Q&As 3.pdf
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- Attached to
- High Uniformity Sputter Deposition System Federal contract opportunity
- Solicitation number
- 80GSFC20Q0004
About this file
This document is a solicitation for a high uniformity sputter deposition system. Key details include that NASA/GSFC requires a system for sputter depositing thin metal films with stringent requirements on film thickness uniformity and substrate cleanliness. The base pressure must be 3e-7 Torr or lower. Evaluation criteria in descending order of importance are technical capability to meet requirements, price, and past performance on similar federal contracts. Quotes are due by March 11, 2020 and shall be emailed to the specified contracting officer. All questions must be submitted in writing by February 17, 2020.
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Other files for this federal contract opportunity
| File | Type | Posted |
|---|---|---|
| Q and As 4.pdf | ||
| Updated SOW High Uniformity Sputter Deposition Tool.pdf | ||
| Q&As 2.pdf | ||
| Q&As.pdf | ||
| SOW High Uniformity Sputter Deposition Tool.pdf |
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Text version
QUESTION 28: Our typical base pressure in our standard sputter system will be 7 x 10-7 Torr
(pumping based on dry pumps and TMP). Is this base pressure sufficient for your process? We typically sputter all metals like Nb, Mo, Ti, Al, Au, Ag for our application with such a base pressure.
ANSWER 28: In accordance with the SOW, the requirement for the base pressure is 3e-7.
File details come from the government source that posted it. Updated .