Attachment 1 23-00586 SOW 4-7-2023.pdf

STATEMENT OF WORK/REQUIREMENTS DOCUMENT

Title: Focused Ion Beam Scanning Electron Microscopes

April 7, 2023

*Paragraphs in red font with brackets are for response clarification and will be removed in the final award.

I. BACKGROUND INFORMATION

The NIST Center for Nanoscale Science and Technology (CNST) has a requirement for one (1) Gallium ion (Ga+) source focused ion beam scanning electron microscope (Ga+ FIB) system and one (1) Xenon (Xe) plasma source focused ion beam scanning electron microscope (Xe PFIB) to support nanofabrication research and development. The FIB SEM systems will replace the aging two Ga+ FIB SEM instruments currently sited and used as a shared resource in the NanoFab User Facility which is accessible to researchers from industry, academia, NIST, and other government agencies.

The FIB SEM systems are essential tools in the NanoFab and there is an increasing demand for new capabilities, such as automated instrument maintenance functions and sample preparation procedures, novel imaging detectors, larger volume processing and analysis, and material processing using ion species other than Ga+, that are well beyond what is supportable with the existing Ga+ FIB SEM systems. By upgrading one of the existing Ga+ FIB with a newer Ga+ FIB and replacing the other Ga+ FIB with a PFIB, NIST will be able to accommodate the research activities that require traditional Ga+ FIB processing as well as those that require faster materials milling, e.g., X-ray computed tomography sample preparation and semiconductor chip delayering and Ga-free transmission electron microscopy (TEM) and atom probe tomography (APT) specimen preparation.

Purpose/Objective: NIST intends to procure one (1) Ga+ FIB and one (1) Xe PFIB to replace two aging Ga+ FIB instruments currently used in the CNST NanoFab. The new FIB and PFIB will ensure NIST’s capacity to serve NanoFab users and provide state-of-the-art technical capabilities for FIB SEM-based characterization and materials processing.

II. SCOPE

The Contractor shall deliver a quantity of one (1) Ga+ FIB and one (1) Xe PFIB, inclusive of FOB Destination delivery, installation, warranty and training, and option line items.

III. MINIMUM REQUIREMENTS

The Contractor shall provide a system that meets all technical specifications identified below. All items must be new. Used or remanufactured equipment will not be considered for award.

Experimental, prototype, or custom items will not be considered. The use of “gray market” components are not authorized. All line items shall be shipped in the original manufacturer’s packaging and include all original documentation and software, when applicable.

Line Item 0001: Ga+ FIB SEM Description: Gallium ion (Ga+) source focused ion beam scanning electron microscope (FIB SEM) system Quantity: 1 A. Technical Specifications

1. Ga+ FIB SEM

1.1. Ion Beam Requirements

1.1.1. Ion Source General Design Requirement

1.1.1.1. The instrument shall be equipped with a liquid metal Gallium ion source capable of emitting for a minimum of 1,000 hours at 1 microamp of ion current. The system shall include provisions to bring the ion source to the operating condition automatically, including any temperature and voltage ramping, conditioning, or other preparations required for stable emission.

1.1.2. Ion Beam Voltage Range Requirement

1.1.2.1. The ion column shall operate at accelerating voltages of 30 kV or higher, and

500 V or lower. [If the energy of the ion leaving the final lens is not the ion landing energy, this shall be noted, and a detailed description of the mechanism provided.]

1.1.3. Ion Beam Current Range Requirement

1.1.3.1. The ion column shall be capable of delivering to the sample a beam current of

50 nA or higher and 1 pA or lower.

1.1.4. Ion Beam Aperture Requirement

1.1.4.1. The ion column shall be equipped with a motor-driven, computer-controlled aperture.

1.1.5. Ion Beam Fast Blanker Requirement

1.1.5.1. The ion column shall be equipped with a fast beam blanker.

1.1.6. Ion Beam Detector Requirement

1.1.6.1. The instrument shall be equipped with ion and electron detectors and ion beam scan coils for ion imaging. [The number, nature, and details of all available electron and ion detectors usable for ion beam imaging shall be described in the response.]

1.1.7. Ion Beam Image Acquisition Size Requirement

1.1.7.1. The ion beam imaging system shall be capable of acquiring digital images measuring 1024 pixels by 768 pixels or larger. The system shall be able to save or archive these images in TIFF format or similar lossless, open image file format.

1.1.8. Ion Beam Image Acquisition Performance Requirement

1.1.8.1. The ion beam imaging system shall be capable of acquiring digital images at magnifications of 300 X or lower and 200 kX or higher.

1.1.8.2. The ion beam imaging system shall be capable of rotating the ion beam raster in a 360 degree continuous fashion, and shall have a function to reset this rotation to 0 degrees.

1.1.8.3. The instrument shall be capable of an electronic ion beam image shift of at least 15 micrometers.

1.1.9. Ion Beam Ultimate Spatial Resolution Requirement

1.1.9.1. The ultimate spatial resolution of the ion beam imaging system shall be stated at ion beam voltage of 30 kV. [The method used (statistical or selective edge) to determine the spatial resolution shall be included in the response.]

1.2. Electron Beam Requirements

1.2.1. Electron Gun General Design Requirements

1.2.1.1. Electron gun shall be a field emission source of the Schottky emitter type to allow high brightness for high spatial resolution imaging, high current for electron backscatter analysis and chemical characterization, and good current stability over time.

1.2.1.2. The electron source shall be field replaceable.

1.2.1.3. The system shall include provisions to bring the electron source to the operating condition automatically, including any temperature and voltage ramping, conditioning, or other preparations required for stable emission.

1.2.2. Electron Beam Voltage Range Requirements

1.2.2.1. The electron column shall operate at accelerating voltages of 30 kV or higher and 500 V or lower. [The full voltage range of the column shall be described in the response.

1.2.2.2. The Vendor shall also describe any unusual design features used to accelerate or decelerate the electrons, such as combined acceleration anodes and sample bias. If the energy of the electrons leaving the final lens is not the electron landing energy, this shall be noted, and a detailed description of the mechanism provided.]

1.2.3. Electron Beam Deceleration or Similar Capability Requirement

1.2.3.1. The instrument shall be capable of electron beam deceleration or similar capability for high resolution imaging of non-conductive samples while maintaining the beam brightness.

1.2.3.2. [The range of landing energies, the description of the mechanism (e.g., stage bias) to control the landing energy shall be included in the response.]

1.2.4. Electron Beam Blanker Requirement

1.2.4.1. The electron column shall be equipped with a fast electron beam blanker.

1.2.5. Electron Beam Current Range Requirement

1.2.5.1. The electron column shall be capable of delivering to the sample a beam current of at least 80 nA.

1.2.5.2. The instrument shall be equipped with both beam current and specimen current measurement equipment, and the outputs from these measurements shall be available to scripts, external users, and accessories such as an XEDS analysis system.

1.2.6. Electron Beam Aperture Requirement

1.2.6.1. The electron column shall be equipped with a motor-driven, computer-controlled aperture.

1.2.6.2. The instrument shall be equipped with an image wobbler to aid in aperture centering and aberration correction.

1.2.7. Electron Detector Requirements

1.2.7.1. The electron column shall be equipped with in-column secondary electron and backscattered electron detectors. [The number, nature, and details of all available electron detectors shall be described in the response.]

1.2.7.2. The instrument shall be equipped with at least one secondary electron detector that is side-mounted or chamber mounted (e.g., Everhart-Thornley detector).

1.2.8. Dedicated Backscatter Electron Detector Requirements

1.2.8.1. The instrument shall be equipped with a dedicated backscatter electron (BSE) detector. [Detailed description of the detector such as the detector type and whether it is a retractable or permanent mount type, shall be stated in the response.]

1.2.9. Dedicated Scanning Transmission Electron (STEM) Detector Requirements

1.2.9.1. The instrument shall be equipped with a dedicated STEM detector that is capable of bright field and dark field STEM imaging. [Detailed description of the detector such as the detector imaging resolution, type (multi-segment, annular, etc.), and whether it is a retractable or permanent mount type, shall be stated in the response.]

1.2.10. Electron Beam Image Auto-Alignment Software Requirement

1.2.10.1. The electron column shall be equipped with automatic alignment features such as auto-focus, auto-stigmate, and automatic adjustment of brightness and contrast.

1.2.11. Electron Beam Image Acquisition Size Requirement

1.2.11.1. The electron imaging system shall be capable of acquiring digital images measuring 4096 pixels by 3072 pixels or larger. The system shall be able to save or archive these images in TIFF format, or similar lossless, open image file format. The bit depth of these images shall be 8 bits or deeper.

1.2.11.2. The electron imaging system shall be capable of simultaneously acquiring images from multiple detectors, e.g., simultaneous acquisition of SE image from the E-T detector and BSE image from an in-column detector.

1.2.11.3. The electron imaging system shall be capable of mixing signals from multiple detectors and displaying the mixed signal images.

1.2.12. Electron Beam Image Acquisition Performance Requirement

1.2.12.1. The electron imaging system shall be capable of acquiring digital images at magnifications of 100 X or lower and 700 kX or higher. The magnification shall be continuously adjustable within the full range and shall be automatically corrected for changes in working distance and accelerating voltage.

1.2.12.2. The electron imaging system shall be capable of rotating the electron beam raster in a 360 degree continuous fashion, and shall have a function to reset this rotation to 0 degrees.

1.2.12.3. The instrument shall be capable of an electronic electron image shift of at least 15 micrometers.

1.2.12.4. The instrument shall have drift correction capability.

1.2.12.5. The instrument shall be capable of both live-frame and frame-store acquisitions, and shall have a waveform monitor for adjusting contrast, brightness, and other image acquisition parameters.

1.2.12.6. The instrument shall be capable of reduced raster, spot mode, and line scan modes.

1.2.12.7. The instrument shall have dynamic focus capability to compensate for stage tilt.

1.2.13. Electron Beam External Scan Control Requirement

1.2.13.1. The instrument shall allow the electron beam to be controlled by an external scan source such as an EDS system.

1.2.14. Electron Beam Ultimate Spatial Resolution Requirement

1.2.14.1. The ultimate spatial resolution of the scanning electron microscope column shall be stated at electron beam landing energies of 30 keV, 15 keV, 1 keV, and 500 eV. [The electron detector type, whether beam deceleration was used, and the method used (statistical or selective edge) to determine the spatial resolution shall be included in the response.]

1.2.15. Electron Beam Multibeam Working Distance (WD) Spatial Resolution Requirement

1.2.15.1. The multibeam WD spatial resolution of the scanning electron microscope (SEM) column shall be stated at electron beam landing energies of 15 keV and 1 keV. This is the SEM resolution with the sample at the position where electron beam and the ion beam are coincident. [Electron beam current, imaging detector, working distance used for each resolution values shall be included in the response.]

1.3. Vacuum System Requirements

1.3.1. Oil-Free Vacuum Systems Requirement

1.3.1.1. Oil-free pumping system shall be used on the instrument.

1.3.2. Maximum Pumping Time to Operation Requirement

1.3.2.1. After venting the system for sample exchange, the system shall require no longer than five (5) minutes to pump down to operating pressure.

1.4. Specimen Chamber Requirements

1.4.1. Stage Navigation Camera Requirements

1.4.1.1. The chamber shall be equipped with at least one in-chamber camera with IR illuminator for sample navigation and stage viewing. [The description of the camera such as the camera type, camera position, and viewing angle shall be stated in the response.

1.4.2. Accessory Ports Documentation Requirement

1.4.2.1. The detailed size and locations of all accessory ports shall be included in the response.]

1.4.3. Sample Holder Requirement

1.4.3.1. The system shall include single stub sample holder and multiple stub sample holder.

1.4.3.2. The system shall include at least one type of TEM grid holders.

1.5. Gas Injection System (GIS) Requirements

1.5.1. Number of Gas Injection Systems Requirement

1.5.1.1. The instrument shall be capable of operating a minimum of four (4) gas chemistries. [Details of the GIS systems such as multiple GIS units, each with single precursor, or single GIS unit with multiple chemistry support shall be described in the response.]

1.5.1.2. The instrument shall be capable of performing material deposition using ion beam and electron beam. The vendor shall provide any configuration limitations (e.g., tilt angle) associated with the ion beam and electron beam deposition.

1.5.2. GIS Gas Availability Requirement

1.5.2.1. The instrument shall be capable of metal (e.g., Pt, W) deposition, carbon deposition, and water etch at a minimum.

1.5.2.2. [A list of available precursor materials shall be included in the response.

1.5.3. GIS Capability Requirement

1.5.3.1. The Vendor shall state whether the GIS supports the following capabilities:

1.5.3.1.1. On-the-fly user controllable flow rate

1.5.3.1.2. On-the-fly user controllable gas mixing

1.5.3.1.3. On-the-fly user controllable GIS needle positioning]

1.6. In situ Micromanipulator System Requirements

1.6.1. In situ Micromanipulation Capability Requirement

1.6.1.1. The instrument shall be equipped with an in situ micromanipulator capable of translocating or altering the sample within the vacuum chamber while the instrument is operating. At a minimum the system shall allow motorized X,Y,Z translation of an in situ probe suitable for attachment to TEM specimen membranes using metal or carbon deposition.

1.6.1.2. The in situ micromanipulator shall be capable of motorized 360 degree rotational control of the needle.

1.6.1.3. The system shall include any accessory necessary for micromanipulator needle exchange.

1.6.1.4. The system shall be compatible with standard manipulator needles available from various electron microscopy supply vendors.

1.7. Stage Requirements

1.7.1. Sample Size Requirement

1.7.1.1. The instrument shall be capable of accepting Si wafers up to 100 mm in diameter and allow full 360 degree continuous rotation of the same sample in the chamber.

1.7.2. 5-axes Motorized Stage Requirement

1.7.2.1. The instrument shall be equipped with a 5-axes motorized stage capable of X, Y, Z translation, rotation, and tilt.

1.7.2.2. The instrument shall be capable of compucentric rotation where stage rotation is accompanied by X and Y translation to maintain the same sample field of view during stage rotation.

1.7.3. [Stage Details Documentation Requirement

1.7.3.1. The stage general design and performance details shall be fully described in the response. The description shall include the following details:

1.7.3.1.1. number of stage drive axes

1.7.3.1.2. tilt angles achievable

1.7.3.1.3. repeatability at 0 degrees tilt

1.7.3.1.4. repeatability at ion-normal tilt]

1.8. Computer Control Requirements

1.8.1. External Computer Control Requirement

1.8.1.1. The instrument shall be provided with a computer control system that allows access to all SEM and FIB operating parameters from an external computer.

All instrument parameters must be controllable from the external computer, including all electron and ion optics, the stage, analytical system operation, and all aperture-drive positions. For all of these sub-systems (optics, stage, apertures), the positions and settings shall be set via digital signals, and a capability for digital recall of pre-programmed positions and settings shall be provided.

1.8.1.2. The instrument shall be provided with a separate data storage and processing computer that is networked to the control system computer. The data storage computer shall include minimum 1 TB of storage, 16 GB of RAM, USB ports, and the capability to accept additional hard drives.

1.8.1.3. The computer control system and data storage and processing computer shall be configurable to allow multiple user logins, each requiring a separate password.

1.8.2. Dedicated External Control Panel Requirement

1.8.2.1. The instrument shall be provided with a dedicated control panel that allows access to frequently used parameters such as focus, magnification, and stigmation.

1.8.3. Computer Controlled Ion and Electron Patterning and Milling Requirement

1.8.3.1. It shall be possible to automatically mill and deposit geometric shapes, patterns, and features using built-in primitive functions such as circles, rectangles, lines.

1.8.3.2. It shall be possible to automatically deposit patterns using the electron beam instead of ion beam.

1.8.4. Computer Controlled Ion Image Milling Requirement

1.8.4.1. It shall be possible to automatically mill and deposit complex images using bitmapped images as masks. Using this feature it shall be possible to mill and deposit features too complicated to represent by constructive geometry based on the primitive pattern palette described in section 1.8.3 above.

1.9. Automated Beam Alignment Capability Requirement

1.9.1. Automated Electron Beam Alignment Capability Requirement

1.9.1.1. The instrument shall be capable of performing automated or guided ‘Power User’ level electron beam alignment (source centering and tilt, stigmation, focus) for all or subset of available beam voltages and currents.

1.9.2. Automated Ion Beam Alignment Capability Requirement

1.9.2.1. The instrument shall be capable of performing automated or guided ‘Power

User’ level ion beam alignment (basic electron beam and ion beam alignment, stigmation, focus) for all or subset of available beam voltages and currents.

1.9.3. [Automated Beam Alignment Capability Documentation Requirement

1.9.3.1. The Vendor shall provide detailed descriptions of the automated electron and ion beam alignment routines that are available to a ‘Power User’. If the routines are not fully automated, the Vendor shall state what part of the alignment routine must be manually performed in the response.]

1.10. Transmission Electron Microscopy (TEM) Sample Preparation Capability Requirements

1.10.1. TEM Sample Preparation Capability Requirement

1.10.1.1. It shall be possible to prepare TEM samples with the system.

1.10.1.2. The system shall include any special sample holder or hardware that are needed for TEM sample preparation.

1.10.1.3. If available, the system shall include any additional software packages needed for automated or guided TEM sample preparation.

1.10.1.4. [The Vendor shall state whether the system can automatically prepare multiple TEM samples without manual intervention. If some parts of the TEM sample preparation process are automated, the Vendor shall provide sufficient information to determine which steps are automated and which steps require manual operations.]

1.11. Atom Probe Tomography (APT) Sample Preparation Capability Requirements

1.11.1. APT Sample Preparation Capability Requirement

1.11.1.1. It shall be possible to prepare APT samples with the system.

1.11.1.2. The system shall include any special sample holder or hardware that are needed for APT sample preparation.

1.11.1.3. If available, the system shall include any additional software packages needed for automated or guided APT sample preparation.

1.11.1.4. [The Vendor shall state whether the system can automatically prepare multiple

APT samples without manual intervention. If some parts of the APT sample preparation process are automated, the Vendor shall provide sufficient information to determine which steps are automated and which steps require manual operations.]

1.12. Large Area Imaging Capability Requirements

1.12.1. Large Area Imaging Capability Requirement

1.12.1.1. It shall be possible to automatically image an area much larger than a typical field of view using image stitching. [The procedure for accessing this feature from the main instrument computer control shall be described in the response.

The capabilities and limitations of the large area imaging software shall be described in the response.]

1.13. Custom Scripting Capability Requirements

1.13.1. Custom Scripting Capability Requirement

1.13.1.1. The interface to the instrument shall allow scripts or custom control programs to be written to automate complex, multi-step tasks that may require data-driven decisions during execution. It shall be possible for THE BUYER personnel to develop and/or modify these procedures or scripts which address the basic instrument control software.

1.13.2. [Custom Scripting Documentation Requirement

1.13.2.1. The Vendor shall provide descriptions of all available scripting packages in the response.]

1.14. Load-lock Capability Requirement

1.14.1. Load-lock Capability Requirement

1.14.1.1. The system shall have a load-lock for faster sample exchange.

1.14.1.2. The system shall include sample shuttles and holders used with the load-lock.

1.14.2. [Load-lock Documentation Requirement

1.14.2.1. The Vendor shall describe the load-lock mechanism (manual rod operation or motorized) in the response.

1.14.2.2. The Vendor shall provide detailed description of the load-lock including the sample exchange time through the load-lock and any compatibility issues with other components in the response.]

1.15. Uninterruptible Power Supply (UPS) Requirements

1.15.1. UPS General Design Requirement

1.15.1.1. The response shall include an uninterruptible power supply for the instrument capable of protecting the instrument and all accessories, computers, auxiliary equipment, water chillers, vacuum pumps, compressors, and other attachments from power failures, power surges, power sags, brownouts, and line noise. [The capabilities and limitations of the offered UPS shall be included in the response.]

1.15.2. UPS Runtime Requirement

1.15.2.1. No minimum capacity in kVA for the UPS is specified, but the UPS shall be capable of fully operating the instrument and other attachments specified in section 1.15.1.1 for a minimum of fifteen (15) minutes without externally supplied electrical power. Switching to battery power from mains supply shall occur smoothly enough to prevent any disruption to instrument operation.

Likewise, switching from battery power back to mains power after restoration of external power shall occur smoothly enough not to prevent resumption of instrument operation.

1.15.3. Automatic Instrument Standby Requirement

1.15.3.1. In the event of a power failure, the UPS will be capable of triggering an orderly shutdown of the instrument to a safe, standby condition that maintains the vacuum integrity of the chamber and guns. This will occur under computer control and without operator intervention. This shall not occur in the event of power sags, power surges, power dips, or other power fluctuations that constitute a loss of electrical power for periods shorter than five (5) seconds.

The maximum runtime of the system in operating mode and in standby mode shall be documented in the response. [The maximum uptime of the UPS with no load shall be described in the response.]

1.15.4. UPS Overcapacity Requirement

1.15.4.1. The UPS shall be capable of supporting a load equal to or greater than 150 % of the load of the instrument and other attachments specified in section 1.15.1.1 above to allow additional instrumentation and external options to be powered with the instrument at a later date. [Maximum runtime while overloaded in this manner shall be documented in the response.]

1.16. Computer Security Requirements

1.16.1. Data Storage and Processing Computer (Data Computer) Security Requirement

1.16.1.1. Data computer shall be capable of connecting to a LAN and joining an MS Windows Active Directory.

1.16.1.2. Data computer and Vendor supplied software on this computer shall operate properly when antivirus software is installed and operational.

1.16.1.3. Data computer and Vendor supplied software on this computer shall operate properly when a password protected screen saver is enabled.

1.16.1.4. Data computer and Vendor supplied software on this computer shall function properly in all aspects under standard user login and shall not require administrative privileges to function properly as long as said standard logins are in a ‘Power User’ defined list.

1.16.1.5. The Vendor shall guarantee the proper operation of the software on the data computer for the life of the operating system (OS) (end-of-life for the OS being defined as the time when the OS is no longer supported by its manufacturer), including the application of all patches and security updates issued by the OS manufacturer.

1.16.1.6. Any software updates and upgrades to the software supplied by the Vendor that address critical computer security issues shall be provided, free of charge by the Vendor, for a period of 5 years after the acceptance of the system.

1.17. [Consumables Documentation Requirement for Informational Purposes Only

1.17.1. Consumables Documentation Requirement

1.17.1.1. The Vendor shall provide a list of all components that are considered consumables along with the typical lifetime of these components.

1.17.1.2. The Vendor shall provide information on components that are expected to be replaced at the same time.

1.17.2. Consumables Price Quote Requirement

1.17.2.1. The Vendor shall provide price quotes for the listed consumable components.]

[Line Item 000101 DATA SUBMITTAL: Specialty Sample Holder Requirements Description: Submittal will be used for Government information purposes and will not be included in award.

CLIN Type: Information Only Quantity: 1

A. Technical Specifications

1.1. Specialty Sample Holder Documentation Requirement

1.1.1. A detailed description of available specialty sample holders (e.g. atom probe sample holder, TEM sample holder) shall be included in the response.

1.2. Specialty Sample Holder Quote Requirement

1.2.1. A price quote for each available specialty sample holder shall be included in the response.]

[Line Item 000102: DATA SUBMITTAL Accessory Documentation Requirements Description: Submittal will be used for Government information purposes and will not be included in award.

CLIN Type: Information Only Quantity: 1

A. Technical Specifications

1.1. Accessory Availability and Capability Descriptions Requirement

1.1.1. The response shall include a description of the function of instrument accessories that may be purchased, including but not limited to optical microscopes, charge neutralization system, active magnetic field cancellation systems, residual gas analysis system, and any other attachment or optional system not specifically addressed in this document. For each system, the capabilities and limitations of the system shall be described in detail.

1.2. Accessory Quotes Requirement

1.2.1. A price quote for each available accessory shall be included in the response.]

Line Item 0002: (OPTION) Rocking Stage Requirements

Quantity: 1 A. Technical Specifications

1.1. Rocking Stage Requirement

1.1.1. The instrument shall be capable of operating with a rocking stage where sample orientation can be switched back and forth during ion milling to minimize curtaining artifact.

1.1.2. The Vendor shall include any software and hardware components that are needed to use the rocking stage.

1.2. [Rocking Stage Documentation Requirement

1.2.1. The description of a rocking stage shall be included in the response.]

Line Item 0003: (OPTION) Insertable CompuStage Requirements Quantity: 1

A. Technical Specifications

1.1. Insertable CompuStage Requirement

1.1.1. The instrument shall be capable of operating with a specialized insertable compustage where sample orientation can be switched from an ion milling position to multiple electron imaging orientations rapidly.

1.2. [Insertable CompuStage Documentation Requirement

1.2.1. The description of the insertable compustage shall be included in the response.]

Line Item 0004: (OPTION) X-ray Energy-Dispersive Spectrometry (XEDS) System Requirements Quantity: 1

A. Technical Specifications

1.1. XEDS System Capability Requirement

1.1.1. The instrument shall be capable of operating with at least one type of integrated XEDS system for the chemical analysis of samples using electron-induced x-ray fluorescence. The compatible XEDS systems shall be integrated into the operation of the instrument so that the user may acquire spectrum images (complete spectra at each X,Y position in a digital image) as well as perform point analyses at the areas of interest.

1.1.2. The XEDS system shall include a Silicon Drift Detector (SDD) with sensor area of 80 mm2 or greater, pulse processor, and system computer.

1.1.3. The XEDS system shall include motorized slide mechanism, ultra-thin polymer window, passive cooling (no fans or liquid recirculation or cryo cooling).

1.1.4. The XEDS system shall have a system computer with a supported Windows operating system, adequate storage hard drive, sufficient internal memory, LCD monitor, Microsoft Office and all OS, vendor software, and 3rd party software media for reinstallation if necessary.

1.1.5. The XEDS system shall be capable of operating at the multibeam working distance, in spot, line, and map modes and include basic data acquisition, storage, and analysis capabilities such as spectrum and spectrum image acquisition, electron image acquisition, drift control, auto and manual peak ID, background subtraction, quantitation and data export.

1.1.6. The XEDS system shall be capable of operating at the instrument multi-beam working distance.

1.1.7. The XEDS system shall be capable of performing 3D EDS mapping where the

EDS mapping is interleaved with serial milling and imaging steps.

1.1.8. The XEDS system shall be capable of large area mapping.

1.1.9. The XEDS system shall be capable of drift correction.

1.1.10. The XEDS system shall be capable of Mn Ka resolution of 129 eV or better.

1.2. XEDS System Compatibility Requirement

1.2.1. The XEDS system quoted for the Ga+ FIB shall have the same analysis software as the XEDS system quoted for the PFIB.

1.3. [XEDS System Documentation Requirement

1.3.1. The basic capabilities of each XEDS system shall be described in the response.

The degree of integration of the XEDS and other instrument capability and analytical systems such as 3D analysis software shall also be described in the response.]

Line Item 0005: (OPTION) Offline License for XEDS Software Requirements Description:

Quantity: 1

A. Technical Specifications

1.1. Offline License for XEDS Software Requirement

1.1.1. The Vendor shall provide at least one offline user license for the XEDS software that can be run on an offline workstation and requires a license key.

1.2. [Offline License for XEDS Software Price Quote Requirement

1.2.1. The Vendor shall provide a per user or per seat license price quote for an offline user license.]

Line Item 0006: (OPTION) Direct Electron Detector Capability Requirements CLIN Type: Information Only Quantity: 1

A. Technical Specifications

1.1. Direct Electron Detector Capability Requirement

1.1.1. The instrument shall be equipped with a dedicated direct electron detector for performing transmission diffraction imaging.

1.2. [Direct Electron Detector Documentation Requirement

1.2.1. The description of the direct electron detector shall be included in the response. If the inclusion of the detector will alter the performance specifications of the instrument, these alterations shall be documented.]

Line Item 0007: (OPTION) Automated Serial Sectioning and Imaging Capability Requirement Quantity: 1

A. Technical Specifications

1.1. Automated Serial Sectioning and Imaging Capability Requirement

1.1.1. It shall be possible to automatically perform serial sectioning of the sample, iteratively removing planes of sample material to reveal progressively deeper features in the sample sequentially. [The procedure for accessing this feature from the main instrument computer control shall be described in the response. The capabilities and limitations of the automatic serial sectioning software shall be described in the response.]

1.1.2. Any special sample holders or accessories necessary to perform automated serial section and imaging shall be included.

Line Item 0008: (OPTION) Automated 3D EDS Analysis Software Capability Requirement

A. Technical Specifications

1.1. Automated 3D EDS Analysis Software Requirement

1.1.1. It shall be possible to automatically perform 3D analysis of the sample by features in the sample sequentially and performing EDS mapping.

Line Item 0009: (OPTION) Nano-prototyping Capability Requirement

A. Technical Specifications

1.1. Nano-prototyping Software Requirement

1.1.1. It shall be possible to perform nanoscale prototyping with the instrument.

1.2. Nano-prototyping Hardware Requirement

1.2.1. If any hardware requirement such as fast beam blanker exists to perform nanoscale prototyping, these hardware capabilities shall be included in the response.

Line Item 0010: (OPTION) CAD Navigation Software Capability Requirement

A. Technical Specifications

1.1. CAD Navigation Software Requirement

1.1.1. A CAD navigation software shall be included in the response. [The procedure for accessing this feature from the main instrument computer control shall be described in the response. The capabilities and limitations of the CAD navigation software shall be described in the response.]

Line Item 0011: (OPTION) Peltier Stage Requirements

A. Technical Specifications

1.1. Peltier Stage System Requirement

1.1.1. The instrument shall be capable of operating with a Peltier stage system with a temperature range of -25 C to 100 C or better (larger temperature range is preferred). The Peltier stage system shall include all necessary hardware including the controller for the stage temperature control.

1.2. [Peltier Stage Documentation Requirement

1.2.1. The description of the Peltier stage shall be included in the response. If the inclusion of the Peltier stage will alter the performance specifications of the

Line Item 0012: (OPTION) Charge Neutralizer Requirements

A. Technical Specifications

1.1. Charge Neutralizer Requirement

1.1.1. The instrument shall be equipped with a charge neutralizer or electron flood gun for processing insulating materials.

1.2. [Charge Neutralizer Documentation Requirement

1.2.1. A detailed description of the compatible charge neutralizer including the rate of gas flow, size of the nozzle, control mechanism shall be included in the response.]

Line Item 0013: (OPTION) Plasma Cleaner Requirements Quantity: 1

A. Technical Specifications

1.1. Plasma Cleaner Requirement

1.1.1. The instrument shall be equipped with an integrated or removable in-chamber plasma cleaner system for chamber decontamination.

1.1.2. The in-chamber plasma cleaner system shall be capable of automated sample cleaning function.

1.2. [Plasma Cleaner Documentation Requirement

1.2.1. A detailed description of the compatible plasma cleaner including the mounting mechanism and control mechanism shall be included in the response.]

Line Item 0014: (OPTION) In situ Argon Ion Milling Capability Requirements Quantity: 1

A. Technical Specifications

1.1. In situ Argon Ion Milling Capability Requirement

1.1.1. Argon ion milling system shall be capable of performing in situ low energy cleaning of sample surfaces without removing the sample from the FIB SEM instrument chamber.

1.2. [In situ Argon Ion Milling System Documentation Requirement

1.2.1. A detailed description of the in situ Argon ion milling system shall be included in the system.]

Line Item 0015: (OPTION) Trade-in Requirements Quantity: 1

A. Technical Specifications

1.1. System Decommissioning Requirement

1.1.1. NIST will trade-in the existing FIB SEM instrument (TFS Helios NanoLab 660 with Elstar XHR immersion lens FESEM column and Tomahawk ion column, S/N 992008). The Vendor shall provide the decommissioning service for the existing FIB SEM system.

1.1.2. The Vendor shall package and ship the decommissioned system.

1.1.3. The Vendor shall coordinate with NIST to schedule the decommissioning of the current system ahead of the installation of the new FIB SEM system.

1.1.4. The Vendor shall provide any requirements for the decommissioning service at least two weeks prior to the service visit.

Line Item 1001: (OPTION 1) Warranty, Gallium ion (Ga+) source focused ion beam scanning electron microscope (FIB SEM) system Quantity: 1

A. Technical Specifications

1.1. 12-Month Warranty. YEAR 1 following end of the initial warranty period described in

Section XI. Warranty shall be available from the Vendor, covering all components including those produced by subcontractors. Warranty shall include routine maintenance visits for cleaning and adjustment of components, and 48-hour response time for service of inoperable equipment. [The Vendor shall furnish with the Response Package a description of the provisions of such a standard warranty. A guaranteed lifetime for the emitter and the time required for replacement shall both be indicated. A guaranteed lifetime for the ion source and the time required for replacement shall both be indicated as well.]

Line Item 2001: (OPTION 2) Warranty, Gallium ion (Ga+) source focused ion beam

Quantity: 1

1.1. 12-Month Warranty: YEAR 2 following end of Line Item 1001.

Line Item 3001: (OPTION 3) Warranty, Gallium ion (Ga+) source focused ion beam

Quantity: 1

1.1. 12-Month Warranty: YEAR 3 following end of Line Item 2001.

Line Item 4001: (OPTION 4) Warranty, Gallium ion (Ga+) source focused ion beam

Quantity: 1

1.1. 12-Month Warranty: YEAR 4 following end of Line Item 3001.

Line Item 0016: XENON (Xe) PLASMA FIB SEM Description: Plasma source focused ion beam scanning electron microscope (PFIB SEM) Quantity: 1

A. Technical Specifications

1.1. Ion Beam Requirements

1.1.1. Ion Source General Design Requirement

1.1.1.1. The instrument shall be equipped with a Xenon (Xe) plasma ion source. The system shall include provisions to bring the ion source to the operating condition automatically, including any temperature and voltage ramping, conditioning, or other preparations required for stable emission.

1.1.1.2. Typical ion source lifetime shall be included in the response.

1.1.1.3. [If available, the Vendor shall state ion species other than Xe that can be used in the instrument in the response.

1.1.1.4. If other ion species in addition to Xe are included in the response, the Vendor shall provide the switching time between species, switching method (physical swap, software control, etc.), and expected lifetime of each ion species in the response.]

1.1.2. Ion Beam Voltage Range Requirement

1.1.2.1. The ion column shall operate at accelerating voltages of 30 kV or higher, and

500 V or lower.

1.1.3. Ion Beam Current Range Requirement

1.1.3.1. The ion column shall be capable of delivering to the sample a beam current of 2 uA or higher and 2 pA or lower. The full ion current range and current density of the instrument shall be described in the response, along with a description of the methods used to change the ion current (e.g., apertures only, apertures and discrete spot size settings, apertures and continuous spot size adjustment.). [If the probe current is limited to a finite set of discrete values and not continuously variable, this shall be noted and the finite values enumerated or described.]

1.1.4. Ion Beam Aperture Requirement

1.1.4.1. The ion column shall be equipped with a motor-driven, computer-controlled aperture.

1.1.5. Ion Beam Fast Blanker Requirement

1.1.5.1. The ion column shall be equipped with a fast beam blanker.

1.1.6. Ion Beam Detector Requirement

1.1.6.1. The instrument shall be equipped with ion and electron detectors and ion beam scan coils for ion imaging. [The number, nature, and details of all available electron and ion detectors usable for ion beam imaging shall be described in the response.]

1.1.7. Ion Beam Image Acquisition Size Requirement

1.1.7.1. The ion beam imaging system shall be capable of acquiring digital images measuring 1024 pixels by 768 pixels or larger. The system shall be able to save or archive these images in TIFF format, or similar lossless, open image file format.

1.1.8. Ion Beam Image Acquisition Performance Requirement

1.1.8.1. The ion beam imaging system shall be capable of acquiring digital images at magnifications of 300 X or lower and 100 kX or higher.

1.1.8.2. The ion beam imaging system shall be capable of rotating the ion beam raster in a 360 degree continuous fashion, and shall have a function to reset this rotation to 0 degrees.

1.1.8.3. The instrument shall be capable of an electronic ion beam image shift of at least 15 micrometers.

1.1.9. Ion Beam Ultimate Spatial Resolution Requirement

1.1.9.1. The ultimate spatial resolution of the ion beam imaging system shall be stated at ion beam voltages of 30 kV, 5 kV, 1 kV, and 500 V. [The method used (statistical or selective edge) to determine the spatial resolution shall be included in the response.]

1.1.10. Ion Beam Multibeam Working Distance (WD) Spatial Resolution Requirement

1.1.10.1. The multibeam WD spatial resolution of the ion beam imaging system shall be stated at ion beam voltages of 30 kV, 5 kV, 1 kV, and 500 V. This is the ion beam imaging resolution with the sample at a position where the electron beam and the ion beam are coincident. [The method used (statistical or selective edge) to determine the spatial resolution shall be included in the response.

1.1.10.2. The Vendor shall state the maximum horizontal field of view of ion beam imaging at multibeam WD.]

1.2. Electron Beam Requirements

1.2.1. Electron Gun General Design Requirements

1.2.1.1. Electron gun shall be a field emission source of the Schottky emitter type to allow high brightness for high spatial resolution imaging, high current for electron backscatter analysis and chemical characterization, and good current stability over time.

1.2.1.2. The electron source shall be field replaceable.

1.2.1.3. The system shall include provisions to bring the electron source to the operating condition automatically, including any temperature and voltage ramping, conditioning, or other preparations required for stable emission.

1.2.2. Electron Beam Voltage Range Requirements

1.2.2.1. The electron column shall operate at accelerating voltages of 30 kV or higher and 500 V or lower. [The full voltage range of the column shall be described in the response.

1.2.2.2. The Vendor shall also describe any unusual design features used to accelerate or decelerate the electrons, such as combined acceleration anodes and sample bias. If the energy of the electrons leaving the final lens is not the electron landing energy, this shall be noted, and a detailed description of the mechanism provided.]

1.2.3. Electron Beam Deceleration or Similar Capability Requirement

1.2.3.1. The instrument shall be capable of electron beam deceleration or similar capability for high resolution imaging of non-conductive samples while maintaining the beam brightness.

1.2.3.2. [The range of landing energies, the description of the mechanism (e.g., stage bias) to control the landing energy shall be included in the response.]

1.2.4. Electron Beam Blanker Requirement

1.2.4.1. The electron column shall be equipped with a fast electron beam blanker.

1.2.5. Electron Beam Current Range Requirement

1.2.5.1. The electron column shall be capable of delivering to the sample a beam current of at least 80 nA.

1.2.5.2. The instrument shall be equipped with both beam current and specimen current measurement equipment, and the outputs from these measurements shall be available to scripts, external users, and accessories such as an XEDS analysis system.

1.2.6. Electron Beam Aperture Requirement

1.2.6.1. The electron column shall be equipped with a motor-driven, computer-controlled aperture.

1.2.6.2. The instrument shall be equipped with an image wobbler to aid in aperture centering and aberration correction.

1.2.7. Electron Detector Requirements

1.2.7.1. The electron column shall be equipped with in-column secondary electron and backscattered electron detectors. [The number, nature, and details of all available electron detectors will be described in the response.]

1.2.7.2. The instrument shall be equipped with at least one secondary electron detector that is side-mounted or chamber mounted (e.g., Everhart-Thornley detector).

1.2.8. Dedicated Backscatter Electron Detector Requirements

1.2.8.1. The instrument shall be equipped with a dedicated backscatter electron (BSE) detector. [Detailed description of the detector such as the detector type and whether it is a retractable or permanent mount type, shall be stated in the response.]

1.2.9. Dedicated Scanning Transmission Electron (STEM) Detector Requirements

1.2.9.1. The instrument shall be equipped with a dedicated STEM detector that is capable of bright field and dark field STEM imaging. [Detailed description of the detector such as the detector imaging resolution, type (multi-segment, annular, etc.), and whether it is a retractable or permanent mount type, shall be stated in the response.]

1.2.10. Electron Beam Image Auto-Alignment Software Requirement

1.2.10.1. The electron column shall be equipped with automatic alignment features such as auto-focus, auto-stigmate, and automatic adjustment of brightness and contrast.

1.2.11. Electron Beam Image Acquisition Size Requirement

1.2.11.1. The electron imaging system shall be capable of acquiring digital images measuring 4096 pixels by 3072 pixels or larger. The system shall be able to save or archive these images in TIFF format, or similar lossless, open image file format. The bit depth of these images shall be 8 bits or deeper.

1.2.11.2. The electron imaging system shall be capable of simultaneously acquiring images from multiple detectors, e.g., simultaneous acquisition of SE image from the E-T detector and BSE image from an in-column detector.

1.2.11.3. The electron imaging system shall be capable of mixing signals from multiple detectors and displaying the mixed signal images.

1.2.12. Electron Beam Image Acquisition Performance Requirement

1.2.12.1. The electron imaging system shall be capable of acquiring digital images at magnifications of 100 X or lower and 700 kX or higher. The magnification shall be continuously adjustable within the full range and shall be automatically corrected for changes in working distance and accelerating voltage.

1.2.12.2. The electron imaging system shall be capable of rotating the electron beam raster in a 360 degree continuous fashion, and shall have a function to reset this rotation to 0 degrees.

1.2.12.3. The instrument shall be capable of an electronic electron image shift of at least 15 micrometers.

1.2.12.4. The instrument shall have drift correction capability.

1.2.12.5. The instrument shall be capable of both live-frame and frame-store acquisitions, and shall have a waveform monitor for adjusting contrast, brightness, and other image acquisition parameters.

1.2.12.6. The instrument shall be capable of reduced raster, spot mode, and line scan modes.

1.2.12.7. The instrument shall have dynamic focus capability to compensate for stage tilt.

1.2.13. Electron Beam External Scan Control Requirement

1.2.13.1. The instrument shall allow the electron beam to be controlled by an external scan source such as an EDS system.

1.2.14. Electron Beam Ultimate Spatial Resolution Requirement

1.2.14.1. The ultimate spatial resolution of the scanning electron microscope column shall be stated at electron beam landing energies of 30 keV, 15 keV, 1 keV, and 500 eV. [The electron detector type, whether beam deceleration was used, and the method used (statistical or selective edge) to determine the spatial resolution shall be included in the response.]

1.2.15. Electron Beam Multibeam Working Distance (WD) Spatial Resolution Requirement

1.2.15.1. The multibeam WD spatial resolution of the scanning electron microscope

(SEM) column shall be stated at electron beam landing energies of 15 keV and 1 keV. This is the SEM resolution with the sample at the position where electron beam and the ion beam are coincident. [Electron beam current, imaging detector, working distance used for each resolution values shall be included in the response.]

1.3. Vacuum System Requirements

1.3.1. Oil-Free Vacuum Systems Requirement

1.3.1.1. Oil-free pumping system shall be used on the instrument.

1.3.2. Maximum Pumping Time to Operation Requirement

1.3.2.1. After venting the system for sample exchange, the system shall require no longer than five (5) minutes to pump down to operating pressure.

1.4. Specimen Chamber Requirements

1.4.1. Stage Navigation Camera Requirements

1.4.1.1. The chamber shall be equipped with at least one in-chamber camera with IR illuminator for sample navigation and stage viewing. [The description of the camera such as the camera type, camera position, and viewing angle shall be stated in the response.]

1.4.2. Sample Holder Requirement

1.4.2.1. The system shall include single stub sample holder and multiple stub sample holder.

1.4.2.2. The system shall include at least one type of TEM grid holders.

1.4.3. [Accessory Ports Documentation Requirement

1.4.3.1. The detailed size and locations of all accessory ports shall be included in the response.]

1.5. Gas Injection System (GIS) Requirements

1.5.1. Number of Gas Injection Systems Requirement

1.5.1.1. The instrument…