1655327-SD Amend_2.pdf

Amendment 0001

NAVFAC

E-PROJECT NUMBER

1655327

CONTINUATION SHEET

URA-DOCK2-NMC-REPAIR SEAWALL AT URAGO DOCK2

At the

NOF URAGO

The purpose of this Amendment 0002 is to change drawings.

1 TABLE OF CONTENTS

1.1 Revising Drawings

DOCUMENT 00 01 15.00 33 LIST OF DRAWINGS

1.2 CONTRACT DRAWINGS

The following drawings are revised as of 01/13/22:

NAVFAC DWG NO. TITLE Revised Date

17259321 SECTION-1 01/13/22

17259322 SECTION-2 01/13/22

These revised/replaced Drawings accompany this amendment.

NAVAL FACILITIES ENGINEERING COMMAND FAR EAST

NAVAL FACILITIES ENGINEERING COMMAND FAR EAST

NAVSEA OP 5 VOLUME 1 SEVENTH REVISION

Change 10 5-39

a. A wide variation in the resistivity of the soil in the immediate area around the grounding system under test;

b. The presence of stray ground currents;

c. The presence of conductors buried near the grounding system under test and the associated reference electrodes, and;

d. The proximity of the reference electrodes to the sphere of influence presented by the grounding system under test. As a result, the purpose of earth resistance measurements is to determine an order of magnitude of the resistance to earth of the grounding system versus to determine a specific value.

FIGURE 5-13. U.S. Air Force Probe Locations

5-8.2.5. Example Written Test Procedure. Appendix E presents a draft of a written test procedure, which can be used in the development of a specific written test procedure for an activity. An activity should use this attachment purely as a guide and should feel free to modify it in any way to make their written test procedure fit the operations at the activity.

5-8.2.6. Point-to-Point Bonding Testing. Resistance testing is the most important quality control technique that can be used to quantify the effectiveness of bonds. The bonding resistance test method is a simple point-to-point resistance measurement. It is recommended that the test equipment used in this testing be capable of using a minimum of two milliamperes test current to ensure proper accuracy at the very low resistance levels to be measured. The test instrument must be capable of reading one ohm, +10%.

CUI//FEDCON

CUI//FEDCON

5-8.2.6. Point-to-Point Bonding Testing5-8.2.6. Point-to-Point Bonding Testing. Resistance testing is t

5-40 Change 10

NOTE

The accuracy of a Simpson 260 multimeter, which is not acceptable for this requirement, is +2.5% of arc, which equates to +20% at one ohm.

5-8.2.6.1. Selection and Preparation of Test Points. The maximum bonding resistance shall be one ohm or less. Since the values expected during such measurements are very low, extreme care must be taken to ensure that the test points are properly prepared for testing to minimize the effect of contact resistance. Preparation of the test points could include the scraping of painted, corroded, or rusted surfaces with files or knives. Careful attention must also be given to the attachment method made with the test points. Some attachment point techniques, which have been successfully used, are electrodes with sharp points or electrodes with clamps which have sharp points which can “bite” into the item under test.

5-8.2.6.2. Effect of Lead Length. When significant lead lengths are used in the testing of the bonding resistance between an item and a ground girdle reference point, the resistance of the cabling used can be much greater than the bonding resistance between the items being measured. It is important that the resistance of the leads used in the testing be measured and recorded prior to (and possibly after) testing. This lead resistance must be subtracted from the measured value of bonding resistance of the item under test to obtain the true bonding resistance of the item under test.

5-8.2.6.3. Example Written Test Procedure. Appendix E shows a proposed test procedure, which can be used to draft a written test procedure conducting bonding resistance testing. This test procedure is written around the use of a digital, four-terminal earth resistance tester. A similar technique can be written around the use of null-balance (or similar) testers.

5-8.2.7. Documentation of Test Results. Electrical test results shall be maintained for the last six inspection cycles. To maximize the ability to perform a trend analysis of the test results, a much larger sample size is necessary. It is recommended that the test data be maintained for the lifetime of the facility. This data can be kept in the form of a paper copy or the data entered into a computer data file. If properly designed, the data file can provide a database, which can be used in a computer-based trend analysis program. Appendix E provides an example of an outline of a minimum written test procedure which can be used in the performance of conductive floor testing. An activity may develop an alternative test procedure as long as it meets the requirements of this manual.

5-8.3. VISUAL INSPECTION. While it is not possible to confirm full system compliance with a visual inspection, it is possible to detect obvious problems such as broken or missing bonding straps, frayed bonding jumpers, and similar items.

5-8.3.1. Inspection Team Membership. The make-up of the visual inspection team, including the team leader, shall be specified in the activity’s test plan. The number of persons on the team is not limited. It is recommended that the building supervisor be a member of the visual inspection team, or that he at least assist in the visual inspection of his facility. The building

E-11

SECTION III

BONDING RESISTANCE TESTING

PURPOSE.

This document provides specific test procedures to be used in the performance of bonding resistance testing in accordance with the requirements of paragraph 5-8.2.6.

SCHEDULING.

This section should identify the frequency of bonding resistance testing.

Point-to-point bonding shall be conducted every 24 months in accordance with the requirements of paragraph 5-8.2.6 using the methods forwarded below.

RESPONSIBILITY.

This section should identify those offices or personnel responsible for performing the various functions required for bonding resistance testing. It should also identify who is responsible for the coordination of various personnel, including the facility supervisor and electrical shop technicians. It is also recommended that the SOP for a facility be more detailed than the text provided below as to the responsibility for the performance of specific tasks.

Among those responsibilities which should be detailed in this section are:

a. Scheduling of the testing.

b. Coordination between (facility supervisor) and (personnel conducting the electrical testing).

c. Providing all necessary test equipment and tools with personnel skilled in the operation of the equipment.

d. Ensuring that the test equipment used in the testing is calibrated in accordance with (facility acronym) requirements.

e. Selection of test points.

f. Ensuring that the testing is conducted in accordance with the requirements of this procedure and that the test results are properly documented.

g. Analysis of test results.

h. Development and dissemination of test data.

E-12

Facility Supervisor. Those tasks which could be best performed by the facility supervisor are given below in a sample format. Cautions and Warnings which should be included in this section at the applicable locations are also provided below.

Prior to the testing detailed in this procedure, (facility supervisor) shall:

a. Brief the test team on any explosives hazards that may exist in the building at the time of the test.

b. Provide any personnel necessary to handle explosives.

1. Only authorized ordnance handlers shall handle any explosives materials.

2. A minimum of two personnel shall be required to move explosives.

Person Responsible For The Operation Of The Test Equipment.

Prior to the performance of any testing conducted as a part of the detailed test procedures, (person responsible for the operation of the test equipment) shall:

a. Ensure that all test equipment to be used in the testing described in this document are properly calibrated and in good working condition;

b. Ensure that electrodes meeting the specifications detailed in the procedures are available.

Test Conductor.

Prior to the performance of any testing conducted as a part of the detailed test procedures, (test conductor) shall:

a. Ensure that all bonding straps have been removed between the grounding systems under test and any grounded ordnance items (as required herein).

TEST HARDWARE.

The manufacturer and model number (and possible serial number) of the equipment chosen for use in bonding resistance testing should be detailed in this section. In the example provided below, even the configuration of the electrodes has been provided in this section for a 4-terminal megger.

a. A (state manufacturer and model number of equipment) tester shall be used in the measurement of point-to-point bonding resistances in ordnance storage and operating facilities.

WARNING

E-13

The C1 and P1 electrodes shall be shunted together and the C2 and P2 electrodes shall be shunted. All measurements shall be made between the C1/P1 and C2/P2 terminals.

CAUTION

The (state manufacturer and model number of the equipment) is not approved for use in hazardous (classified) locations. The test equipment shall not be located in any area where there may be explosives dusts, exposed electro-explosive devices (EEDs), or flammable or combustible vapors.

SELECTION OF TEST POINTS.

The test points to be used in the bonding resistance testing shall be as specified on the test data for the structure.

It is the responsibility of (test conductor) to make the connection of the test leads to the items-under-test. He will have the ultimate responsibility to determine the specific test point location.

SPECIFIC TEST PROCEDURES.

The specific procedures to be used in the bonding resistance testing must be detailed in this section. Such procedures will vary depending upon the type of equipment used. The text below provides example wording when using a 4-terminal digital earth tester for the bonding resistance testing.

Prior to conducting any point-to-point resistance testing, (test equipment operator) shall ensure that the test equipment is configured as shown in figure 1.

FIGURE E-2. Bonding Resistance Testing Equipment Configuration

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Prior to conducting any of the testing discussed in this section, the resistance of the test leads to be used shall be measured by (test equipment operator) and recorded onto the data sheet by (test conductor).

(Test conductor) shall select the test points from the test data sheet provided in the Grounding Systems Test Plan.

(Test conductor) shall prepare the test points and make the connection between the test leads and the items-under-test.

CAUTION

The test leads shall be disconnected from the test equipment until which time the leads have been connected to the test points and (test conductor) has given the command to make the reading.

Once (test conductor) has made the connection between the test leads and the test points, he shall signal to (test equipment operator) to make the measurement.

At the command of (test conductor), (test equipment operator) shall connect the test leads to the test equipment as described under "Test Hardware".

CAUTION

Prior to connecting the leads to the test equipment, (test equipment operator) shall ensure that the power to the test equipment is OFF.

Prior to applying power to the test leads, (test equipment operator) shall ensure that the C1 and P1 electrodes are shunted together and the C2 and P2 electrodes are shunted, that the TEST CURRENT is set on NORMAL setting, and the FILTER is OUT.

(Test equipment operator) shall switch the RANGE selector switch working down from the highest to lowest range.

(Test equipment operator) shall notify (test conductor) of the test value recorded for the test point, that the power to the test equipment is being turned OFF and the test leads are being removed. (Test conductor) shall record the test results on the data sheet.

(Test conductor) shall prepare the next test point and repeat the above steps until all the data is gathered on each of the test points specified by the Grounding Systems Test Plan.

DATA ANALYSIS.

There are a great deal of different procedures that can be used in the analysis of bonding resistance test data. Some minimum evaluation criteria is forwarded below. An activity may

E-15/(E-16 Blank) also choose an analysis procedure that would be based on the analysis of the differences in bonding resistance values.

No bonding resistance of greater than one ohm will be allowed.

Any value recorded greater than 0.9 ohms shall be documented and reported to (office for the grounding systems for ordnance facilities) for further review.

POST-TEST PROCEDURES.

The procedures to be performed after the completion of the testing should be detailed in this section. An example of some of the items which should be included in this section are listed below.

a. Reconnect all ground straps disconnected prior to testing (recommend a facility representative).

b. Check to ensure all tools are removed from test area (recommend test conductor).

c. (State the procedures to be used to assemble and forward a copy of test data and comments/recommendations and to identify those offices requiring a copy of the final report.)