Acceptance.docx

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CENTER FOR NANOSCALE MATERIALS CONTACT ALIGNER
Solicitation number
5-B175-Q-00113-00
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This document appears to be an acceptance checklist for a contact aligner to be installed at the Center for Nanoscale Materials. The key details are:

The contact aligner must meet specific performance criteria, including +/-2.5% light uniformity, demonstration of I-line and G-H-line wavelength capability, and proper functioning of the mask holders and chucks. Resolution testing on a 200mm wafer with 10mm edge exclusion must achieve 3 microns +/- 10%. The acceptance testing will be performed after the aligner is fully installed in the cleanroom.

The related federal contract opportunity is for Argonne National Laboratory to source one (1) contact aligner. The solicitation number is 5-B175-Q-00113-00, and responses are due by 11/20/2024, 5:00 PM CST. All questions will be accepted until 11/15/2024, 3:00 PM CST. The required documents include an executed ANL-70 Request for Quotation, proposal lead time, and country of origin for each item.

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Other files

File Type Posted
Addendum 0001.doc DOC document
Appendix A-71COM-13-FEB-2023.PDF PDF
ANL-70 Request for Quotation.doc DOC document
ANL-366M (on-site mod risk)-01-OCT-2024.PDF PDF
ANL-70B Reps and Certs.pdf PDF
Appendix D8C-12-DEC-2023.PDF PDF
Appendix B SOW.docx.docx DOCX document

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CENTER FOR NANOSCALE MATERIALS

CONTACT ALIGNER

Acceptance Oct 22, 2024 Suzanne Miller

1. Acceptance:

The tool shall be tested after the aligner is fully installed in the cleanroom.

Light Uniformity:

· +/-2.5% over the 200mm diameter exposure area. No maintenance, no adjustments required.

· Demonstration of I-line, G-H-line

· Verify constant intensity for each wave length.

Mask Holders

· Demonstrate all mask holders work and clamp a mask both with vacuum and without vacuum (mechanical clamping).

Chucks

· 200mm chuck: Demonstrate it works with proximity and soft contact as well as back side alignments. Resolution testing is done on a 1.3µ positive Shipley S1813 resist on soft contact.

· Resolution 3µ +/- 10% across a 200mm wafers with a 10mm edge exclusion: Front side exposure

· Top side alignment Accuracy(overlay) <1 µ

· Bottom side alignment Accuracy(overlay) < 1 µ

· 3”, 100mm and 150 mm chuck: Resolution testing is done on a 1.3µ positive Shipley S1813 resist on vacuum contact.

· Demonstrate they work with proximity, soft, hard, and vacuum contact.

· Resolution: .8 : +/- 10% across the wafer with a 5mm edge exclusion

· Top side alignment Accuracy(overlay) <0.5 µ

· Bottom side alignment Accuracy(overlay) < 1 µ

· 2” to Piece chuck: GLASS/S-10X10/W-2/2VA/SPEC - for substrates 10x10mm and 2" diameter - with 2 switchable vacuum areas - Resolution testing is done on a 1.3µ positive Shipley S1813 resist on vacuum contact with a 2 inch wafer.

· Demonstrate they work with proximity, soft, hard, and vacuum contact for a 2” substrate.

· Demonstrate they work with a 10x10mm piece for soft and hard contact

· Resolution: .8 : +/- 10% across the wafer with a 5mm edge exclusion

· Top side alignment Accuracy(overlay) <0.5 µ

· Bottom side alignment Accuracy(overlay) < 1 µ

· Auto Align software: The tool should be able to do both manual and auto align.

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