Salient Characteristics.docx

This is a Salient Characteristics document for a Real-Time Micro-Focus X-Ray Inspection System sourced by the Department of the Army Materiel Command Army Contracting Command Aberdeen Proving Ground (Solicitation W911QX26QA189). The Government requires a compact, real-time micro-focus X-ray inspection system designed for quality inspection of populated printed circuit boards (PCBs), specifically for Ball Grid Array (BGA) solder joint and void analysis following automated pick-and-place placement. The system must feature adjustable anode voltage (0-80 kV), adjustable anode current (up to 200 micro-amps), and a focal spot size of 10 microns or finer, with minimum resolution of 10 microns or better. The system shall provide geometric magnification of at least 500x and optical magnification of at least 1,200x with selectable field of view options (minimum 25 mm and 50 mm).

The system requires a five-axis manipulator with joystick positioning control, X/Y scan area of minimum 5.5" x 9", and board accommodation capacity of minimum 12" x 8". Additional mandatory specifications include an integrated laser locator for sample positioning, image processing software with variable frame averaging and on-screen measurement capability, static and video image output formats (.jpg, .tif, .avi), and a self-contained internal computer with integrated display, wireless keyboard/mouse, dual-display capability, Wi-Fi, and Bluetooth connectivity. The system must fit a compact desktop form factor not exceeding approximately 22"W x 26"D x 27"H, operate on 120V/60Hz or 220V/50Hz standard facility power, and comply with U.S. radiation safety standards (21 CFR 1020.40) with full shielding and CE marking or equivalent. Desired evaluation factors include low-lead/lead-free enclosure design, optional transport/road case for portability, and warranty, installation, operator training, and U.S.-based service/support availability.