Attachment 1 - Salient Characteristics.pdf

PDF 104 KB Posted

Attached to
USAFA Thin Film Vacuum Deposition and Coating System Federal contract opportunity
Solicitation number
FA700025Q0044
Issued by
Department of the Air Force Headquarters Air Force Academy

About this file

This document lists the salient characteristics for a sophisticated deposition chamber system. The specifications include a stainless steel chamber measuring at least 19 x 19 x 36 inches with welded side plates and a load lock system. The system features multiple deposition sources, including two 2-inch magnetron ion sputter sources, a 4-pocket E-beam source, and two thermal evaporation sources, along with comprehensive power supply and pumping capabilities.

Key technical features include a 1500 L/s cryopump, dry scroll mechanical pump, four thickness control crystal sensors, and a computer-controlled interface. The system supports substrate processing with a minimum substrate size of 4 inches and heating capabilities up to 350 °C. Additional specifications include two process gas channels with mass flow controllers, DC and RF power supplies, and comprehensive shipping and freight included in the price. The detailed list suggests this is a high-end scientific or industrial deposition equipment specification.

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Other files for this federal contract opportunity

Other files attached to USAFA Thin Film Vacuum Deposition and Coating System, newest first.
File Type Posted
Combined Synopsis Solicitation_Coating System_FA700025Q0044 Amendment 3.pdf PDF
Attachment 4 - FAR 52.212-3(b).pdf PDF
Tech Clarifiaction Answers.pdf PDF
Tech Clarifiaction Answers.pdf PDF
Attachment 2 - Provisions and Clauses_FA700025Q0044.pdf PDF
Attachment 3 - Buy American Certificate.pdf PDF
Combined Synopsis Solicitation_Coating System_FA700025Q0044.pdf PDF

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Text version

Salient Characteristics

• Stainless steel deposition chamber of size at least 19 x 19 x 36 inches (depth x width x height).

• Welded side plates of main chamber.

• Load Lock system.

• Two magnetron ion sputter sources of size 2 inch.

• 4-pocket E-beam source.

• Two thermal evaporation sources.

• Dry scroll mechanical pump.

• 1500 L/s or better cryopump.

• Four thickness control crystal sensors.

• DC and RF power supplies for ion sputter sources.

• Two DC power supplies for thermal evaporation sources.

• Minimum substrate size at least 4 inches.

• Substrate heating to at least 350 °C.

• Two process gas channels with mass flow controller

• Computer controlled interface

• Shipping and freight included in price.

File details come from the government source that posted it. Updated .