Attachment 1 ASIS2 Manufacturing Specs.doc

Manufacturing

Specification

For the

ASR9 SERIAL INTERFACE SYSTEM (ASIS)

PHASE 2 (Assembly Revision F) Circuit Card Document Rev Q (08-26-2016) Prepared by the

Federal Aviation Administration

Air Traffic Organization (ATO)

AJW-146

Including part updates 08-26-2016 Asis2_q.doc

QUALITY

The contractor / supplier shall fabricate the deliverables, assemble them, and test each ASIS 2 system in accordance with the test instructions provided in the ASIS 2 Factory Acceptance Test Procedure. This document will be provided as GFE (Government Furnished Equipment) to the successful contract bidder. A description of these tests is provided herein.

Each ASIS 2 assembly shall be appropriately packaged in a static-free bag contained in foam cushioned, cardboard, shipping container (ULINE part number S-5938).

Quality. Overall quality of the ASIS 2 shall be commensurate with industry accepted standards for commercial quality products. The following are some, but not all examples:

1. Wire crimps to cabling/wire assemblies are gas tight; calibrated and certified crimp tools only.

2. All flux removed from any solder work.

3. Component leads are neatly trimmed.

4. Wire harnessing inside the adapter box is neatly dressed.

5. Any screws, nuts appropriately torqued.

6. Final product free from dirt, chemicals, scratches, etc.

7. Strain reliefs on cables act as strain reliefs.

8. Components assembled neatly on baseboards, parts numbers visible when possible.

9. Serial numbers shall be inscribed onto the ASIS 2 circuit card with indelible ink or permanent labels in the appropriate place: (S/N 2001 is starting number in this manufacturing sequence) starting with:

month-year-2001 example for January 2011

01-11-2001

10. PC bare board fabrication shall comply with IPC (Institute for Interconnecting and Packaging Electronic Circuits) standard IPC-A-600E class “2”.

The baseboards shall be standard FR4, 0.0625” +.009” / -.007”, 1 ounce copper, manufactured solder mask over bare copper. Other specifications may apply. See the baseboard descriptions on sheets A2 and A3.

The baseboards must be manufactured and tested so as to insure no opens or shorts in the deliverables.

11. The PC board assemblies must be wave soldered and visually inspected so as to insure no opens or shorts in the deliverables. PC board assembly shall comply with IPC standard IPC-A-610B class 2.

12. Each ASIS 2 assembly shall be appropriately packaged in a static-free bag contained in a protective, foam cushioned, cardboard, shipping container (12” x 10” x 2.75”, ULINE S-5938).

13. Place “REV F” label on completed circuit card assembly (Over top of “REV E” silkscreen) Components may not be interchanged without prior written approval by the customer; i.e., the Federal Aviation Administration AJW-146. That approval will normally be given provided function and quality are not compromised.

Components with part numbers which include a propagation delay may not be interchanged with a slower part.

All of the deliverables must successfully pass the Factory Acceptance Testing described herein.

Any ASIS 2 assembly or system component which does not meet these qualifications may be rejected.

FACTORY ACCEPTANCE TESTING

All of the deliverables shall be tested in the factory; i.e., factory acceptance tested prior to their delivery to the Government (AJW-146). The customer (AJW-146) reserves the right to witness those factory acceptance tests. The contractor/supplier shall provide at least one working week’s prior notice to AJW-146 when that testing will begin.

The factory acceptance test is described in the supplied document “Factory Acceptance Test Procedures” dated 9/21/2000.

Government Furnished Equipment (GFE): All GERBER and CAD files required for manufacturing will be provided to the selected contractor/supplier. The test equipment, i.e. hardware and diagnostic programs, required to perform factory acceptance testing, will also be provided. These files and equipment are listed below respectively.

Files necessary for manufacturing (CROM disk )

1) ASIS 2 GERBER files, disk 1 of 1 Manufacture of ASIS 2 baseboard.

See file list on page A2

2) U7 EPROM master or binary format disk file Manufacture of PCB filename: boot.bin 2/24/2003

3) U51 PAL master or JDEC fuse map disk file Manufacture of PCB filename: ch5_mux.jed 4/20/98

4) U59,61,63,65,67,69 PAL master or JDEC fuse map disk file Manufacture of PCB filename:data_mux.jed 9/21/99

5) U60,62,64,66,68,70 PAL master or JDEC fuse map disk file Manufacture of PCB filename:clk_mux.jed 9/21/99

Equipment, hardware and software, necessary for Factory Acceptance Testing (SIMULATOR)

1) ASIS 2 Factory Acceptance Test Procedures. Also, in this procedure, is a complete listing of the equipment (including test software) which will be GFE’d to the contractor. An overview follows.

2) ASIS II Test Set - a MS Windows based Personal Computer (not supplied) is required to operate the test set. The “Hyperterminal” software supplied with MS Windows is used.

A) ASR9 Serial Interface System (ASIS 2) Card Assembly

This portion of the specification describes the ASIS 2 card assembly.

Included in this package are:

1) the baseboard description

2) the baseboard print

3) a complete parts description

4) the assembly print

Files for the PCB (GERBER) are available from AJW-146 on a PC compatible CDROM. Those files will be delivered to the successful bidder.

The PC board assemblies must be wave soldered and subsequently visually inspected so as to insure no opens or shorts are in the deliverables. All ICs, sockets, and components shall be soldered directly to the boards.

Components may not be interchanged without prior written approval by the customer; i.e., the Federal Aviation Administration AJW-146. That approval will normally be given provided function and quality are not compromised.

Components with part numbers which include a propagation delay may not be interchanged with a slower part.

(ASIS 2) Card Assembly Baseboard Description

Approximately 11.3"L x 7.75"W x 0.0625"T (actual size from GERBER files)

6 Layers

No special thickness required on layers

1 ground plane

1 power plane

4 signal layers, 8 mil traces, 8 mil clearances, 60 mil pads, surface mount pads: one 0.025” pitch component, one 0.1” pitch component

Solder mask on both sides

Silk-Screen on component side, white epoxy.

See artwork drawing ASR9-002.6 silkscreen.

approx. 3000 holes, 6 sizes, no blind vias, no interstitial vias

Hole size tolerance - commercial standard, hole sizes listed are finished sizes.

FILES INCLUDED

ASIS2E.FAB

baseboard fab drawing

ASIS2E.ASY

PCB assembly drawing

ASIS2E.TOP

component layer

ASIS2E.IN1

internal 1 layer

ASIS2E.PWR

power layer

ASIS2E.GND

ground layer

ASIS2E.IN2

internal 2 layer

ASIS2E.BOT

solder layer

ASIS2E.SLK

top silk screen

ASIS2E.TMS

top solder mask

ASIS2E.BMS

bottom solder mask

ASIS2E.PST

top solder paste

ASIS2E.NCD

excellon n/c drill file

ASIS2E.NET

net list

README.TXT

information document

ORDER OF THE LAYERS

1 component (top)

2 int 1 (in1)

3 power (pwr)

4 ground (gnd)

5 int 2 (in1)

6 solder (bot)

PC bare board fabrication shall be commensurate with IPC (Institute for Interconnecting and Packaging Electronic Circuits) standards IPC-A-600E class 2 unless otherwise specified.

The baseboards shall be standard FR4, 0.0625” +.009” / -.007”, 1 ounce copper, manufactured solder mask over bare copper.

The baseboards must be manufactured and tested so as to insure no opens or shorts in the deliverables.

(ASIS 2- REV F) Card Assembly Parts List 08/26/2016 Itm# Qty Mfr Part # Manufacturer Description Print Reference

ASR9-002.6.1

Sub-Assy Bare Printed Circuit Card

C322C104M5U5TA

Kemet Cap, Monolithic, Ceramic, 0.1uF/50V C1, C7-C21, C23-C25, C54-C58, C77-C94

C97,C102-C104,C108

C330C105M5U5TA

Kemet Cap, Monolithic, Ceramic, 1.0uF/50V C2-C6, C26-C53, C59-C76

TAC226K020P06-F

Cornell-Dublier Cap, tantalum, 22.0 uF, 20 V C95,C96

C315C391K2G5TA

Kemet Cap, Monolithic, Ceramic, 390 pF/200V C22

2510-5002UB

3M Conn., 10 pos., right angle header J3, J4

2550-5002UB

3M.

Conn., 50 pos., right angle header J1, J2

SN7406N

TI

U12

SN74F74N

TI

74F74 U13

SN74LS10N

TI

74LS10

U1

SN74LS14N

TI

74LS14

U26

AM26LS31CN

TI

26LS31

U27-U34, U40-U46,U56-57,U71

AM26LS33ACN

TI

26LS33.

U35-U39,U47,U52,U55

MAX232ACPE+

Maxim

MAX232A

U2

MAX691CPE+

Maxim

MAX691A

U15

MAX200CPP+

Maxim

MAX200

U17-U25

M27C1001-70F1

ST MICRO

128K X 8 CMOS EPROM, 70 ns U7

AT27C010-70PU

Atmel

ALTERNATE OTP PROM

110-13-632-41-001 Mill-Max Socket, 32 Pin.

U7

SST39SF010A-70-4C-PHE MicroChip 128K X 8 CMOS Flash RAM, 70 ns U3-U6

AM29F010B-70PC

AMD (Alternate part)

WMS128K8-55CM

Microsemi 128K X 8 CMOS Static RAM, 55 ns U8-U11

K6T1008C2E-DB55

Samsung

ALTERNATE

628128LP-70

Generic Alternate 128K X 8 CMOS Static RAM, 70 ns

TS68EN360MRB/Q25L E2V

Quad Integrated Comm. Controller U14

MC68EN360RC25L

Freescale (NXP), New Old Stock acceptable

510-93-241 Mill-Max PGA Socket, 241 pins U14

-18-075-002

HTF546A-49.1520

Conner Winfield Oscillator, 49.152 Mhz Stratum 3 U16

2340-6111TG

3M Jumper block, 2 Posts

JP3,J19-20

Note this jumper block comes in strips of 40 posts and must be cut down to two post units

S9002 Sullens.

Shorting block

JP3,JP7-8

Do Not Populate JP1 Component

JP1

Shorting Wire, 26 AWG, Soldered in place of JP2

JP2

5302H1-5V

IDI

LED, red

DS1

5302H5-5V

IDI

LED, green

DS2

TP12SH9ABE

C+K Switch, PB, SPDT

SW1

1N5819

GI

Diode.

D1

OD334JE

Ohmite Resistor, 330K, 1/4W carbon, 5% R4

510-AG90D-06

Augat SIP socket, 6 pos R7-R12,R14

Note: no resistors are populated into the SIP sockets.

CSC08A014K70GPA

Vishay/Dale Resistor ntwk, bussed SIP, 4.7K R3,15,19-20

MDP16014K70GD04

Dale Resistor ntwk, bussed DIP, 4.7K R1, R5, R6

OD472JE

Ohmite Resistor, 4.7K, 1/4W carbon, 5%.

R2,R18

(ASIS 2- REV F) Card Assembly Parts List 08/26/2016 Itm# Qty Mfr Part # Manufacturer Description Print Reference

138C910H02 Armel Custom connector, backplane P1

Screw, #2-56 X 3/8 P1

Nut, #2-56, with nylon locking P1

Calmark Card Extractor

C320C393K5R5TA

Kemet Cap, Monolithic, Ceramic, 0.039 uF/50V C98

C315C220K2G5TA

Kemet Cap, Monolithic, Ceram., 22 pF/200V C100-101

C315C392K5R5TA

Kemet Cap, Monolithic, Ceramic, 3900 pF/50V C99

AS-20.000-18-FUND

Raltron Crystal, 20 MHz X1

2380-6121TG

3M Header Connector,dual row 8 pins J16

3M Header Connector,dual row 6 pins J21

Note this header block comes in strips of 80 pins and can be cut down to six and eight pin units

2516-6002UB

3M Connector 16 pin header J5-J10

2526-6002UB

3M Connector 26 pin header J11

2534-6002UB

3M Connector 34 pin header J17

2520-6002UB

3M Connector 20 pin header J12-J15

SN74LS157N

TI

74LS157

U53

SN74LS374N

TI

74LS374

U50

ATF22V10CQZ-20PU Atmel

22V10 PAL

U51,59,61,63,65,67,69

E2007QNL

Pulse Engineering Ethernet transformer module, SMT U49

2340-6111TG

3M Jumper block, 3 Posts

JP7,JP8

Note this jumper block comes in strips of 40 posts and must be cut down to three post units

0705530004 Molex.

Right angle connector, 5 pin J18

OD301JE

Ohmite Resistor, 300 ohm, 1/4W carbon, 5% R13

MC68160AFB

Motorola Ethernet transceiver, SMT U48

MC68160AFBR2

IDT

ALTERNATE PART

CSC10A014K70GPA

Vishay/Dale Resistor ntwk, bussed SIP, 4.7K R16,R17

110-13-324-41-001 Mill-Max Socket, 24 Pin, open frame, screw machine.

U51

U59,U61,U63,U65,U67,U69

76PSB06ST

Grayhill Switch, DIP 6 position, Piano style

SW2

76SB06ST

Grayhill Switch, DIP 6 position

SW3

110-13-328-41-001 Mill-Max Socket, 28 Pin, open frame, screw machine.

U60,U62,U64,U66,U68,U70

SN74ALS29821NT

TI

IC

U58

SN74BCT29821NT

TI

.ALTERNATE PART

GAL26CV12B-20LP

Lattice

PAL

U60,U62,U64,U66,U68,U70

PALCE26V12H-20PC/4 AMD

ALTERNATE PART

GAL26CV12C-15LP Lattice ALTERNATE PART – Rochester Electronics

PTL-9-426

Brady High Temp Label

“REV F”

700-TFL-9001

ECS

Crystal Case Insulator Install on X1

S-5938

ULINE

Card Shipping Box

3001014 3M Static Shielding Bag

Change History

5/98

Original

7/7/98 Item 33 quantity changed from 6 to 7. (part R12, SIP socket)

Item 51 quantity changed from 1 to 2. (part U58, IC)

05/24/99 Item 2 quantity changed from 48 to 47

Item 3 quantity changed from 46 to 51

Item 16 quantity changed from 8 to 9

Item 34 quantity changed from 2 to 4

Item 46 quantity changed from 10 to 6

Item 49 deleted and replaced with new part

Item 52 quantity changed from 1 to 13

Item 54 quantity changed from 5 to 2

Item 59 quantity changed from 1 to 13

Items 60,61 added (DIP switches)

05/27/99 Item 20 part number changed from HM628128LP-7 to HM628128BLP-7

06/01/99 Item 14 part number changed from MAX202CPE to MAX232ACPE

08/12/99 Item 51 quantity changed from 2 to 1

Item 52 quantity changed from 13 to 7

Item 59 quantity changed from 13 to 7

Items 62,63,64 added

12/26/00 As built parts list. Updated items 19,20,21,24,54,61,64 to correct numbers.

03/12/02 Item 13 changed manufacturer from National DS26LS33ACN to TI AM26LS33ACN.

Item 20 part number changed from HM628128DLP-7 to HM628128DLP-5SL

Item 52 part number changed from PALCE22V10H25PC/4 to GAL22V10D-25LJ

7/22/02 As built parts list (second manufacturing run 12/02 – 4/03)

Item 52 part number changed from GAL22V10D-25LJ to GAL22V10D-25LPI

Item 20 part number changed from HM628128DLP-5SL to K6T1008C2E-DB55

Item 17 part number changed from AM27C010-70DC to M27C1001-70F1

Item 57 part number changed from MC68160FB to MC68160AFB

Item 64 part number changed from GAL26CV12B20LP to GAL26CV12C-20LP

9/11/06 Item 23 part number changed from MXO-045-50Mhz to HTF546A-49.1520

Item 20 alternate generic part number added 628128LP-70.

11/27/07 Item 65 Added “Rev F” label

03/31/08 Item 64 part number corrected from GAL26CV12C-20LP to GAL26CV12B-20LP

07/29/11 Item 63 part number alternate added SN74ALS29821NT

Item 55 part number updated to current Molex # 0705530004

Item 52 part number updated to current replacement TI # TIBPAL22V10ACNT from

Obsolete Lattice Part number

GAL22V10D-25LPI

Item 21 part number updated to current version Freescale# MC68EN360RC25L from

Obsolete Motorola # MC68EN360RC25K

Item 12 part number updated to current TI # AM26LS31CN was National DS26LS31CN

Item 66 part added to PCB assy- insulator for X1 crystal can 02/03/16 Items 67,68 added part numbers for shipping box and bag.

08/24/16 Item 2 part number change from C322C104M5U5CA to C322C104M5U5TA

Item 3 part number change from C330C105M5U5CA to C330C105M5U5TA

Item 5 part number change from C315C391K2G5CA to C315C391K2G5TA

Item 15 part number corrected from MAX691ACPE+ to MAX691CPE+

Item 16 part number change from MAX200CPP to MAX200CPP+

Item 41 part number change from CW-20C393K to C320C393K5R5TA 08/24/16 Item 42 part number change from C315C220K2G5CA to C315C220K2G5TA

Item 43 part number change from CW-15C392K to C315C392K5R5TA

Item 52 part number change from TIBPAL22V10-20 to ATF22V10CQZ-20PU

Item 53 part number change from E2007 to E2007QNL

Item 57 part number manufacturer added IDT

Item 63 swapped main and alternate part numbers

08/26/16 Item 19 part number change from AM29F010B-70PC to SST39F010A-70-4C-PHE

Item 20 part number added WMS128K8-55CM

Item 21 part number change from MC68EN360RC25L to TS68EN360MRB/Q25L

Item 32 part number change from unspecified generic to OD334JE

Item 34 part number update from CSC08A-01-472G to CSC08A014K70GPA

Item 35 part number update from MDP-16-01-472G to MDP16014K70GD04

Item 36 part number change from unspecified generic to OD472JE

Item 56 part number change from unspecified generic to OD301JE

Item 57 added alternate part MC68160AFBR2

Item 58 part number update from CSC10A-01-472G to CSC10A014K70GPA

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