Attachment B - MDA_QS_003_PMAP_Rev_C.pdf

MISSILE DEFENSE AGENCY

PARTS, MATERIALS, AND PROCESSES

MISSION ASSURANCE PLAN

MDA-QS-003-PMAP-REV C

October 01, 2019

Hard copies of this document are for REFERENCE ONLY and should not be considered the latest revision.

beyond the date of printing.

MDA-QS-003-PMAP-REV C

Missile Defense Agency Parts, Materials, and Processes Mission Assurance Plan

APPROVED BY

M c~iJ Wtte(.-4u~ - Michael Wadzinski G

Date · 2 '?> S{:JYT '2.o l q

Director Quality , Safety, and Mission Assurance (QS)

APPROVED BY:

Vi~JohnHill

Date I ar 20) 1 Director Missile Defense Agency iii

October 01, 2019 MDA-QS-003-PMAP-REV C iv

Revision Record

Revision Date Description Affected Pages

- 20 October 2006 Initial Draft Release

A 26 March 2008

Revision incorporating MDA community comments

2-40, Appendices A, B, C, D, E, F, G

Revision of RHA Appendix, Added “REV A” to name of document

Appendix D

Added new Fig 1, Improved PMPB structure, roles and responsibilities, Clarified/Reinstated Outgassing and Offgassing requirements to Categories B and C

2-3, 6, 11

Added requirement for impact statement on MDA Advisories

B 2 March 2012 Revisions incorporating PMAG and Program comments (see ECP), Addition of IA and SCRM requirements

1-54, Appendices A, B, C, E, F, H

C 26 July 2019 Parts Selection Order of Precedence, Additive Manufacturing, Add requirements for new technology program TRL 4-6 Program comments (see ECP), Addition of new SCRM requirements, New/revised COTS requirements, Addition of Appendices I and J

1-82, Appendices A, B, C, D, E, F, G, H, I, J

Original QS Team Contributors Tom Bulk

Barry Birdsong Craig Chamberlain

Joe Khuri Glenn Benninger

Alexander Steel Fred Schipp Rich Baldwin

Matthew Parsons Dale Platteter

Mike Rader Trent Anderson Jack Henderson

Aaron Victor Robert Herron

Rev C QS Team Contributors

Barry Birdsong Lynn Mayes Rich Baldwin

Glenn Benninger Matthew Parsons

Fred Schipp Alexander Steel Jonathan Ahlbin Richard Boxwell

David Busby Randy Carter Scott Carver

Andre Danson Alfonso Rivera-Ortiz

Bruce Dickerson Dan Foster Nick Fox

Steve Harrigan Johnnie Hobbs Gary Huffman Don Hutchings

Tara Jones Duane Larsen

Tessa Lett Thom Lopez

Greg May Melany Mioduszewski

Isaiah Mullis

Craig Neermann Aaron Pedigo Chuck Peltier

Keith Peterson Richard Plebuch

Taylor Reed Mark Savage

Stephanie Stanley Alex Trcka

Mark Van Hoorde Robert Varner Robert Wilson Steven Twigg

Table of Contents

1 Scope

1.1 Purpose

1.2 Applicability and Accountability

1.3 Implementation Plan

1.4 Order of Precedence

1.5 Contract Requirements

1.6 Legacy Designs

1.7 Advanced Research Programs

2 PMP Management Structure, Roles, and Responsibilities

2.1 PMP Board

2.1.1 PMP Board Chairmanship

2.1.2 PMP Board Membership

2.2 PMP Control Board

2.2.1 PMPCB Chairmanship

2.2.2 PMPCB Membership

2.2.3 PMPCB Administrator

2.2.4 PMPCB PMP Data and Review Process

2.3 QSP Group

2.4 As Designed Parts, Materials and Processes List (ADPMPL)

3 PMP Requirements

3.1 Hardware Categories and Descriptions

3.2 EEE Parts, Mechanical Parts, and Materials

3.2.1 Order of Precedence for EEE Parts Selection

3.2.2 Standard Parts and Materials

3.2.3 Nonstandard Parts and Materials

3.2.4 Tailoring

3.2.5 EEE Parts Screening

3.2.6 Parts Derating

3.2.7 Plastic Encapsulated Devices

3.2.8 Custom Devices

3.2.9 Pb-Free Risk Management

3.2.10 Electrical Connectors

3.2.11 Laboratory Certification

3.2.12 High Density Packaging

3.3 Materials and Processes

3.3.1 Materials Selection

3.3.2 Material Outgassing

3.3.3 Flammability

3.3.4 Non-destructive Inspection (NDI)

3.3.5 Organic Coatings and Paintings

3.3.6 Adhesive Bonding

3.3.7 Lubricants

3.3.8 Aluminum

3.3.9 Steel

3.3.10 Titanium

3.3.11 Welding

3.3.12 Brazing

3.3.13 Forgings

3.3.14 Castings

3.3.15 Composites

3.3.16 Electrolysis and Silver Migration

3.3.17 Conductive Gaskets

3.3.18 Additive Manufacturing & Printed Electronics

3.4 Corrosion Prevention

3.4.1 Stress Corrosion

3.4.2 Finishes and Surface Treatments

3.4.3 Galvanic Corrosion

3.5 Restricted PMP

3.6 PMP Quality Requirements

3.6.1 Data Retention

3.6.2 Reuse of Parts and Materials

3.6.3 Electronic Parts and Commercial Off-The-Shelf (COTS) Assembly Traceability

3.6.4 Mechanical Parts Traceability

3.6.5 Materials Traceability

3.6.6 Incoming Inspection Requirements

3.6.7 Supply Chain Risk Management

3.6.8 Destructive Physical Analysis

3.6.9 Process Selection

3.6.10 Processes and Controls

3.6.11 Service Life

3.6.12 Shelf Life

3.6.13 Parts Age Control

3.6.14 EEE Parts Obsolescence Plan

3.6.15 Industry/GIDEP/MDA Advisories

3.6.16 Alternate Part and Material Selection

3.6.17 Substitute Part and Material Selection

3.7 PMP Procurement Management

3.7.1 Authorized Supplier/OCM Selection & Surveillance

3.7.2 Procurement of Mechanical Parts and Materials

3.7.3 Procurement of Printed Wiring Boards

3.8 Radiation Hardness Assurance (RHA)

3.8.1 RHA Qualification of Parts for Use

3.9 Government Furnished Equipment & Material

3.10 Commercial Off-The-Shelf (COTS) Product and Non-Developmental Item Management

3.10.1 COTS Product Management – Additional Requirements for Categories A, B, T, and D. 60

3.11 PMP Qualification (General)

3.11.1 Qualification by Similarity

3.11.2 Requalification of Parts

3.12 Non-Conforming Materials and Parts

3.13 Failure Investigation Support

3.14 Electrostatic Discharge Control

3.15 Environmental Controls

3.16 Handling Requirements

3.16.1 Moisture/Reflow Sensitive Surface Mount Devices

3.16.2 Contamination Prevention and Control

3.17 Part and Material Identification and Marking

3.18 Use of New Technology PMP

Definitions Acronyms Government Documents Commercial Documents

Appendix A EEE Parts Derating…………………………………….………………………..………..……….A-1 A.1 Microcircuit Derating Requirements ................................................................................................... A-2 A.2 Transistor Derating Requirements ..................................................................................................... A-3 A.3 Diode Derating Requirements ........................................................................................................... A-4 A.4 Capacitor Derating Requirements ..................................................................................................... A-6 A.5 Resistor Derating Requirements ........................................................................................................ A-7 A.6 Connector Derating Requirements .................................................................................................... A-8 A.7 Crystal Derating Requirements .......................................................................................................... A-9 A.8 Crystal Oscillator Derating Requirements.......................................................................................... A-9 A.9 Filter Derating Requirements ........................................................................................................... A-10 A.10 Fuse Derating Requirements for Cartridge Style ........................................................................... A-10 A.11 Circuit Breaker Derating Requirements .......................................................................................... A-11 A.12 Magnetics Derating Requirements ................................................................................................. A-12 A.13 Relay Derating Requirements ........................................................................................................ A-13 A.14 Mechanical Switch Derating Requirements .................................................................................... A-14 A.15 Thermistor Derating Requirements ................................................................................................ A-15 A.16 Wire and Cable Derating Requirements ......................................................................................... A-15 A.17 Derating Requirements for PEMs ................................................................................................... A-16 A.18 Optoelectronic Device Derating Requirements .............................................................................. A-17 A.19 Microwave Device Derating Requirements .................................................................................... A-18 A.20 MCM and Hybrid Derating Requirements....................................................................................... A-20

Appendix B Plastic Encapsulated Microcircuits………………...………………….………..………..………B-1 B.1 Plastic Encapsulated Microcircuits (PEM) Requirements ................................................................. B-2 B.2 Requirements for PEMs with Copper or Silver Wire Bonds .............................................................. B-4 B.2.1 Non-Destructive Wire Bond Screening ........................................................................................... B-5 B.2.2 Documentation Review ................................................................................................................... B-5 B.2.3 Qualification by Similarity ................................................................................................................ B-6 B.2.4 Baseline Construction Analysis or Destructive Physical Analysis .................................................. B-6 B.2.5 PEMS with Copper Wire Bond Qualification ................................................................................... B-8 B.2.6 Three Temperature Electrical Testing ............................................................................................ B-9 B.2.7 Preconditioning ............................................................................................................................... B-9 B.2.8 Temperature Humidity .................................................................................................................... B-9 B.2.9 Temperature Cycling ....................................................................................................................... B-9 B.2.10 Pass/Fail Criteria .......................................................................................................................... B-9

Appendix C COTS Product Hardware Selection and Acceptance Best Practices.........…………..……..C-1

C.1 COTS and Non-Developmental Item Selection Checklist…………………………………........……....C-2

Appendix D Radiation Hardness Assurance…………………………………….………..………….….…....D-1 D.1 RHA Program (General) .................................................................................................................... D-2 D.2 Specification of Radiation Environment ............................................................................................. D-2 D.3 Radiation Transport Analysis ............................................................................................................. D-3 D.4 Radiation Hardness Assurance Testing ............................................................................................ D-3 D.4.1 Total Ionizing Dose ......................................................................................................................... D-7 D.4.2 Displacement Damage ................................................................................................................... D-7 D.4.3 Dose Rate Effects ........................................................................................................................... D-7 D.4.4 Single Event Effects ....................................................................................................................... D-8 D.4.5 EMP Coupled Effects ..................................................................................................................... D-8 D.4.6 Thermomechanical Effects ............................................................................................................. D-9 D.5 Hardness Critical Category vs. Radiation Design Margin .................................................................. D-9 D.5.1 Special Considerations ................................................................................................................. D-10 D.6 Radiation Hardness Assurance Related Documents ...................................................................... D-11

Appendix E Restricted PMP Requiring Special Consideration………………………...………….………..E-1

Appendix F MDA PMAP Data Items…………………………………………………………………………...F-1

Appendix G Corrosion Prevention and Control Planning…………………..…………………………..……G-1 G.1 Purpose ............................................................................................................................................. G-2 G.1.1 General ........................................................................................................................................... G-2 G.2 Organization and Responsibilities ..................................................................................................... G-2 G.2.1 MDA Program Corrosion Prevention Advisory Teams ................................................................... G-2

G.2.1.1 Corrosion Prevention and Control Responsibilities of the PMPCB .................. G-2 G.2.2 Contractor Corrosion Team (CCT) .................................................................................................. G-3

G.2.2.1 Contractor Corrosion Team Responsibilities .................................................... G-4 G.2.3 Corrosion Control Functional Tasks................................................................................................ G-4

G.2.3.1 Materials and Processes ................................................................................... G-5 G.2.3.2 Materials and Processes – Testing ................................................................... G-5 G.2.3.3 Design ............................................................................................................... G-5 G.2.3.4 Reliability, Maintainability, and Supportability (RM&S) ..................................... G-5 G.2.3.5 Production Operations ...................................................................................... G-5 G.2.3.6 Quality Assurance ............................................................................................. G-6 G.2.3.7 Planning for Manufacture .................................................................................. G-6 G.2.3.8 Hazardous Materials ......................................................................................... G-6

G.3 Corrosion Prevention and Control Planning- General Requirements ............................................... G-6 G.3.1 System Development and Demonstration Phase ........................................................................... G-7

G.3.1.1 Primary Engineering Documents ...................................................................... G-7 G.3.1.2 The Materials and Processes Functional Group Shall Verify: .......................... G-7 G.3.1.3 Supplier Designed Parts and Equipment .......................................................... G-7 G.3.1.4 Upgrade/Integration to Existing Systems .......................................................... G-7

G.4 Production and Development Phase ................................................................................................. G-7 G.4.1 Technical Manuals .......................................................................................................................... G-7 G.4.2 Field Maintenance ........................................................................................................................... G-8 G.4.3 Operations and Support Phase....................................................................................................... G-8 G.5 DOD and Service Corrosion Policy, Regulations, and Guidance...................................................... G-8 G.5.1 Public Law ....................................................................................................................................... G-8 G.5.2 DoD Acquisition Policy .................................................................................................................... G-8 G.5.3 U.S. Army Regulations .................................................................................................................... G-8 G.5.4 U.S Air Force Instructions and Handbooks ..................................................................................... G-9 G.5.5 NAVY and USMC Programs, Policies and Instructions .................................................................. G-9

Appendix H PMAP Compliance Matrix…………………………………………………………….....………..H-1

Appendix I Parts Age Control ….………………………………………………..………………………....……I-1 I.1 Scope…………………………………………………………………………………………………………….I-2 I.2 Monitoring & Tracking ............................................................................................................................ I-2 I.2.1 Lot Date Codes ................................................................................................................................... I-2 I.2.2 Environments ...................................................................................................................................... I-2 I.2.3 Identification........................................................................................................................................ I-2 I.3 Environmental Parameters for Storage ................................................................................................. I-2 I.4 Shelf Life Extension ............................................................................................................................... I-2 I.5 Control Parameters ................................................................................................................................ I-2 I.5.1 Test Requirements ............................................................................................................................. I-2 I.5.1.1 General Requirements per EEE Parts Family: ......................................................................... I-2 I.5.1.2 Specific Requirements per EEE PartsFamily: .......................................................................... I-3 I.5.1.3 ElectricalTtesting ...................................................................................................................... I-3 I.5.1.4 External Visual Inspection ........................................................................................................ I-3 I.5.1.5 Seal Test .................................................................................................................................. I-3

I.5.2 Nonconformance ................................................................................................................................ I-3 I.5.3 Shelf Life Extension Date Code.......................................................................................................... I-4 I.5.4 Shelf Life Extension Report ................................................................................................................ I-4 I.5.5 Certificate of Conformity ..................................................................................................................... I-4 I.6 Shelf Life Extension Report ................................................................................................................... I-4 I.6.1 Purpose and Objective ....................................................................................................................... I-4 I.6.2 Report Content ................................................................................................................................... I-4

Appendix J PMAP Application for Heritage Hardware…………………………………………….….………J-1 Appendix J Conventions: ........................................................................................................................... J-2 Scope ......................................................................................................................................................... J-4 J.1.1 Purpose ............................................................................................................................................. J-4 J.1.2 Applicability and Accountability ......................................................................................................... J-4 J.1.3 Implementation Approach ................................................................................................................. J-5 J.1.4 Order of Precedence ......................................................................................................................... J-6 J.1.5 Contract Requirements ..................................................................................................................... J-6 J.2.2 PMP Control Board ........................................................................................................................... J-6

J.2.2.1 PMPCB Chairmanship ................................................................................................... J-6 J.2.2.2 PMPCB Membership ..................................................................................................... J-6 J.3.6.16 Alternate Part and Material Selection .......................................................................... J-6 J.3.6.17 Substitute Part and Material Selection ........................................................................ J-6

Page Intentionally Blank

1 Scope

This document defines Parts, Materials, and Processes (PMP) requirements for all new or modified, safety critical or mission critical products and systems developed for the Missile Defense Agency (MDA).

The definitions section of this document defines “Modified”, “Safety Critical” and “Mission Critical”.

Sections 3.6.7.2 and 3.7.1 apply additionally to Heritage and Legacy safety critical or mission critical products and systems. This document provides detailed PMP requirements for MDA programs and contractors and is an integral part of the MDA Quality, Safety, and Mission Assurance Strategic Mission.

1.1 Purpose

This document establishes the minimum requirements for the selection, approval, and overall management of PMP used in the design, development, fabrication, procurement, and service life of MDA products and systems. This plan documents a coordinated approach essential to maintain the highest quality, reliability, and availability of MDA products and systems by utilizing PMP review boards at the program and Agency level. The contractor shall utilize integrated management of the selection, application, procurement, control, and standardization of PMP by use of an Integrated Digital Environment (IDE). This coordinated approach should include, but is not limited to, the following:

Improve the reliability of program PMP and reduce PMP failures throughout the complete product life cycle: design, qualification, manufacturing, procurement, integration, assembly, test, and operations.

Define Agency and Program roles and responsibilities for PMP.

Promote use of proven practices and standards (both Government and non-government) that best reduce program life cycle costs.

Minimize impact from Diminishing Manufacturing Sources and Material Shortages (DMSMS) and part obsolescence.

1.2 Applicability and Accountability

This document is applicable to all MDA organizations and contractors involved in the development, management, or procurement of safety critical or mission critical items. It is the responsibility of the MDA program offices to allocate PMP budget to implement the PMAP requirements. The MDA program office

Quality Tip (Non-mandatory) – PMAP Introduction

These requirements represent decades of MDA/QS Mission Assurance lessons learned in the aerospace industry, but are not intended to be a substitute for the critical thinking needed to properly apply them. There are a myriad of additional factors which are beyond the scope of this document, but which must be carefully considered when applying these processes to each unique company, contract, system, component, work environment, and employee. Contractors are encouraged to partner with the Government early and often in this tailoring process, to ensure the intent of each requirement is properly understood while being applied.

Quality Tip (Non-mandatory) – “Safety Critical” and “Mission Critical”

MDA Programs should define Mission and Safety Critical PMP via the Failure Modes and Effects Criticality Analysis (FMECA) and Reliability Critical Items lists. These lists should be program-level controlled CDRL items.

MDA Programs require identification of “Mission Critical” items in accordance with criteria in MDA Assurance Provisions (MAP) paragraph 3.5.7, and “Safety Critical” items in accordance with MAP, paragraph 3.14.

shall ensure proper flow down of PMP requirements (as applicable) to the prime contractor and assess the prime contractor to ensure that applicable PMAP requirements are flowed down to subcontractors, down to the Original Component Manufacturer (OCM) tier level.

MDA program offices ensure PMAP compliance via approval of the prime contractor’s PMP Plan deliverable (CDRL defined in Appendix F). Additionally, the program office and prime contractor shall conduct PMP compliance assessments at the Tier 1 level as a minimum. The on-site PMP compliance assessments shall ensure that all applicable PMP requirements and deliverables defined in the prime contractor’s PMP Plan herein are flowed down through contracts to the Tier 1 subcontractors and implemented accordingly via procurement documentation, purchase orders and performance specifications down to the subcontractor that purchases OCM piece parts. Participation of the responsible MDA program office and prime contractor shall also be allowed at on-site PMP assessments.

The initial on-site assessments by the MDA program office, prime contractor, and subcontractors shall be conducted after the Program Critical Design Review (CDR) and prior to the Program Production Readiness Review. Follow-up on-site assessments shall be conducted by the MDA program office, prime contractor, and subcontractors throughout the contract deliverables life cycle with the time between assessments not exceeding three (3) years.

On-site assessments at the prime contractor, subcontractors, or suppliers for contract changes to safety critical or mission critical items is at the discretion of the MDA program office, but shall not violate the timespan between assessments of three (3) years throughout the contract deliverables life cycle.

When test equipment (e.g., range safety equipment), telemetry equipment, or Information Technology (IT) hardware is determined to be mission critical or safety critical, the requirements of this document apply.

1.3 Implementation Plan

Implementation of the PMAP on MDA Programs is accomplished via three (3) contract data items described in Appendix F of this document.

1) The contractor shall develop a Program PMP Plan in accordance with (IAW) Contract Data Requirements (CDRL, number per program contract) for the program that meets the requirements and follows the guidance of MDA-QS-003-PMAP (PMAP). This Program PMP Plan shall be approved by the Government Program Office with MDA/QS concurrence via the MDA PMP Board (PMPB). The contractor shall notify the Program Office, PMP Control Board (PMPCB) whenever the prime contractor PMP Plan is revised, and provide a detailed summary of the changes.

2) The contractor shall provide a submittal of the As Designed Parts, Materials and Processes List (ADPMPL) IAW CDRL (number per program contract). 1st submittal - at Preliminary Design Review, 2nd submittal - 60 days prior to Critical Design Review, and every 6 months thereafter for the life of the program.

3) The contractor shall provide a Lead (Pb) Free Control Plan (LFCP) for approval IAW CDRL (number per program contract) outlining the use of Pb-free or Tin (Sn)-based finishes and solders with less than 3% Pb by weight. (See Appendix F for LFCP CDRL example).

Quality Tip (Non-mandatory) – PMAP Compliance Matrix Appendix H

The MDA Program offices can complete a PMAP Compliance Matrix as provided in Appendix H to help draft the Program PMP Plan. The compliance matrix tool provides valuable insight into contractor PMP documentation and command media that helps to shape the deliverable PMP Plan and can help scope the Basis of Estimate for implementing the PMP Plan.

1.4 Order of Precedence

In the event of a conflict between the requirements of the MDA PMAP and the applicable documents cited herein, the requirements of the MDA PMAP take precedence. However, nothing in this document supersedes applicable laws and regulations unless a specific exemption has been obtained.

1.5 Contract Requirements

This document is a MDA Ballistic Missile Defense System (BMDS) Technical Baseline Requirements Document. MDA-QS-003-PMAP shall be referenced as an applicable document in the contract Statement of Work (SOW), Task Orders, and Statements of Objectives for development and/or procurement of new or modified, safety critical or mission critical hardware.

1.6 Legacy Designs

Legacy or Heritage designs may be used in MDA systems, subsystems, or assemblies, without invoking the full suite of PMAP requirements. PMAP Sections 3.6.7.2 and 3.7.1 shall be implemented on all Legacy designs and Heritage hardware. The MDA Program Office has the responsibility to require, the technical data package, design validation and verification records, reliability records, and qualification records for the proposed legacy design to ensure that the design meets performance, reliability, and service life requirements. Additionally, Appendix J provides suggested PMAP applicability for Legacy or heritage designs.

Any new PMP inserted into legacy design shall require PMPCB approval. When a proposed legacy design is determined to have modifications (e.g., part or material configuration changes due to obsolescence and/or product change notifications), the program office and prime contractor shall evaluate the identified part and material changes to determine the extent legacy designs shall be characterized. If the program office determines that the legacy design has enough configuration changes to require a delta qualification of the hardware, then all parts and materials of that assembly shall be subject to the requirements of the PMAP. Legacy designs planned for use by the contractor as Heritage hardware shall be submitted to the PMPCB via the ADPMPL for information and archiving to track potential impacts from future supply chain issues.

When Legacy designs are used and specific PMP requirements implementation cannot be validated (e.g., pure tin finishes, Particle Impact Noise Detection (PIND) on Cavity Devices, identification of galvanic couples, etc.) a Program Risk shall be documented for the Critical Design Review and or for Flight Tests.

Quality Tip (Non-mandatory) – Legacy Designs

Legacy Designs should be fully evaluated to ensure suitability for performance, reliability, and service life. The Heritage hardware item should meet all of the criteria below to be considered heritage;

otherwise, it shall be considered new or modified hardware and shall meet the full PMAP requirements:

The hardware environmental requirements, both amplitude and duration, encountered in the new application are equal to or less than the Heritage application.

The hardware has successfully passed qualification testing to the Heritage environments and successfully passed post-environmental functional testing.

The hardware is produced by the same manufacturer using identical tools, manufacturing processes, and quality control procedures.

For Flight Hardware, the hardware has a successful flight history of a minimum of five (5) flights in a similar application and performs similar functions.

For Ground Hardware, the hardware has a successful fielded operation for two (2) years with similar application and performs similar functions.

1.7 Advanced Research Programs

MDA is continuously working with contractors to improve technology for future advancements and programs to defeat evolving threats. Many of these program and technologies are managed as developmental programs at or below a Technology Readiness Level (TRL) of 6. For a new program in development stages that may never be flight-tested or fielded, it is not feasible to be fully PMAP compliant. Beginning with TRL 4, contractors shall develop a Requirements Applicability Matrix (RAM) to plan for becoming PMAP compliant and to ensure that any prototype designs can be produced to meet the PMAP. By TRL 5, the contractor shall document expected environments and a path to full PMAP compliance. At TRL 6, the contractor shall baseline the configuration for processors, Field Programmable Gate Arrays (FPGAs), and programmable devices that will meet MDA reliability and performance requirements. This approach ensures that any developed software and firmware can be carried forward with the hardware through each maturation of TRL levels and ensures that microprocessor changes and Printed Wiring Board Layouts at TRL 6 can incorporate the earlier design.

For TRL 5 hardware, the PMAP planning RAM shall be updated to reflect design changes from the TRL 4 design to include any parts that will need to be updated to meet reliability and performance. Parts selection criteria and rationale shall be documented in relevant engineering notebooks with justification to demonstrate how the objective system requirements, as well as potential near term parts obsolescence, and restricted parts and materials (per PMAP Appendix E) will be mitigated.

For TRL 6 hardware, the PMAP planning RAM shall be updated to reflect design changes from the TRL 5 design to include any parts that will need to be updated to meet reliability and performance before the Printed Wiring Boards are laid out for device footprints and device inputs and outputs. Parts selection criteria and rationale shall be documented in program design reviews, or relevant engineering notebooks, and shall include justification to demonstrate how the objective system requirements, obsolescence, and restricted parts and materials (per PMAP Appendix E) will be mitigated. In addition, at TRL 6, the contractor shall document radiation requirements (if applicable), obsolescence mitigations, derating violations (Appendix A), and service life concerns that may impact future systems performance and reliability.

Any development program of record shall be fully PMAP compliant at entrance to TRL 7 and shall not be allowed to leverage previous noncompliant PMAP designs, parts, materials, or processes.

For additional information on TRLs, see DoD Technology Readiness Assessment (TRA) Guidance.

2 PMP Management Structure, Roles, and Responsibilities

MDA PMP management structure consists of an Agency level PMP Board (PMPB) (see 2.1), and PMP Control Boards (PMPCB) at the Program level (see 2.2). Program PMPCBs address all PMP activity, review and approve all PMP (standard and nonstandard), and can adjudicate most issues concerning PMP compliance with the program PMP Plan and the PMAP. Items containing restricted PMP identified in Appendix E shall be submitted to the PMPCB (Severity 2 or 3), PMPB (Severity 1), or MDA QS and MDA DE (Severity 0) for adjudication. Major non-compliances, such as use of a Severity Rating 1 restricted PMP, or deviation from an approved PMP Plan, shall be submitted to the PMPB for disposition.

The Agency PMPB will provide feedback to the program office on evolving new PMP issues, disposition of major non-compliances from other programs that may impact all programs, and other PMP acquisition information as shown in Figure 2. Severity Rating 1 restricted PMP submissions to the PMPB will be adjudicated as needed and do not need to occur during the on-site meetings.

MDA program roles and responsibilities include staffing parts and materials expertise to support the PMPCB and conducting on-site PMP compliance assessments. Each MDA program is responsible for including PMAP compliance requirements in new acquisition Statements of Work, Task Orders and Statements of Objectives as defined in paragraph 1.5. Finally, each MDA program, in coordination with the PMPB, is responsible for approving a PMP Plan that complies with the scope of the PMAP. PMPCB program office and contractor co-chairs shall be required to participate in semi-annual Agency PMPB Meetings, which may require travel to the meeting location.

Figure 2 - PMP Management Process

2.1 PMP Board

MDA staffs and manages a PMP Board (PMPB) to ensure reliability and uniform PMP requirements compliance across all PMPCB operations and assure the reliability of all new or modified, safety critical or mission critical PMP. PMPB responsibilities include:

a. Establishes and ensures consistent application of PMP requirements

b. Provides management of QSP resources

c. Reviews and jointly approves MDA Program Prime Contractor PMP Plans

d. Reviews PMPCB proceedings/minutes

e. Helps Programs develop adjudication process to address issues arising out of PMPCBs

f. Manages and updates the MDA ADPMPL

g. Dispositions Severity Rating "1" Restricted PMP as defined in Appendix E

h. Reviews failure analyses and corrective actions performed by PMPCBs

i. Shares PMP lessons learned with all programs

j. Reviews Program Office PMP staffing levels

Each program PMPCB shall provide an ADPMPL to the PMPB IAW section 2.4 below and Appendix F.

To conduct the business of the board, the PMPB shall meet semi-annually at a minimum and at other times as directed by the chairman.

2.1.1 PMP Board Chairmanship

The PMPB chairman is appointed by the MDA QS Director. The chairman directs the activities of the PMPB and manages agency PMP resources, including technical expertise and development of PMPB procedures and requirements. As required, the PMPB has the authority to override a PMPCB decision or recommendation.

2.1.2 PMP Board Membership

PMPB roles and responsibilities shall not be delegated. Representatives may be substituted as required.

PMPB members include:

a. Chairman

b. Co-Chairs of the PMPCBs

c. MDA representatives (as required) from DE (Engineering), and QS (Quality, Safety, and Mission

Assurance)

d. PMP technical representatives appointed to advise the board

e. Contractor PMP expertise as required

2.2 PMP Control Board

MDA Program Offices shall establish and maintain a PMP Control Board (PMPCB) to ensure reliability and uniformity across all contractor PMP and corrosion prevention operations. In addition, subcontractors of new or modified, safety critical or mission critical hardware shall also be represented on the board when their hardware is reviewed by the PMPCB. The PMPCB shall meet monthly as a minimum and at other times as directed by the co-chairs and as required to conduct the business of the Board.

PMPCB responsibilities include:

a. Reports board proceedings/minutes to the PMPB chairman

b. Reviews and approves subcontractor PMP Plans and changes to the PMP Plans

c. Reviews and dispositions Standard Parts for proper application, to include derating, lead finish, GIDEP Alerts, Obsolescence status and the need for extra testing such as Particle Impact Noise Detection (PIND)

d. Reviews and dispositions all materials and Nonstandard Parts per PMAP Section 3 for proper application/derating, screening, qualification, lead finish, obsolescence and Product Change Notifications for all new or modified safety critical or mission critical hardware

e. Reviews and dispositions Severity “2” Restricted PMP as defined in Appendix E

f. Reviews and recommends disposition of Severity "1" and “0” Restricted PMP as defined in

Appendix E to Agency PMPB

g. Develops and maintains a configuration controlled ADPMPL

h. Reviews part and material failure analyses and corrective action reports

i. Reviews and approves contractor radiation test approach and test plans when applicable

j. Supports on-site assessments of subcontractor facilities to verify PMP requirements compliance

k. Assigns a contractor board administrator to document PMP control board proceedings/minutes

l. Supports pre-flight risk assessment (see Definitions) of all parts procured from unauthorized suppliers

Additionally, each program PMPCB shall maintain the As Designed Parts, Materials, and Processes List ADPMPL (see 2.4) throughout the system life cycle. The contractor shall ensure that all subcontractors submit all required data fields for each PMP item used in new or modified safety critical or mission critical hardware IAW Appendix F.

2.2.1 PMPCB Chairmanship

The PMPCB shall be co-chaired by a Government representative from the program office and a representative from the prime contractor. The PMPB ensures the appointed PMPCB Co-Chairs have the proper qualifications.

2.2.2 PMPCB Membership

Roles and responsibilities of the PMPCB Co-Chairs shall not be delegated. Representatives may be substituted as required. PMPCB membership includes:

a. Co-Chairs of the PMPCB

b. Contractor representatives (as required) from systems engineering and parts and material engineering, reliability engineering, radiation survivability and corrosion prevention support

c. Agency sponsored technical representatives (as required), PMAG (Parts and Materials Advisory

Group)

d. Prime Contractor Board Administrator

e. Subcontractor PMP representatives

2.2.3 PMPCB Administrator

The prime contractor shall staff a PMPCB Administrator. The PMPCB administrator shall be responsible for preparation and distribution of PMPCB meeting agenda, PMP data packages, meeting minutes, and tracking PMPCB action items and comment closure.

2.2.4 PMPCB PMP Data and Review Process

PMP shall be submitted for PMPCB consideration a minimum of seven (7) business days prior to the meeting date to allow for a Government review cycle. A review cycle represents the required timeframe to adequately evaluate and respond to each submission of a part or material. The Government review cycle may be extended based on the number of PMP submittals received. Contractors should plan PMP submittals to the PMPCB accordingly prior to major milestones. The MDA Directive for Engineering Technical Reviews has rigid PMP requirements for each Program Milestone and should be reviewed. All standard and nonstandard PMP shall be included in the ADPMPL submission (see 2.4). Each nonstandard PMP submitted for PMPCB review and approval shall be submitted as a data package. A data package shall contain, at a minimum, the items listed in Table 2.2.4.

Table 2.2.4 Nonstandard PMP Data Package Contents

Item Documentation Nonstandard Electronic

Parts Nonstandard Mechanical

Parts Materials and

Processes

Approval Request Form (see Appendix F)

Nonstandard Part Approval Request

(NSPAR)

Nonstandard Mechanical Part Approval Request

(NSMPAR)

Material/Process Approval Request

(MPAR)

Comment Matrix Comment Matrix Comment Matrix Comment Matrix

Supporting Documentation

All qualification data, data sheet, reliability monitoring data, source control drawing, if applicable, procurement control drawing, if applicable, etc.

All relevant drawings, procurement specifications, galvanic assessment

For materials: a technical data sheet, safety data sheet, procurement specification, and all relevant drawings.

For Processes: detailed description, specification

2.3 QSP Group

MDA Quality, Safety and Mission Assurance Directorate has established and staffed a Part and Material Advisory Group (PMAG) that provides in-depth technical expertise for the Agency, programs, and contractors. This organization supports the PMPB and PMPCBs. Responsibilities include:

a. Participates in PMP inter-Agency activities

b. Provides expertise, guidance, and shares lessons learned with all programs and contractors

c. Provides industry with technical expertise, e.g., passive devices, monolithic circuits, Pb-free, nanotechnology, polymers, composite materials, and material processes

d. Supports PMPCB meetings as required

e. Manages the MDA Advisory Program

f. Develops strategic alliances with industry to influence standards development, and supports sharing of parts and materials qualification and reliability information, product changes notices, and obsolescence information

g. Facilitates PMP investigations

h. Manages the QS Part and Material Failure Analysis Laboratories

2.4 As Designed Parts, Materials and Processes List (ADPMPL)

For all mission critical or safety critical items, the contractor shall provide a submittal of the As Designed Parts, Materials, and Processes List (ADPMPL) in accordance with Program specific CDRL (number per program contract). An example of an ADPMPL CDRL is provided in Appendix F. 1st submittal - at Preliminary Design Review, 2nd submittal - 60 days prior to Critical Design Review, and every 6 months thereafter for the life of the program or as frequently as required by the contract.

3 PMP Requirements

All PMP shall be selected for use based upon meeting the requirements of the applicability matrix (Table 3.1), which shows the general MDA PMP requirements by category. Specific applicable PMP requirements include all subparagraphs of the PMAP that may not be listed in Table 3.1. Hardware categories A, B, C, T, D, R, and E shown in Table 3.1 are defined in Section 3.1.

3.1 Hardware Categories and Descriptions

Category A: Continuous use systems, under space environment conditions, non-repairable, such as satellite systems that encounter severe environment conditions from launch, flight trajectory and orbit, and radiation hardness requirements (single-event effects, low dose rate, high total dose).

Category B: Impulse (Single shot) systems encountering extreme conditions related to launch (air, ground and sea), flight trajectory, vehicle boost into exo-atmosphere, and vehicle reentry. Category B hardware can be subjected to periods of long-term storage up to 25 years. Once deployed, equipment is non-repairable without recall to Missile Assembly Buildings or Depots. Radiation hardness requirements (single-event effects, high dose rate, and low total dose) may apply.

Quality Tip (Non-mandatory) – MDA Engineering Technical Review Process

The MDA Systems Engineering Directorate has established minimum exit criteria requirements for each major milestone in program development and documented those requirements in MDA Instruction 5000.20-INS, Engineering Technical Review Process. This document requires rigorous PMP Exit Criteria for each Program Milestone and the Agency uses these criteria to determine if the Program can proceed to the next milestone. It is recommended that contractors review the Engineering Technical Review Process for situational awareness regarding expectations of the Agency for PMP compliance and maturity at each program milestone.

Category C: Extended use aircraft systems, repairable. Equipment exposed to turbulence and air temperature fluctuations. Extreme pressure, shock, condensation and vibration are minimal.

Category T: Targets. Test-specific, non-deployable, impulse (single shot) systems encountering extreme conditions related to launch (air, ground and sea), flight trajectory, vehicle boost into exo-atmosphere, and vehicle reentry. Test Targets typically have shorter service life requirements than interceptors.

Category D: Ground and Sea-based mobile systems, repairable, exposed to one or more of the following: temperature and humidity fluctuations, vibration, shock, and Electromagnetic Environmental Effects. Typical steady state continuous operation.

Category R: Stationary, ground-based sensor systems, networking equipment, or fire control processing with redundancies, repairable, in temperature and humidity controlled environments, designed and constructed using cost of maintenance as a key program parameter. Hardware in this category is typically used in 24/7 systems, primarily composed of both contractor designed hardware and Commercial Off-The-Shelf (COTS) products.

Category E: Stationary, ground systems, repairable, in temperature and humidity controlled environments readily accessible to maintenance. Hardware in this category is typically used in 24/7 systems, with redundancies, and is primarily composed of COTS products.

Quality Tip (Non-mandatory) – Example Systems in Each Category

Category A – Space Tracking and Surveillance System (STSS) Category B – Ground Based Interceptor, SM-3, THAAD Interceptor Category C – Airborne Laser Category T – Medium Range Ballistic Missile Targets, Air Launched Targets Category D – SM-3 Shipboard Launch and Tracking Equipment, THAAD TPY-2 Radar Category R – Long Range Detection Radar, Ground-Based X-Band Radar Category E – Internal MDIOC Workstations and Servers, COTS IT Products

Table 3.1 PMP Requirements Applicability Matrix

Paragraph PMP Requirement Cat A Cat B Cat C Cat T Cat D Cat R Cat E

1.2 Applicability and Accountability x x x x x x x

1.3 Implementation Plan x x x x x x x

1.6 Legacy Designs x x x x x x x

1.7 Advanced Research Programs x x x x x x x

PMP Management Structure, Roles, and Responsibilities x x x x x x x

2.1.2 PMP Board Membership x x x x x x x

2.2 PMP Control Board x x x x x x x

2.2.1 PMPCB Chairmanship x x x x x x x

2.2.2 PMPCB Membership x x x x x x x

2.2.3 PMPCB Administrator x x x x x x x

2.2.4 PMPCB PMP Data and Review Process x x x x x x x

2.4 As Designed Parts, Materials and Processes List (ADPMPL)

x x x x x x x

3 PMP Requirements x x x x x x x

3.2 EEE Parts, Mechanical Parts, and Materials x x x x x x x

3.2.1 Order of Precedence for EEE Parts Selection

x x x x x x

3.2.2 Standard Parts and Materials x x x x x x

3.2.3 Nonstandard Parts and Materials x x x x x x x

3.2.4 Tailoring x x x x x x x

3.2.5 EEE Parts Screening x x x x x x

3.2.6 Parts Derating x x x x x x

3.2.7 Plastic Encapsulated Devices x x x x x x

3.2.8 Custom Devices x x x x x x

3.2.9 Pb-free Risk Management x x x x x x x

3.2.10 Electrical Connectors x x x x x x x

3.2.11 Laboratory Certification x x x x x x x

3.2.12…