GERBER LAYER NAMING.txt
TXT text file 591 B Posted
- Attached to
- CMS HL Scintillator Tileboards PCBs
- Solicitation number
- 370664swk
About this file
The provided file is a Gerber layer naming convention document detailing file extensions for printed circuit board (PCB) design layers. The document outlines specific layer designations including drill drawings (*_BOHR.ger), copper layers (top and inner layers from L01T to L08B), solder mask layers (top and bottom), silkscreen layers (top and bottom), and paste layers (top and bottom).
This layer naming document corresponds to a Fermilab solicitation (No. 370664swk) for CMS HL Scintillator Tileboards PCBs, with proposals due by 5pm on July 28, 2025. The solicitation is specifically for bare PCBs and requires SARC and PUR-466 documentation for proposals exceeding $10,000. The full design files are available on SAM.gov, and the procurement is being conducted by the Department of Energy's Fermi National Accelerator Laboratory.
Text of this file
File Name Meaning *_BOHR.ger Drill Drawing *_L01T.ger Top Copper (Layer1) *_L02i.ger Inner Copper (Layer2) *_L03i.ger Inner Copper (Layer3) *_L04i.ger Inner Copper (Layer4) *_L05i.ger Inner Copper (Layer5) *_L06i.ger Inner Copper (Layer6) *_L07i.ger Inner Copper (Layer7) *_L08B.ger Bottom Copper(Layer8) *_LSM1.ger Top Solder Mask *_LSM2.ger Bottom Solder Mask *_POS1.ger Top Silkscreen *_POS2.ger Bottom Silkscreen *_SMD1.ger Top Paste *_SMD2.ger Bottom Paste
Other files
| File | Type | Posted |
|---|---|---|
| PUR-466_Proposal Certifications.pdf | ||
| 370664swk Design Files.zip | ZIP file | |
| RFP 370664swk.pdf | ||
| DO-34125 Tileboards Technical Specification.pdf | ||
| SARC_Subcontractor Annual RepsCerts Rev 4.pdf |
On GovTribe
Work with this file
- Download the original file
- Contacts named in this file
- Similar government files
- Ask GovTribe AI about this file
File details come from the government source that posted it. Updated .