufacturer built in accordance with

IPC-6012, Class 3 standards. Per 6011, use supplied data files listed. PCBs shall meet the requirements of IPC-6012 Table 4-3 “Acceptance Testing and Frequency” for

Class 3.

• Materials used shall be laminate per IPC-2221 par 4.3; L40XXXXHX/HXAA IAW

IPC-4101/24, laminated sheet, flame resistant, UL 94V-0.

• PCB core and prepreg materials used must have a Tg of 140°C or greater.

• All holes without dimensions are located on a modular grid of 0.0005-inch increments. All holes shall be located within 0.005-inch radius of true position in respect to datum A, datum B, datum C. Hole locations are defined by the NC DRIL data file supplied.

• Layer-to-layer registration shall be within 0.007 inches diameter of true position in respect to datum A, datum B, datum C.

• Finished hole size is as indicated in hole drill table.

• Soldermask for the prototypes (first 5 units and any possible follow-on prototypes) that are delivered shall be white and their silkscreen shall be black.

• Finish:

o Production units, quantity 50: Apply liquid photo imageable solder mask per IPC-SM-480, Class H, color yellow, RGB: 255, 255, 0 or equivalent, to both sides of the PCB over bare copper. Via holes covered with solder mask must be plugged. Mask must be below flush to primary side surface.

Maximum misregistration is +/-0.003 inches.

o Silkscreen shall be black, permanent, organic, non-conductive ink. There shall be no silkscreen on any solderable component pads.

o Prototypes units only, at least two batches, quantity 5 per batch: Solder mask for the prototypes (first 10 units and any possible follow-on lots) that are delivered shall be white and their silkscreen shall be black.

• Process Allowances:

o Warp or twist of PCBs shall not exceed 1%.

o Conductor widths and spacing shall be within +/-0.0015 inches of supplied

Gerber data.

o Remove all burrs and break sharp edges, 0.015 inches maximum.

o 0.059 inch maximum radius on any inside corners.

• Marking: UL Logo: Manufacturer’s identification/traceability and date code letter shall be rendered in etch on the bottom side of the board in accordance with IPC-

6011.

• Test requirements:

o 250VDC HIPOT (high potential) test required prior to board assembly.

o Flying probe test required before board assembly.

o Quality conformal test coupons shall be maintained for all inspection lots.

Test coupons shall be in accordance with IPC-2221.

o A certificate of compliance shall be submitted with each lot.

• With the exception of this statement of work, the information and files contained in this solicitation are technical in content, but not technical data as defined by the

International Traffic in Arms Regulations (ITAR). With the exception of this statement of work, the information and files contained in this solicitation have been determined to be technology as defined by the Export Administration Regulations

(EAR), not found under an ECCN of any category of the Commerce Control List, and therefore is designated as EAR99. Information designated as EAR99 shall be handled in accordance with the EAR. Violations of these regulations are punishable by fine, imprisonment, or both.

• Supplied fabrication files (All EAR99/CUI):

o PCB-100_revProt-.apr o PCB-100_revProt-.DRR o PCB-100_revProt-.EXTREP o PCB-100_revProt-.G1 o PCB-100_revProt-.G2 o PCB-100_revProt-.G3 o PCB-100_revProt-.G4 o PCB-100_revProt-.G5 o PCB-100_revProt-.GBL o PCB-100_revProt-.GBO o PCB-100_revProt-.GBP o PCB-100_revProt-.GBS o PCB-100_revProt-.GKO o PCB-100_revProt-.GM o PCB-100_revProt-.GP1 o PCB-100_revProt-.GTL o PCB-100_revProt-.GTO o PCB-100_revProt-.GTP o PCB-100_revProt-.GTS o PCB-100_revProt-.LDP o PCB-100_revProt-.REP o PCB-100_revProt-.TXT o PCB-100_revProt--macro.APR_LIB

• Supplied assembly files (All EAR99/CUI):

o PCB-100_RevProt-_BOM.xlsx o PCB-100_revProt-_Pick-Place.txt o PCB-100_revProt-_PCB_Assembly.pdf

• PCB thickness shall be less than or equal to 0.062 inches.

• Acquire parts in provided bill of materials. Layer stack legend provided for reference.

• Assemble PCB in accordance with IPC-A-610 Class 3 assembly standards.

3. Deliverables and Schedule

Description Quantity Unit Delivery Date

Prototype PCB 5 Each 3 weeks from contract award

Cert. of Conform. 1 Each Delivered with prototypes

Test reports 1 Each Delivered with prototypes

Prototype PCB vs2 5 Each 3 weeks from receipt of revised design from NASA

Cert. of Conform.

for PCB vs2

1 Each Delivered with prototypes

Test reports for PCB vs2

1 Each Delivered with prototypes

Prototype PCB vs3

(if needed)

5 Each 3 weeks from receipt of revised design from NASA

Cert. of Conform.

for PCB vs3

1 Each Delivered with prototypes

Test reports for PCB vs3

1 Each Delivered with prototypes

Production PCB 50 Each 5 weeks from confirmation of final design from NASA

Cert. of Conform. 1 Each Delivered with production units

Test reports 1 Each Delivered with production units

4. Place of Performance

U.S. domestic facility as determined by the contractor.

5. Period of Performance

Items must be delivered by dates specified in the table in section 3.