Attachment A TECH REQUIREMENT MC2 10 Jul 26.docx

ATTACHMENT A: TECHNICAL REQUIREMENTS

DEPARTMENT of ENERGY /NATIONAL NUCLEAR SECURITY AGENCY

MICROELECTRONICS RESEARCH, DEVELOPMENT, AND PRODUCTION CAPABILITY

1.0 INTRODUCTION

The National Nuclear Security Administration (NNSA) mission includes the delivery of safe, secure, and reliable nuclear weapons for the Nation’s strategic deterrent. As part of this process, the NNSA produces materials and components that comprise modern nuclear weapons, including microelectronics. Responses to this Request for Information (RFI) will be used to identify qualified vendors capable of meeting these requirements. The information gathered will be used to formulate final requirements, which will subsequently be posted in a solicitation for competitive bids.

2.0 BACKGROUND

The Office of Production Modernization and Materials Management (NA-193) oversees the modernization of production facilities that manufacture the materials and components necessary for long-term reliability of the Nation’s nuclear weapons, including microelectronics. These microelectronic products include a variety of complementary metal–oxide semiconductor (CMOS) based products (including digital, analog, and mixed signal), micro–electromechanical systems (MEMS), silicon photonics, and quantum devices (e.g., micro–fabricated ion traps). NNSA requirements include rigorous quality and reliability standards and documentation, tailored requirements, and demands not typical of commercial users.

3.0 TECHNICAL REQUIREMENTS

This contract requires the following capabilities:

3.1 Technical Capabilities in Microelectronics:

a) Vendors must describe typical or expected throughputs for each process, performance attributes (e.g., node size, power requirements, wafer substrate type), packaging and testing capabilities, lead times, and certification standards (e.g., Defense Microelectronics Activity (DMEA) certification, ISO–9001).

3.2 Radiation Effects and Testing:

a) Vendors must describe their radiation hardened (rad hard) manufacturing process, including levels of radiation hardness, validation, and radiation testing capabilities.

3.3 Research and Development (R&D):

a) Vendors must describe their ability to support external partnerships for R&D, including process modifications.

3.4 General Questions:

a) Do you currently provide microelectronics production or R&D services to the United States Government (USG)? If able to provide, please list services.

b) Describe your ability to handle export-controlled information (ECI) and other information-controlled drawings and products.

c) Describe your recommended business partnership approach, including the key parameters (i.e., buy quantity, value, design for existing product) of a viable business partnership.

4.0 QUALITY

The NNSA requires a high level of product and supplier process quality. NNSA is interested in providers that operate under industry leading quality management system(s). Offeror quality management systems should be documented, registered, and proven to support consistent operational processes, manage risk, and prioritize process improvement (e.g., ISO 9001:2015). Offeror’s quality management systems should account for the following:

a) Purchasing.

b) Corrective and preventive action.

c) Handling, storage, packaging, preservation and delivery and procedures.

d) Control of quality records.

e) Internal quality audits.

f) Training.

The supplier quality management system must be proven to be capable of delivering highly consistent, predictable, and compliant operations that deliver products that meet NNSA requirements.

5.0 SUPPLIER MANAGEMENT

The Contractor shall maintain a comprehensive Supplier Management Program to ensure that all material suppliers, manufacturers, distributors, and supply chain providers consistently meet contract requirements for quality, delivery, cost, and performance. The Contractor shall implement a disciplined process for supplier qualification, selection, onboarding, performance monitoring, and continuous improvement. The Contractor shall conduct periodic supplier assessments, monitor supply chain risks, and implement mitigation strategies to address potential disruptions affecting production schedules or product quality. Quality issues shall be managed through documented corrective and preventive action processes, with suppliers held accountable for prompt resolution and sustained performance improvement.

The Contractor shall maintain effective communication and collaboration with key suppliers to ensure material availability, product conformity, and supply chain continuity. When required by contract, statute, or regulation, the Contractor shall ensure compliance with domestic sourcing requirements, including the use of U.S.-manufactured products and materials. The Contractor shall maintain documented traceability and pedigree records for critical materials, components, and assemblies, including records of origin, certifications, inspection results, and chain-of-custody documentation, to support product authenticity, regulatory compliance, and end-to-end supply chain visibility.

6.0 SECURITY REQUIREMENTS

The Contractor must be free from foreign ownership, control, or influence (FOCI) and must currently possess or have the ability to obtain a top secret facility security clearance. Per 11.4 952.204-73 Facility clearance, and 10 U.S.C. §2536, Award of certain contracts to entities controlled by a foreign government: prohibition, the award of a contract under a national security program is prohibited to entities controlled by a foreign government if access to proscribed information is required.

7.0 PLACE OF PERFORMANCE/DELIVERY

The primary place of performance shall be the vendor’s facility. The vendor is responsible for packaging and testing of microelectronic components prior to final delivery.

8.0 DEFINITIONS

· CMOS: complementary metal–oxide semiconductor

· CO: Contracting Officer

· COR: Contracting Officer Representative

· DMEA: Defense Microelectronics Activity

· DOE: Department of Energy

· ECI: export-controlled information

· FOCI: foreign ownership, control, or influence

· MEMS: micro–electromechanical systems

· NNSA: National Nuclear Security Administration

· R&D: research and development

· Rad hard: radiation hardened

· RFI: Request for Information

· USG: United States Government