454244 - Statement of Work_10-23-2024.pdf
PDF 142 KB Posted
- Attached to
- GaAs Sensors
- Solicitation number
- 454244
- Issued by
-
Department of Energy Office of Science
About this file
This document is a Request for Quotation (RFQ) for the fabrication of GaAs Sensors. The Contractor is required to fabricate 384 strip and 128x128 pixel array sensors in GaAs wafer, with specific requirements on the strip sensor dimensions and pixel array size. The RFQ is being issued by Brookhaven Science Associates, LLC (BSA), the operator of Brookhaven National Laboratory (BNL) under contract with the U.S. Department of Energy (DOE). Interested offerors must submit their quotes by December 2, 2024, and the anticipated material due date is three months after receipt of the signed award. Pricing is to remain firm for 60 days, and offerors must be registered in the System for Award Management (SAM) and provide their Unique Entity ID (UEI) number. Foreign offerors are not required to be registered in SAM but must complete the AMS-Form-050 (Annual Representations & Certifications). The successful offeror will also be required to complete additional forms, such as the ACH Authorization, W-9, and W-8 forms.
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Other files
| File | Type | Posted |
|---|---|---|
| 454244 - Quotation Pricing Sheet.docx | DOCX document | |
| 454244 - W-8 BEN-E Form (Foreign).pdf | ||
| 454244 - W-9 Form (REV 2024).pdf | ||
| 454244 - ACH Authorization Form.pdf | ||
| 454244 - W-8 BEN Form (Foreign).pdf | ||
| 454244 - DRAFT Award.PDF | ||
| 454244 - RFQ Document.pdf |
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Text version
P.O. Box 5000
Upton, NY 11973-5000 managed by Brookhaven Science Associates for the U.S. Department of Energy
Subject: GaAs Strip and Pixel Sensor
Date: October 23, 2024
SCOPE:
The Contractor shall fabricate 384 strip and 128X128 pixel array sensor in GaAs wafer.
REQUIREMENTS:
Brookhaven National Laboratory (BNL) requests the following devices in GaAs wafer (total number of wafers – 2).
1. Each wafer shall contain 3-4 pcs of strip sensor 384 strips, 6mm long, and a pitch of 125 micron (exact number shall be decided based on the available space in a 3-inch wafer).
2. Each wafer shall contain 2 pcs of MMPAD pixel sensors (150 micron pitch and 128x128 pixel array).
3. Wafer shall be diced before shipment to BNL.
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