SOW 26-6B1 -Plasma Cleaner.pdf
PDF 196 KB Posted
- Attached to
- Plasma Cleaning System
- Solicitation number
- HQ072726QNR02
- Issued by
-
Defense Microelectronics Activity
About this file
This is a Statement of Work (SOW) for DMEA 26-6B1, effective 16 December 2025, for procuring a plasma cleaning system for microelectronics surface preparation at the Defense Microelectronics Activity (DMEA) Packaging Assembly and Substrates (PAS) Lab in McClellan, California.
The contractor must supply and deliver an OPENAIR Plasma System with associated components including an FG5001S digital 1KVA plasma generator with touchscreen control, RD1004 rotating jet, PCU-M plasma control unit, HV connection set, cable sets, rotation monitoring module, jet pressure control module, and additional carbon fine filter. The contractor must also provide a 3-axis Cartesian Robot (510 x 510mm), a lab enclosure with safety controls and 6-inch diameter exhaust port, and one day of on-site plasma system startup and configuration. Equipment maintenance and all updates, enhancements, and upgrades are required for one year from delivery. Technical support must be provided through a staffed support center with experienced design engineers knowledgeable in the OPENAIR Plasma system, available Monday through Friday from 8:00 AM to 5:00 PM Pacific Standard Time, capable of diagnosing and resolving all levels of technical complexity. The contractor must also provide spare parts, materials, training, and software licensing. Primary government points of contact are Stephanie Wasmuth (Project Engineer), Brian Frost (Contract Officer Representative), Dean Cable, and Steven Nelson (Chief, Quick Reaction Engineering Branch), all located at DMEA in McClellan, California.
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Other files
| File | Type | Posted |
|---|---|---|
| JA - 26-6B1_Redacted.pdf | ||
| Combined Synopsis and Solicitation SOW 26-6B1.pdf |
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Text version
SOW PWS Template 2021 June.doc
STATEMENT OF WORK (SOW)
DMEA 26-6B1
16 December 2025 Project Engineer: Stephanie Wasmuth, DMEA/MEAB, (916) 231-2608
Contract Officer Representative: Brian Frost, DMEA/MEAA, (916) 999-2724
1.0 SCOPE:
1.1 TITLE: Plasma Cleaning System
1.2 APPLICABILITY: The Packaging Assembly and Substrates (PAS) Lab fabricates developmental, prototype, and production high voltage devices and Enclosures for DoD Customers that are required to function in adverse operational environments.
1.3 BACKGROUND: The PAS Lab regularly needs to perform surface preparation and cleaning for integrated circuit and PCB assembly projects in order to achieve die bond, wire bond, solder, and lid seal attachments strengths that meet MIL-STD-883. Plasma cleaning is a critical process step for many packaging and assembly projects at DMEA. Packaging materials have also steadily increased in variety and thermal sensitivity, preventing the current unsupported legacy plasma cleaning system from being able to meet the capability needs of the War Fighter.
1.4 PURPOSE: Procure plasma cleaning system for microelectronics surface preparation
2.0 REFERENCED GOVERNMENT PROVIDED RESOURCES: None
3.0 REQUIREMENTS:
3.1 GENERAL REQUIREMENTS:
3.1.1 RESERVED
3.2 PROGRAM MANAGEMENT: None
3.3 GENERAL REQUIREMENTS: The Contractor shall provide equipment, spare parts, materials, training, software licensing, with relevant updates, enhancements and upgrades, along with remote technical support for the following products shown in Table 1.
Table 1: Plasma Cleaning System requirements
3.3.1 EQUIPMENT MAINTENANCE REQUIREMENT: The Contractor shall provide equipment maintenance for the OPENAIR Plasma system and associated updates, enhancements, and upgrades for a period of one year.
3.3.2 SUPPORT REQUIREMENTS: The Contractor will provide access to a technical support center staffed by experienced design engineers with specialized knowledge of additive manufacturing, the OPENAIR Plasma system, and available materials for said system. The staff will understand, diagnose and resolve problems of all levels of technical complexity. The Contractor will provide access to the technical support center Monday through Friday during the hours of 8:00 AM to 5:00 PM Pacific Standard Time.
3.4 PROGRAM SUMMARY: None
5.0 POINTS OF CONTACT:
DMEA/ MEAB: Mechanical Engineer Stephanie Wasmuth Address: 4234 54th Street McClellan, CA 95652-2100 Voice: (916) 231-2608 E-Mail: stephanie.e.wasmuth.civ@mail.mil
Item Part Name, Equipment Summary Description
1 OPENAIR Plasma System
1) FG5001S Plasma Generator, digital 1KVA, Touchscreen control
2) RD1004 Rotating Jet RD1004
3) PCU-M Plasma Control Unit for Openair- Plasma® system
4) HV SS single HV connection set plasma jet/transformer unit
5) PC RS Cable set on the primary side of the transformer unit/generator
6) RCM-PCU Rotation monitoring for the functional module PCU
7) PCM-PCU Jet pressure control module 8DAE5 Additional Carbon Fine Filter
2 Cartesian Robot 3 axis robot (510 x 510mm)
3 Enclosure Lab Enclosure including safety controls, 6inch diameter Exhaust port
4 Tool Start up On-site Plasma System Start-up: One day
DMEA/ MEAB: Mechanical Engineer Dean Cable Address: 4234 54th Street McClellan, CA 95652-2100 Voice: (279) 782-8611 E-Mail: dean.c.cable.civ@mail.mil
DMEA/MEAB:
Steven Nelson Chief, Quick Reaction Engineering Branch Address: 4234 54th Street McClellan, CA 95652-2100 Voice: (916) 999-2785 E-Mail: steven.b.nelson25.civ@mail.mil
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