Summary

This is a Bill of Materials (BOM) for PCB Assembly Service Solicitation 471674, detailing all components required for the IO-1750-1F printed circuit board assembly. The BOM specifies 1,350 boards as the baseline requirement with a 0.03 to 0.1 spare rate depending on component type, resulting in total quantities ranging from approximately 1,418 to 357,210 units across different component categories. Components include capacitors (primarily ceramic and tantalum in various capacitance values from 0.01uF to 680uF), resistors (ranging from 0 ohms to 10 megaohms), inductors, ferrite beads, connectors (USB-C, LEMO, Molex, Samtec, TE Connectivity, and others), integrated circuits (analog and digital from manufacturers including Texas Instruments, Analog Devices, Microchip, and others), oscillators, LEDs, diodes, fuses, switches, and a Xilinx FPGA (XCZU6CGFFVB1156). Key suppliers identified include Yageo, Samsung Electro-Mechanics, KYOCERA AVX, Murata Electronics, KEMET, and numerous specialized component manufacturers.

The assembly includes high-pin-count components such as 16 MAX3801UTG processors, multiple LTC series analog-to-digital converters, and various signal processing ICs. Notable items include a bare PCB board (IO-1750-1F) and front panel assembly supplied by BNL, with the complete bill of materials provided by BNL as per the labor-only assembly arrangement. The document references Phase 1 (30 units), Phase 2 (520 units for FD-VD), and Phase 3 (800 units for FD-HD), indicating this is a multi-phase production effort with increasing volumes across qualification and production phases.