SHB pulsed RF HPA high level Spec Requirements 12 Oct 2025.xlsx
XLSX spreadsheet 19 KB Posted
- Attached to
- ALS AIP RF Amplifier Replacement Federal contract opportunity
- Solicitation number
- AM202510-13
- Issued by
- Department of Energy
About this file
This file is a High-Level Specification Requirements document for two high-power RF amplifiers (HPAs) to be procured by Lawrence Berkeley National Laboratory (LBNL). The specification details requirements for two solid-state pulsed RF HPAs: one operating at 500 MHz and another at 125 MHz, each capable of delivering 25 kW peak power. Key technical specifications include precise performance parameters such as power stability (< 1% short-term, < 2% long-term), phase stability, input/output power characteristics, efficiency (> 70%), and redundancy capabilities.
The procurement is a pre-solicitation opportunity from the Department of Energy seeking vendors to replace existing tube-based Sub-Harmonic Buncher (SHB) pulsed RF amplifier systems. Vendors are requested to complete the specification sheet, provide technical documentation, demonstrate similar HPA implementations, and submit budgetary quotations. The procurement process involves detailed evaluation stages including a Final Design Review, Factory Acceptance Tests, and Site Acceptance Tests. The successful vendor will be required to provide a three-year comprehensive on-site warranty, complete documentation, and meet stringent technical, safety, and performance standards specified in the document.
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| File | Type | Posted |
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| RFI (ALS AIP RF Amplifier Replacement).pdf |
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Text version
Sheet1
| (A) High Level Main Specifications / Requirements of solid state (LDMOS / GaN) pulsed RF HPA : | Value | Vendor Compliance (Yes / No / Partly) | Vendor Response Comments / Notes (if any) |
| Note : Total Two units pulsed RF HPA's ; One unit pulsed RF HPA at 500 MHz ; One unit pulsed RF HPA at 125 MHz | |||
| HPA Center Frequency (approx) : | 500 MHz and 125 MHz | ||
| HPA Output Pulsed RF Peak Power (in pulse flat top region) : | ≥ 25 kW with less than 1 dB compression | ||
| HPA Output pulsed power stability (inter-pulse and intra-pulse ; and also long term (8 hours) ) | < 1 % (short term) ; < 2% (long term) | ||
| HPA Output pulsed power phase stability (inter-pulse and intra-pulse ; and also long term (8 hours) ) | < 1 deg for 125 MHz and < 4 deg for 500 MHz | ||
| HPA Input Pulsed RF power (in pulse flat top region) for ≥ 25 kW output : | ≤ 0 dBm | ||
| HPA Output Power P1 dB ( ≥ 25 kW) Bandwidth (BW) : | ≥ 5 MHz about center frequency | ||
| HPA must be capable of receiving an external Fiber Optic (FO) gating signal as input for turning on / off the LDMOS Gate of RF Amplifier Modules (for reducing HPA power dissipation). Such FO gating signal shall be turn on (FO light present) about 2 ms before the start of the RF pulse input ON duration and it shall be turned off (FO light absent) about 2 ms after the end of RF pulse input ON duration of 15 us to 60 us. | |||
| HPA Output Pulsed RF flat top (ideally) duration (excluding the rise, overshoot, fall times) : | 15 us to 60 us | ||
| HPA Pulse Repetition Frequency :- Also the vendor shall perform prolonged pulsed RF testing and provide limits, if any, to the range of pulse repetition frequency and to the range of duty cycle for no damage to LDMOS / GaN due to such low frequency thermal cycling and/or fatigue. | 0.5 Hz to 10 Hz | ||
| HPA Output Pulsed RF Power Envelope Droop (in pulse flat top (ideally) region) : | < 1 % | ||
| HPA Output Pulsed RF Power Envelope Overshoot and Undershoot : | < 2 % | ||
| HPA Output Pulsed RF Power Envelope Rise and Fall time ( 10 % to 90 % of final value) : | < 100 ns | ||
| HPA Group Delay (over the P1 dB bandwidth of 5 MHz) : | < 100 ns | ||
| HPA Input VSWR and Output VSWR over P1 dB Bandwidth : | < 1.1 | ||
| HPA DC to RF output efficiency (in pulse flat top region) : | ≥ 70 % | ||
| HPA RF High Power Combiner efficiency : | > 98 % | ||
| RF High Power output combiner must be capable of handling reflection power at all phase angles of upto 150% of the full output forward power | |||
| HPA RF output Second Harmonic : | < -40 dBc | ||
| HPA RF output Third Harmonic : | < - 60 dBc | ||
| HPA Spurious (measured on span 2 MHz about center frequency and RBW 1 kHz) : | < - 70 dBc | ||
| HPA RF Output Power (1kW to 25 kW) Phase variation from RF Input power sweep in 10 us : | ≤ 10° and monotonic | ||
| Pulsed HPA must also be capable of operation in CW mode with P1dB output power : | ≥ 500 W | ||
| Redundancy to failure of RF Amplifier Modules for degraded RF output power of 20 kW minimum. The HPA shall continue to be operational with remaining working RF Amplifier modules even when the failed RF modules are physically removed out from HPA. | upto 10% | ||
| Redundancy to failure of Quasi Constant Power (QCP) Capacitor Charging Power Supply (CCPS) DC PS Modules for degraded HPA RF output power of 20 kW minimum. The HPA shall continue to be operational with remaining working QCP DC PS modules even when the failed modules are physically removed out from HPA.: | N+2 redundancy | ||
| The Quasi Constant Power (QCP) Capacitor Charging Power Supply (CCPS) Modules having such N+2 redundancy shall be connected in parallel operation using MOSFET OR-ing OR preferably utilising active current sharing mechanism, connected to a common bus bar and then have fused wired connections to the local bulk storage capacitors placed close & connected to each RF Amolifier LDMOS / GaN drain. | |||
| Such aforesaid QCP CCPS based charging bias scheme shall provide one "Capacitor Charged" FO output signal (FO light turns ON) after the local bulk capcaitors have been precisely charged to the user set voltage value (between 40 V to 50 V) and then the QCP CCPS modules mode shall change from QCP mode to CV mode. The next local capacitors charging cycle shall start at the falling edge of the external FO gating signal input. | |||
| The quiscent LDMOS drain DC bias current for class AB operational mode of the RF Amplifier modules shall be provided from separate highly regulated, very low ripple DC PS module(s) operating in CV mode to the same user set voltage value ( between 40 V to 50V) with parallel M+1 redundancy to another common bus. Necessary diodes (for blocking reverse currents) shall be used for each LDMOS/ GaN drain connection. The quiscent drain bias current will be switched i.e, turned ON aligned with the FO external gating signal input is turned ON, upon which the Gate bias voltage will be applied to LDMOS Gate. | M+1 redundancy | ||
| Maximum RF Amplifier LDMOS / GaN FET junction temperature (at 25 kW output) : | ≤ 100° C | ||
| HPA Reliability (MTBF) : | ≥ 150000 hours | ||
| DFMECA analysis and HALT testing report of HPA | |||
| RF Amplifier Module output power variation across Modules ((max power - min power )/avg power) : | ≤ 5 % | ||
| RF Amplifier Module output phase variation across Modules (max phase - min phase) : | ≤ 5 degree | ||
| RF Amplifier Modules must have stable operation over FET drain bias voltage range : | 40 to 50 V DC | ||
| All RF amplifier Modules must have suitable circulator protection at its output and input. | |||
| Circulator (at each RF Amplifier module output) must have power handling capabilty to withstand four times the nomial forward module output power and also withstand short and open load conditions at all phase angles | |||
| Audible noise at all HPA output power levels (measured at 1 feet from cabinet on all four sides of HPA with doors closed ) : | ≤ 55 dBA | ||
| HPA Noise Figure over P1dB bandwidth : | < 3 dB | ||
| HPA additive jitter (at offset from 0.01 Hz to half of PRF) | ≤ 300 fs | ||
| Input AC power thorough enclosed lockable UL listed MCB on HPA : 208 VAC, 3-phase, 5 wire, upto 50 A ; AC Input PF > 0.9 ; Line currents balanced within 5 % | |||
| Input AC power for HPA controls through UL listed MCB on HPA : 120 VAC, 1-phase, 3 wire, upto 20 A | |||
| HPA RF input connector : N type (F) on HPA front side ; RF output connector : 7/8 " EIA on HPA rear side | |||
| Adequate forced clean air cooling such that max temp of internal components parts & internal air must be < 40 degC even at ambient temperature of 35 deg C. Air intake from cabinet front side bottom and exhaust from cabinet rear side top. | |||
| HPA cabinet overall dimensions (Note : Only Front and Rear sides of HPA are accessible ; The Left and Right sides are blocked by other cabinets) ; Front and Rear sides shall have latchable (not locks) doors (swinging outwards). All components inside HPA must be easily accessible and be removed or installed quickly from Front and Rear sides. | 1.15m (W) x 0.75m (D) x 2.35m (H); Front along W =width ; D = Depth ; H= Height |
| IP rating of HPA cabinet | IP 51 |
| Cabinet top shall have four swivel lifting bales (not eyebolts). The swivel lifting bales shall meet the ASME B30.26, rigging hardware standard. | |
| The vendor shall provide Center of Gravity (CG) location of HPA cabinet with its complete internal parts. The vendor shall provide lifting certification of HPA with its complete internal parts. | |
| FO interfaces on front panel :- Four FO External inputs as permit signals to HPA ; Four FO Internal output signal as HPA faults signals; (for interfacing with EPS and spare future use, if needed) | |
| Small sampled RF input Fwd and Rev powers (with coupling about -10 dB) and also at intermediate location between driver amplifier output and RF splitter input shall be provided on front panel with N type (F) connectors for user tests/ measurements | |
| Small sampled RF Output Fwd and Rev powers (with coupling about -80 dB) shall be provided on front panel with N type (F) connectors for user tests/ measurements | |
| Operating Ambient Temperature | 05 °C to 35 °C |
| Operating Relative Humidity | 10 - 90 % |
| HPA must successfully obtain the preliminary field evaluation (at vendor factory before shipping) and also final field evaluation (at LBNL) certification from OSHA approved NRTL to the applicable US standards such as NFPA 70, UL 508A, UL-61010-1, UL- 60950-1 etc. Additionally the vendor must built the HPA as per LBNL specific engineering standards / requirements and safety documents (see attached list of such LBNL standards). This shall be Vendor responsibility. | |
| HPA cabinet must successfully obtain the structural integrity including lifting/ rigging and seismic integrity & cabinet base anchoring certification as per relevant California code standards from a California licensed engineer. This shall be Vendor responsibility. | |
| 15" colour HMI (preferably from Allen Bradley) with main / home page and other navigation pages for controls interface and display of HPA states & display of signals readings with latched interlocks of various HPA signals & parameters like HPA Finite State Machine (Off, Standby, DC, RF, Fault, Fault Reset), AC input line voltages & line currents, DC PS module wise DC output voltages & currents, HPA Input & Output RF power, Set Drain Voltage, Set pulse repetition frequency, Cooling Fans status and speeds, Internal cabinet temperature, humidity ; RF amplifier module wise parameters like drain voltage & currents, FET flange temperature, Circulators load temperatures, Forward & Reflected powers ; chronological storing & display of all event actions made and fault occurrence with signal name, parameter values and respective time stamps ; Password protected acess to configuration settings of various signal parameters for warnings limits and interlocks limits in Local mode only ; | |
| EPICS IOC based remote mode read capability of all HPA PLC registers & all signal parameters readings, interlocks, with time stamps etc., via EthereNet/IP over fast Ethernet 6 interface and remote mode EPICS write capability of HPA states commands & Fault Reset | |
| Fast acting (< 50 ns) absorptive type PIN diode switch at RF input for RF power fast interlock protection | < 50 ns |
| Fast interlocks control response time (for HPA RF Input (Fwd) & Output (Fwd & Refl) powers ; External FO permits ) using FPGA or otherwise : | < 10 us |
| Slow interlocks controls response time using PLC (preferably Allen Bradley Compact Logix 5380): | < 50 ms |
| The various Interlock signals must be implemented as failsafe positive logic i.e., absence of voltage is considered as fault and will disable the system operation. Similarly absence of light in FO is considered as fault and will disable the system operation. | |
| HPA RF Input Overdrive limit (before fast HPA controls acts on) for no damage to HPA : | ≥ 6 dBm |
| HPA cabinet roof top must be capable of carrying additional weight upto 100 kgs | |
| All electrical equipment's, components, cables, condcutors etc used in HPA must be UL Listed / Certified wherever available. | |
| Vendor to provide certification that critical fasteners used for HPA mechanical cabinet or electrical high current contacts in HPA are not counterfeit. | |
| Stored energies in all capacitors inside HPA shall be discharged to < 5 V and < 10 J within < 30 seconds of turning OFF the HPA's | |
| The two HPA's design & manufacture shall be robust for continuos 24/7 over period of 2 to 3 weeks at full output power and at max PRR, without occurences of any interruptions / trips / failures. | |
| The vendor shall provide complete design documentations & drawings within expected period of three months and a Final Design Review (FDR) will be conducted by committee of experts from LBNL, other Lab with vendor for any modifications / recommendations etc. | |
| Only after the written approval by LBNL after conducting such HPA Final Design Review (FDR), the vendor shall proceed to manufacture the two HPA's. | |
| The vendor shall provide a detailed Test and Inspection Plan (TIP) document which will be reviewed by LBNL for any modifications / additions etc if any and evenatully be approved by LBNL. Such approved TIP document shall be utilised for conducting the tests / inspections for Factory Acceptance Tests (FAT) at vendor factory site and also utilised for conducting a subset of tests/ inspections for SAT at LBNL site. | |
| Prior to FAT the vendor must successfully complete the NRTL premilinary field evaluation to US standards and provide LBNL such NRTL preliminary evaluation report & certificate. | |
| Prior to FAT the vendor must successfully complete atleast 100 hour continuous testing of each HPA at 25 kW pulsed output at ambient temperature of 35 C and constant input power and log all the signal parmaters at intervals of 1 minute. No faults or trips of HPA shall occur due to any internal fault in HPA and the vendor must provide such detailed test results & report prior to FAT. | |
| Only if the Factory Acceptance Tests (FAT) conducted by vendor and supervised by LBNL at Vendor's factory site on the two HPA's connected to proper dummy load to check conformance to aforesaid high level specifications / requirements (specific deep details TBD) is satisfactory & successful, then the vendor will be given written approval to proceed to ship the HPA's to LBNL | |
| After receival of two HPA's at LBNL, they will be visually inspected for any apparent physical / external damages perhaps due to transit and it shall be vendor responsibility to make good any such damages found at no additional costs to LBNL. | |
| If the HPA's successfully passes such visual inspection with no apparent physical / external damages, then Site Acceptance Tests (SAT) to check conformance to aforesaid high level specs/ requirements will be conducted on HPA on a dummy load and then on actual cavity load, within a expected period of six months after dleivery of the two HPA's. | |
| Only if the HPA's are successful in SAT at LBNL, then the vendor will be given written acceptance of the two HPA's and the final part / installment payment for HPA will be released to vendor. | |
| Vendor must provide comprehensive on-site (at LBNL installation site) warranty for the two HPA's for three years from the date of written acceptance of the two HPA's upon successful SAT OR three and half years from date of delivery of the two HPA's, whichever occurs earlier. | |
| Vendor must provide complete PLC and FPGA control code used in HPA and also complete native & pdf files of all mechanical, electrical, schematic drawings, manufacturer part numbers etc from system level to component level of HPA | |
| Vendor must provide complete detailed installation manual, operational manual, troubleshooting & repair manual, maintenance manual etc of the HPA |
| (B) Notes for Vendor and other desirable requirements |
| No parts or materials will be supplied by LBNL in above HPA development by Vendor |
| Vendor provide detailed HPA failure modes analysis (DFMECA) especially of the critical parts / components in HPA along with analysis of their probabilities occurrences , margins, HALT testing, risks, potential impact and mitigation strategies |
| Vendor to provide a list of recommended spare parts lists & quantities and a separate estimated costs for spare parts. |
| Vendor to provide total budgetary costs for each of two HPA for destination LBNL inclusive of costs for aforesaid NRTL field evaluations at factory & at LBNL, CA licensed structural engineer evaluation report & certification, packaging, air shipping, transit insurance, warranty etc (preferably with high level breakup of such costs) |
| The total number of RF amplifier modules utilised should be minimised but be mindful of not to push their operating point to maximum limits. |
| The RF high power combining should be preferably in single stage. |
| Despite above specs & requirements, the vendors are welcome to provide any relevant information as much as they can on corresponding technical details on similar pulsed RF HPA as designed, built & demonstrated by them. Vendors are welcome to provide any additional remarkable design features that they have built & demonstrated in similar pulsed RF HPA's. |
| Vendors are also welcome to provide any value engineering ideas and proposals for improvements in pulsed RF HPA performances in cost effective manner. |
(C) Estimated total budgetary costs (for destination LBNL) for such aforesaid each HPA unit in USD
(D) Estimated delivery period for two HPA units (after placing of procurement order, if any made)
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