5_205-4411_05924_NULL_NULL_0001_NULL_NULL_0001_441_U_N_Y_N_N_Y_D.PDF

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Attached to
FA8212-25-Q-0005 F-16 Circuit Card Assembly
Solicitation number
FA8212-25-Q-0005
Issued by

About this file

This file contains technical drawings and assembly specifications for a circuit card assembly (CCA) backplane, including PCB fabrication Gerber files, copper layer specifications, and detailed assembly instructions. The drawings show component placement, staking requirements, and assembly notes for an ADTU (Air Defense Terminal Unit) backplane circuit board manufactured by Space Dynamics Laboratory at Utah State University Research Foundation under contract HQ0147-11-D-0052-0028.

The assembly requires IPC J-STD-001 Class 3 specifications and includes specific encapsulation requirements using Arathane/Urethane mixtures for various connectors and components. Key technical requirements include press-fit connectors P1-P4, precise spacing requirements for connectors P6 (.025") and P7 (.035"), and detailed staking instructions for multiple components. The document contains export-controlled technical data subject to Arms Export Control Act restrictions and is authorized for DoD and DoD contractors only. While this technical drawing package appears related to the F-16 Circuit Card Assembly solicitation FA8212-25-Q-0005, it represents an existing design rather than new procurement requirements.

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DATA FILES:

- PCB FABRICATION GERBER FILES

- FAB PAGE

- PCB COPPER LAYERS 1 - 12

- SOLDER MASK TOP AND BOTTOM

- SILKSCREEN TOP AND BOTTOM

- ASSEMBLY PAGES

CIRCUIT CARD ASSY,

ADTU BACKPLANE

98747

HQ0147-11-D-0052-0028

05924

- - INITIAL RELEASE-

DESIGN ACTIVITY

TRANSFER TO CAGE

CODE 98747

April 20, 2015

NEXT ASSY. TITLE

NEXT ASSEMBLY

PROGRAM

ENGINEER

LAST MODIFIED

SCH REVDRAWING NUMBER

INSTANCE NAME

SCHEMATIC NAME

TITLE

Form Number QF0442 Rev - (B Landscape)

A

B

C

D

SPACE DYNAMICS LABORATORY

UTAH STATE UNIVERSITY RESEARCH FOUNDATION

North Logan, Utah 84341

OF

A

B

C

D

PAGE NAME

REVISIONS

REV DESCRIPTION RELEASED DATE APPROVED

APPROVALS DATE

Current Design Activity

CONTRACT NUMBER

CAGE CODE

DISTRIBUTION STATEMENT D: Distribution authorized to DoD and DoD Contractors only:

critical technology;

AFLCMC/WWMPA 6137 Wardleigh Rd, Bldg 1515, Hill AFB UT 84056-5843.

WARNING: This document contains technical data whose export is restricted by the Arms

Export Control Act (Title 22, U.S.C., 2751, et seq) or the Export Administration Act of 1979, as amended,Title50,U.S.C.,App.2401 et seq. Violations of these export laws are subject to severe criminal penalties. Disseminate in accordance with provisions of DoD Directive 5230.25.

DESTRUCTION NOTICE: For unclassified, limited documents, destroy by any method that will prevent disclosure of contents or reconstruction of the document.

ZONE

Other requests for this document must be referred to

04/20/2015 1 1

Schematic1

205-4411T. Jeppesen

205-4410

ADTE

DATA PACKAGE, ADTU BACKPLANE

T.JEPPESEN

B.CARLSEN

T.MIKESELL

R.SHAFFER

D.CLAWSON

2015-04-14

2015-04-17

2015-04-14

2015-04-14

2015-04-20

B.CARLSEN 2015-04-20

ASSY TOP

Assemble per IPC J-STD-001 Class 3 Electronic Assembly specifications.

ASSEMBLY NOTES:

T. MIKESELL

ADTE

-205-441112-18-2013

205-4410

PCB ASSY, ATDU

BACKPLANE

Form Number QF0419 Rev A

PROGRAM

NEXT ASSEMBLY

LAST MODIFIED

NEXT ASSY TITLE

TITLELAYER

A

PWB REVDRAWING NUMBER

4 3

DD

C

C

BB

A

North Logan, Utah 84341

UTAH STATE UNIVERSITY RESEARCH FOUNDATION

SPACE DYNAMICS LABORATORY

DESIGNER

A B

Z

C D E F

A B

Z

C D E F

SPACE DYNAMICS LAB/USURF

ADTE

BACKPLANE

CAGE CODE:

DATE CODE:

PANEL/BOARD S/N:

GND

PWB P/N:205-4411-1 REV:-

205-4411-2 ASSY S/N:

A B

Z

C D E F

1 22

A B

Z

C D E F

1 22

1 11 15 25

1 11 15 25

T3_CHASSIS

T1_MHL

T2_GND

AC_BAC_A

J1

P4

P2

P3

P1

P6

P7

Encapsulate pins and components highlighted in blue (SH 4) using the following mixture:

1) Arathane/Urethane 5753 LV-A or equivalent (6 grams)

2) Arathane/Urethane 5753 LV-B or equivalent (30 grams)

3) Cab-O-Sil, M-5 or equivalent (0.7 grams)

a. Apply staking mixture to the base of connectors outlined in blue (SH 3 & 4). See detail view for P6 and P7 (SH 3).

b. Apply staking mixture to the metallic surface of PCB highlighted in green. (See SH 3 detail view).

Encapsulate pins highlighted in red using the mixture below (SH 3 & 4). Apply using a mold to meet the indicated dimensions and ensure a minimum coverage of .020” above the pins so that leads will not protrude through the encapsulation.

1) Arathane/Urethane 5753 LV-A or equivalent (6 grams)

2) Arathane/Urethane 5753 LV-B or equivalent (30 grams)

3) Cab-O-Sil, M-5 or equivalent (2.1 grams)

Encapsulate J1 fasteners with MIL-A-46146 silicone rubber.

3 Inspect per IPC-A-610 Class 3 Acceptability for Electronic Assemblies.

When installing P6:

a. There shall be a .025” (-.005", +.010") spacing between connector body and PCB

(SH 2).

b. The leads shall protrude though the board and be trimmed prior to soldering so that a solder fillet will be discernable (SH 2).

When installing P7:

a. There shall be a .035” (-.005", +.010") spacing between connector body and PCB

(SH 2).

b. The leads shall protrude though the board and be trimmed prior to soldering so that a solder fillet will be discernable (SH 2).

Install press-fit connectors P1, P2, P3, and P4 per manufacturer specifications.1

J1

PCB

Washer, #4

Washer, #4

PHMS, #4‐40 UNC x ½”, Phillips, Locking

Nut, Hex # 4‐40 UNC

J1 Hardware Details

4 Key connectors J1, P1, P3, and P9 as shown.

Nut, Hex #2‐56 UNC

DATA PACKAGE, ADTU BACKPLANE

ASSY BOT

T. MIKESELL

ADTE

-205-441112-18-2013

205-4410

PCB ASSY, ATDU

BACKPLANE

Form Number QF0419 Rev A

PROGRAM

NEXT ASSEMBLY

LAST MODIFIED

NEXT ASSY TITLE

TITLELAYER

A

PWB REVDRAWING NUMBER

4 3

DD

CC

BB

A

North Logan, Utah 84341

UTAH STATE UNIVERSITY RESEARCH FOUNDATION

SPACE DYNAMICS LABORATORY

DESIGNER

C12

C9

C

C

C2

R1 R2 R3 R4

R7

R5 R6

R8

C8 C7 C6

C

C

C

C10C11C

C5

C

C3C4 C1

R10R9

C

P9

5b

6b

P6 & P7 Details

PCB

5a,6a

STAKING TOP

ADTE

-205-441112-18-2013

205-4410

PCB ASSY, ATDU

BACKPLANE

Form Number QF0419 Rev A

PROGRAM

NEXT ASSEMBLY

LAST MODIFIED

NEXT ASSY TITLE

TITLELAYER

A

PWB REVDRAWING NUMBER

4 3

DD

CC

BB

A

North Logan, Utah 84341

UTAH STATE UNIVERSITY RESEARCH FOUNDATION

SPACE DYNAMICS LABORATORY

DESIGNER

A

B

Z

C

D

E

F

A

B

Z

C

D

E

F

SPACE DYNAMICS LAB/USURF

ADTE

BACKPLANE

CAGE CODE:

DATE CODE:

PANEL/BOARD S/N:

GND

PWB P/N:205-4411-1 REV:-

205-4411-2 ASSY S/N:

A

B

Z

C

D

E

F

1 22

A

B

Z

C

D

E

F

1 22

1 11 15 25

1 11 15 25

T3_CHASSIS

T1_MHL

T2_GND

AC_BAC_A

J1

P4

P2

P3

P1

P6

P7

7a

7a

7a

3.50"

0.250"

7b

P6 & P7 Details

Stake Around Base of Connectors P6 and P7

Apply staking to metallic surface of PCB below P7

PCB

7a 7b

ADTE

-205-441112-18-2013

205-4410

PCB ASSY, ATDU

BACKPLANE

Form Number QF0419 Rev A

PROGRAM

NEXT ASSEMBLY

LAST MODIFIED

NEXT ASSY TITLE

TITLELAYER

A

PWB REVDRAWING NUMBER

4 3

DD

CC

BB

A

North Logan, Utah 84341

UTAH STATE UNIVERSITY RESEARCH FOUNDATION

SPACE DYNAMICS LABORATORY

DESIGNER

C12

C9

C

C

C2

R1

R2

R3

R4

R7

R5

R6

R8

C8 C7 C6

C

C

C

C10C11C

C5

C

C3C4 C1

R10R9

C

P9

7a

X 3

0.875"

0.875"

3.025"

0.375"

STAKING BOT DATA PACKAGE, ADTU BACKPLANE

205-4411-_CoverProj222222
Schematic1 Sheet 1 (1)
205-4411-_3
205-4411-_CoverProj
Schematic1 Sheet 1 (1)
205-4411-_3
205-4411-_gerbers
205-4411-_ASSY_DWG
Top Assy�
Bottom Assy�
Top staking �
Bottom staking�

File details come from the government source that posted it. Updated .