Appendix B SOW.docx.docx

CENTER FOR NANOSCALE MATERIALS

CONTACT ALIGNER

Statement of Work Oct 22, 2024 Suzanne Miller

1. Introduction and Background:

The Center for Nanoscale Materials is seeking to purchase a mask aligner that can be used for both front side and front to back alignment capable of exposing pieces up to a 200 mm substrate. It should be user friendly and give outstanding process results. The tool will be replacing an older contact aligner and needs to fit into the same space and require the same facilities. The new tool also needs to be upgradable with a nanoimprint and wafer bonder alignment option if funds become available for future upgrades. Credit for tool trade in for our older contact aligner MA6/BA6.

2 Scope of Work/Technical specifications:

The new aligner must be flexible and able to handle a wide variety of samples. It should be able to perform front side exposures and front to back exposures. All types of materials; metals, semiconductors and insulators are expected to be processed.

2.1 Space & Utilities

The new tool needs to fit into a space. 4ft x 3ft; monitor swing out 2.5 ft.

Utilities: Compressed Air (CDA): 70-120PSI Nitrogen: 29-70psi Vacuum:<80Kpa Electrical: 200-240VAC, 60Hz Exhaust: The new tool can’t require exhaust as it is not set up in the cleanroom space.

2.2 General Description of tool requirements

The contact aligner should be able to handle multiple samples sizes from 10x10mm to a 200 mm wafer. The thickness of the samples can be a maximum of 6 mm with one chuck capable of 9 mm thick sample. This will include multiple chucks and the appropriate mask holders. It should be configured for front side and front to back side alignment. It should have LED optics (H, G and I line) It should have state of the art microlens optical arrays for optics.

The control of the entire system shall be through a computer. The control software shall be very flexible and user-friendly to allow users the best possible control over the system. Data logging of all important parameters is preferred, to aid in fault analysis.

2.3 Specific Requirements

2.3.1 Installed base: Vendors shall document their ability to provide the described system and shall provide a list of recent buyers with installed systems for evaluation by CNM.

2.3.2 Basic configuration: housing equipped with motorized alignment stage with automatic wedge compensation system in contact or without contact between mask and wafer

· alignment gap programmable from 1 to 100 micron,

· automatic wedge compensation system in contact or without contact between mask and wafer (with reference balls), alignment gap programmable from1 to 1000 micron, resolution 1 micron

· movement range mask aligner mode: X +/-5.0mm, Y +/-5.0mm, Theta +/-5°

· movement range bond aligner mode: X +/-3.0mm, Y +/-3.0mm, Theta +/-3° + reset movement to ZERO position after each exposure basic equipment consisting of:

· one joystick X/Y- and THETA for alignment stage control.

· Protection of mask and wafer when in contact by locking the motors to prevent stage movement.

· TSA/BSA face-to-face microscope stage with motorized X-Y-manipulator

· TSA/BSA face-to-face microscope stage with motorized X-Y-manipulator + manual loading and unloading of wafer, single substrates or substrate stack +

· PLC control with LCD display, WINDOWS GUI + for wafer 1" up to200 mm diameter and substrates 2"x2" up to 8"x8" for lithography application +

· for wafer 3" up to 200 mm diameter for bond application

· machine base frame made of aluminum profile

· operator manual on CD or thumb drive (preferred)

· Safety labelling in English

· prepared for BSA microscopes

· UPS, Uninterruptible Power Supply

· Able to perform in Constant Dose exposure mode

2.3.3 Adaptable for future purchase of a wafer-to-wafer bond or nanoimprint options.

2.3.4 ALIGNMENT SYSTEM TSA/BSA: face-to-face alignment system for mounting of TSA and/or BSA microscopes

2.3.5 TSA-D including adaptor for optical fibre, cube for mounting of objective + 2x digital camera incl. Optical fibre, white LED with yellow filter, power supply and cables + for Lithography applications only

2.3.6 MICROSCOPE RAIL BSA Rail to be equipped with BSA microscope + for standard applications up to 200mm substrate size+ max travel y: -21 / +23 mm

2.3.7 SINGLE OBJECTIVE 5X/0.15 + Working distance 20mm:

2.3.8 OFFSET OBJECTIVE 7.2X/0.15 WITH AN OFFSET OF 16.7MM; Working distance 17mm Caution: movement only in the area of the mask holder opening due to low working distance

2.3.9 EXPOSURE UNIT LED LH UV400 micro-lens plates optics, Lamp house with LED arrays of I-line, G-H-line ; Power Consumption 450W

2.3.10 Microlens plate Exposure Optics UV400/W-200 LED LH

· Front lens, dia. 230mm

· For maximum exposure area 200mm diameter

· Surface mirror

· Microlens plate Integrator for highest uniformity and source decoupling:

· Fourier lens

· Set of illumination aperture plates to define the illumination angular spectrum

· Internal Light Sensor for Constant Dose Mode

· Uses 2X MicroLens Optical arrays for better homogenization of light. Light Uniformity:

· +/-2.5% over the 200mm diameter exposure area. No maintenance, no adjustments required.

2.3.11 Full Wafer MASK HOLDERS: All mask holders should be compatible with Contact/proximity wedge-error-compensation exposure programs. They should also have the ability to mechanically clamp as a backup for vacuum clamping.

· For masks 2.5“ or 4“ + Exposure opening for wafers dia. 2" With stop pins

· For masks from 3,5“x3,5“to 5“x5“ + Exposure opening for wafers dia. 3“ + With displaceable stop pins

· For masks from 5“x5“ to 6“x6“ . Exposure opening for wafers dia. 100mm + With displaceable stop pins

· For masks 7“x7“ . Exposure opening for wafers dia. 150mm + With stop pins

· For masks 9“x9“ with a mask thickness from 3mm to 6.5mm + Exposure opening for wafers dia. 200mm + With stop pins

2.3.12 Chucks to be included;

· 2” to Piece chuck: GLASS/S-10X10/W-2/2VA/SPEC - for substrates 10x10mm and 2" diameter - with 2 switchable vacuum areas - for soft, hard and vacuum contact exposures in combination with mask holder for contact processes.

· 200 mm wafer chuck: For proximity and soft contact exposures in combination with mask holder for proximity/contact processes: For soft contact exposures in combination with mask holder for contact processes with 2 openings for front to back alignment.

· 3” wafer chuck: For proximity, soft - and vacuum contact exposures in combination with mask holder for proximity/contact processes. For soft - and vacuum contact exposures in combination with mask holder for contact processes with 2 openings for front to back alignment. With prealigner pins

· 100mm wafer chuck: For proximity, soft - and vacuum contact exposures in combination with mask holder for proximity/contact processes + For soft- and vacuum contact exposures in combination with mask holder for contact and proximity processes + With 2 openings for front to back alignment. With prealigner pins

· 150mm wafer chuck: For proximity, soft - and vacuum contact exposures in combination with mask holder for proximity/contact processes + For soft - and vacuum contact exposures in combination with mask holder for contact processes + With 2 openings for viewing for front to back alignment. With prealigner pins for flat length 57.5mm

2.3.13 Test Masks: The Vendor will supply test mask for both front side and front to back alignment.

· Front side Mask: quartz mask. 9”x9”

· Minimum CD (guaranteed): 1.0 μm, CD tolerance: 0.1μm

· Minimum CD (best effort) 0.6 μ

· Line / space resolution test patterns with CD's ranging from 1 (0.6) to 100μm

· Scales for analyzing first print accuracy

· Verniers for easy overlay analysis

2.3.14 UV light measuring probe 365/405nm for UV optometer

2.3.15 Constant Dose option

2.3.16 Antivibration Table

· Dimension: 894mm x 1056mm

· Pneumatic vibration isolation and automatic height control +

· Vertical frequency of resonance: smaller than 2Hz at rated load

· Horizontal frequency of resonance: smaller than 1,8Hz at rated load

· Improved horizontal damping

· Vertical adjustment stands

· Suitable for cleanroom class 100

2.3.17 Auto Align software: The tool should be able to do both manual and auto align.

· Direct Mask alignment to include

· Z axis goes up to exposure gap

· Machine checks if the target has shifted or not.

· If alignment is out of set limit, alignment is automatically repeated.

2.4 Documentation

Vendor shall supply layout drawings, system manuals for hardware and software, user manuals for hardware and software, training documentation.

3.0 Shipping and Installation

Shipment DDP according to INCOTERMS 2020

The contractor shall be responsible for installation of the Contact aligner system. Placement of the equipment at the job site shall be the responsibility of Argonne. Argonne shall be responsible for providing the basic facilities necessary for the contractor to complete the installation.

4.0 Training

The training curriculum shall cover at a minimum: operation of all hardware and software components; faults and alarms; and routine maintenance procedures to be performed by CNM personnel.