Amendment 0004 - Questions & Responses.pdf

CMM Submitted Questions and Responses Clutter Map Memory

SIR 693KA7-18-R-0010

Amendment 0004

Q No. Reference Vendor Comment Amendment Response

Attachment J-1 Clutter Map

Memory CCA Control Signals, Section 2.3.2.5.2.1.2.1.2.4.5 Error

Register: (Page 2-219 PDF page

48)

This critical section is truncated, although figure 11-24 is provided, Page 2-220 should be include to complete the Error Register definition

Page 2-220 is provided. See page 9 of the revised

Attachment J-1.

Attachment J-2: Engineering

Drawings and Part List: (PDF Page

51)

The Engineering drawings do not include any mechanical dimensions.

Are the original board gerbers, or other engineering resources available to accurately place the connector and extraction components for the board?

Original Gerber files are not available. However, see revised attachment J-2 which incorporates Drawing

ID21062 & parts list (pages 203-210).

Attachment J-22: Engineering

Drawings and Part List:

(PDF Pages 53-54):

Components 645A670H02, 138C909H03, and 581R848H02 have been identified as critical for Form/Fit/Function equivalent. These parts seem to not be available on the open market or have extensive lead times. Are there known sources available for these critical connectors/extractors, and guide pins?

It is the Offerors responsibility to source the required parts or identify Form-Fit-Function equivalents. P/N

6454670H02 may be available through Amphenol Corp.

The Government does not have information for known suppliers of P/Ns 138C909H03 and 581R848H02. The preceeding information does not represent an endorsement of the suppliers noted or availablity of parts.

Attachment J-1, J-3, J-4 Missing

Timing requirements

There are several timing diagrams, but none have the timing requirements associated with them, like setup/hold requirements of the various signals. Do these exists, or will these have to be reverse engineered from the existing board?

The Government does not have the timing diagrams. The

Government requires the Offeror to reverse engineer the timing diagrams from the existing boards.

Part I Section C Page 5 (PDF Page

7) 5-C Environmental

Specifies 0-50 C operation conditions. The original components appear to be primarily mil spec (-55 C to 125C) components. Are industrial temp components (-40 C to 85C) acceptable for the redesign?

Yes, see revised Section C, Page 5, Development Test Plan and Procedures, Paragraph 5c)

6 General Electronic Design

The original design used 55 memory components arranged in 5 banks to create the 320 Kbits of Clutter Memory. Current technology allows a signal chip to be used for the on board memory. The original design also had all components socked to be field replaceable. Is it acceptable to minimize the design components with modern surface mount memories and have them directly soldered to the PCB?

Yes.

7 Error Detect and Correct Logic:

The original design has 1 bit correct 2 bit detect. Using more check bits, 2 bit correct, 3 bit detect is possible. Should this logic be improved where possible?

Yes.

8 General Technical Question Are there any ROHS (or Lead Solder) requirements for this design? No.

9 Test Stand Will the FAA provide a test stand that will operate the FFF redesigned

Clutter Memory CCA board?

No. The Offeror is required per the Statement of Work to provide the test stand in accordance with Section C 9.0, Test Equipment (CLIN 0006) (FFP)

9a If no:

Will FAA provide the detailed timing diagrams for all system signals?

• Clock frequency tolerance/jitter

• Setup/Hold time for signals

• Rise/Fall time tolerance

• Noise tolerance

Reference Government response to Vendor Comment #4

U9 (5962-8760201XX or

585R644H02) – Error Detection &

Correction

Will FAA provide datasheet for this part? Datasheet 585R644 is provided. See pages 10 through 50 of the revised Attachment J-2.

10a

U9 (5962-8760201XX or

585R644H02) – Error Detection &

Correction

Does FAA have any detailed engineering timing or data on this circuit?

Reference Government response to Vendor Comment #4

11 General Technical Question

Will FAA provide detailed drawings of the PCB?

• Board outline dimensions with tolerances

• Board cutout dimensions and tolerances

• Board thickness dimension and tolerances

• Board material requirements

Reference Government response to Vendor Comment #2

Amendment 0004

Q No. Reference Vendor Comment Amendment Response

12 General Technical Question

Will FAA provide datasheets for the following Identifying Part

Numbers?

a. 138C909H03

b. MS51923-157

c. 153C638H01

d. 645A670H02

e. 581R848H02

f. 635A866H04

g. M38510/30001BCX

h. M38510/30003BCX

i. 645A544H01

j. 635A861H01

k. M38510/32403BRX

l. M38510/30702BEX

m. M38510/07005BCX

n. M38510/32503BRX

o. M39510/30109BEX

p. M38510/31004BCX

q. M38510/07001BCX

r. M38510/07106BEX

s. M38510/07003BCX

The Government is only able to provide the below data sheets, incorporated into the revised Attachment J-2:

a. 138C909 page 51-52

C. 153C638 page 53-55

d. 645A670 page 56-76

e. 581R848 page 77-112

f. 635A866 pages 113-157

i. 645A544 pages 158-181

j. 635A861 pages 182-202

13 General Technical Question It appears the bid for this board is to replicate a design from 1985 -

1993. Do I understand the goal here correctly?

The Government requires the offeror to develop a Form-

Fit-Function equivalent. The offeror may replicate the existing design at their discretion, but satisfying the terms of the Statement of Work.

14 General Technical Question

I’d like to request the Gerber files and any drawings for the bare boards, as well as the bill of materials and any drawings for the assembly please for this RFP

Gerber files are not available. Please see revised

Attachment J-2 for available drawings and datasheets.

15 General Technical Question For schematic and PCB layouts, can we provide source files in OrCAD and Cadence Allegro instead of Altium?

No. Files must be submitted using Altium format. See revised Section C, page 4, as amended.

Section C (Statement of Work),

4.0 Prototype Units (CLIN 0002)

(FFP), page 5 of 11; 5.0, Pre-

Production Units (CLIN 0003)

(FFP), page 7 of 11; 6.0 First

Article Units (CLIN 0004) FFP, page

9 of 11; and 7.0 Production Units

(CLIN 0005) FFP, page 10 of 11.

Will you accept the schematics and PCB design files in other than the

Altium Designer format, for example, OrCAD Capture and OrCAD PCB

Editor?

Reference Government response to Vendor Comment #15

17 Section 5.1

"For each CMM CCA, electrical continuity & isolation PCB must be performed." Does this requirement refer to the blank unassembled

PCB, or the final soldered CCA (which, based on our experience, does not make sense)?

The Government requires electrical continuity and isolation for the blank unassembled PCBs. See revised

Section C, Section 5.1, as amended.

18 Section 9.0 What level of test is required for the test equipment (logic function only, power consumption, I/O levels, timing measurements?, etc.)

The level of testing required is predicated on the Offerors proposed solution.

19 Section 9.0

Some of the testing (if required) will necessitate the integration of off-the-shelf 3rd party test equipment. In that case, do we bid the test equipment as fully integrated, or allow FAA to purchase the equipment separately from the proprietary portion of the test equipment?

Offerors are to propose the test equipment as fully integrated.

20 Section 12.0 Is the Government furnished CCA in functional order? Yes.

21 General Technical Question

Missing documents that would be helpful. Are these available?

a. Dwg. No. 647A001 "Test spec" (important but not critical)

b. Dwg. No. 138C909H03 "Extractor" F/N 011 (important but not critical)

c. Dwg. No. 153C638H01 "Stiffener" F/N 013 (important but not critical)

d. Dwg. No. 645A670H02 "Connector P1" F/N 014 (critical)

The Government has included the following drawings as part of Attachment J, as specified herein:

a. Dwg. No. 647A001 "Test spec" - see revised J-1 pages 10 through 13

For the following drawings, reference Government response to Vendor Comment #12:

b. Dwg. No. 138C909H03 "Extractor" F/N 011,

c. Dwg. No. 153C638H01 "Stiffener" F/N 013,

d. Dwg. No. 645A670H02 "Connector P1" F/N 014.

22 General Technical Question

There is an edge connector on the opposite end of the CCA from P1.

We assume that this is where Test Points (in schematic) are terminated, for testing or debugging using an older test set-up. Are we required to be compatible with these connection points for testing or debugging using legacy testers or procedures also?

Yes, the connection points must be compatiable with legacy testers and procedures for testing and debugging.

Amendment 0004

Q No. Reference Vendor Comment Amendment Response

23 General Technical Question

For the memory in the CCA, we intend to use Static RAM (SRAM), not

DRAM as used in the legacy design. Are the error checking / correction functions required for the new SRAM design, if we can demonstrate with analysis and calculations that the error rate of the

SRAM approach without error detection or correction will have a lower error rate than the error-corrected DRAM? Alternatively, we can implement the error detection and correction functions with the

SRAM, and keep that functionality identical to the legacy design, but it would be moot and wasteful of manpower and logic gates.

Use of SRAM is acceptable.

24 SIR Evaluation Question What are the criteria for selecting the contractor for awarding this contract?

The FAA will perform evaluations based on the Offeror’s response to the SIR and in accordance with the evaluation factors for award as described in Part 4 - Section M. The

Offeror must clearly address each factor identified in SIR

Section M

It appears as though there are other cards in this system and we wanted to find out if you are seeking replacements for any of those as well.

No. The Government is only soliciting a solution for the

CMM CCA.

Part 4, Section L, L.18, page 11 of

Should the text be “Volume III Price Proposal”?

Yes. Additionally, Section L.17 should be changed from

"Volume III Past Peformance" to "Volume II Past

Performance". See revised Section L.

Part 1, Section C, SOW 6.0 CLIN

0004 First Article Units

CLIN 0004 First Article Units, FFP has a delivery date of “within 90 days” while Section F.2 has CLIN 0004 as “120 days”. Which delivery date is correct?

The delivery schedule for CLIN 0004, First Article units, is

90 days after Government approval of pre-production units. See revised Section F.2.

Part 1, Section F.2, CLIN 0007, Optional Production Units

It appears the word “Exercised” is missing from the statement, “No later than ten (10) days from the date of delivery of final production unit. Section C, SOW 10.0, appears correct and has the following text

“…and may exercise this option within ten (10) days from the date of delivery of the final production unit”.

CLIN 0007 is subject to AMS Clause 3.2.4-33 Option to

Increase Quantity - Separately Priced Line Item (Apr 1996).

See revised Section F.2 CLIN 0007 which states, "Delivery of optional units shall continue at the same rate that like items are called for under the contract, if the option is exercised."

Part 1, Section C, SOW Section

2.0, page 3 of 11. List of Applicable

Documents, Item 5: 3.3.1.4.7

Conformal Coating of Printed

Circuit Boards

The referenced section in Attachment J-5, FAA-G-2100H, makes it unclear if the vendor is required to conformal coat the new CMM

CAA or not. Please clarify.

Conformal coating is not required. If the offeror chooses to utilize components that are moisture-sensitive, then the offeror must apply applicable portions of FAA-G-2100H

Part 1, Section C, SOW Section

2.0, page 3 of 11. List of Applicable

Documents, Item 5: 3.3.1.4.8

Electromagnetic Shielding.

The referenced section in Attachment J-5, FAA-G-2100H, references another FAA document, FAA-STD-020. We do not have this document and the guidance to this section is not clear. Please clarify.

FAA-STD-020b is provided at Attachment J-6

31 Part 1, Section C, SOW listed within each CLIN deliverables is a reference to the schematic package Altium. Sometime the reference is “e.g., Altium” and sometimes it is referenced without the “e.g.”. Is the vendor permitted to use ORCAD for schematic capture development in this project, and not Altium?

Reference Government response to Vendor Comment #15

Attachment J, document TI

6310.26, page 2-214, Section

2.3.2.5.2.1.2.1.2.3 Memory Map

Controls.

How is the memory partitioned in banks? How big are the partitions?

Would it be possible for the FAA to provide a complete memory map of the CMM CCA?

The Government does not have this specific data available.

The Government cannot provide a complete CMM CCA memory map.

33 Attachment J, CCM CCA Are there additional Input/Output timing diagrams available? No.

Attachment J, document TI

6310.26, Figure 11-24, Target and two-level weather detector signal flow diagram (Sheet 2)

Are there any additional I/O signals for the CMM, other than power and Test Points, not shown in the diagram? Additionally, is there relevant information in (Sheet 1) which is not currently in the SIR package?

No additional data is available.

Attachment J, document TI

6310.38, Figure 11-48 Clutter map schematic diagram (Sheet 22 –

END)

What are the current limitations on the input +5V power, per connector pin? Note: this may not be an issue for today’s electronic components, but wanted to verify this point with the FAA.

Additionally, does the FAA have any data on the ripple level associated with the +5V power?

The Government requirement is 3 amps per pin.

36 General Technical Question

The legacy CCM CCA has a large bank of Test Points. Does the vendor have to replicate these Test Points as part of Fit, Form and Function?

Or is the vendor permitted to develop a new test point scheme. Note, any new design will have a different circuit implementation and different Test Points.

Reference Government response to Vendor Comment #22

Attachment J, J3, page 2-446, Section 2.43.7

Can the vendor implement any Memory ECC logic the meets the criteria of section 2.43.7? If the FAA requires the current EEC method to be used, can the associated data be provided?

The Offeror may implement any Memory EEC that meets the criteria of Section 2.43.7. The Government does not require the Offeror to use the current EEC method. The

Offeror may choose the current EEC method at its discretion.

Amendment 0004

Q No. Reference Vendor Comment Amendment Response

38 General Question Deliverable dates described in days, are those work days or does that include weekends/holidays?

Days mean calendar days, which includes weekends and holidays.

39 General Technical Question Are there any known sources for the connector? Reference Government response to Vendor Comment #3

40 General Technical Question Are there air flow requirements for cooling?

The Government does not have an air flow requirement for the CMM CCA

41 General Technical Question Will the Government provide sample of the CCA for the awarded contractor for analysis and comparison during the design?

Yes. See Section C, Statement of Work (SOW) Paragraph

12.0 Government Furnished Equipment

42 General Technical Question

The SIR includes a parts list for the Card components. IT lists JAN/MIL

MFR part no for the Connector (P1) on page 8-280 as P/N

645A670H2. This is the design company internal part number. The

SIR includes a datasheet for the next part on the list (635A866H04) which is a memory IC. Could you provide additional datasheet for the connector or provide source control drawing info that might point to possible vendor data for the P1 connector?

Reference Government response to Vendor Comment #12

43 General Technical Question We take the existing boards and re-work them and provide a 1-2 year warranty. Would this be something your division would consider?

No. The Government requirement does not encompass reworking the existing boards.

44 General Question Can you please let [us know] the last time this CCA was manufactured for the FAA?

Approximately 1993

45 General Question Has the FAA, prior to this solicitation hitting the street, received any prototypes or redesign writeups for this Clutter Map Memory CCA?

No.

46 General Question [AMS Clause] 3.10.4-13 says that formal third party ISO 9001 registration is not required. However, Section L.16 seems to say that it is required. Can you clarify?

The Offeror must provide a current Proof of Quality

Assurance Certificate applicable to ISO 9001.2008 held by the firm that will perform the manufacturing effort. See revised Section L.16 and revised Section E Clause 3.10.4-

13.

47 General Question

Under L.16, is the certificate only required for the parties that will engage in the manufacturing? Since we farm that work out to companies that are ISO 9001 certified, would be be eligible for the contract award?

Reference Government response to Vendor Comment #46

48 General Question

Is the Government requiring certification for only the manufacturing component (during CLIN 0003 and 0004) of the team or is the design/test engineers component of the team required to be certified as well?

Reference Government response to Vendor Comment #46

49 General Question [Would the FAA consider] engaging in a PCB Reverse Engineering process to obtain an exact replica of the existing CCA that will interface with the remaining components of the system?

Reference Government response to Vendor Comment #13