Silicon Wafer Ball Bonder

NASA's National Aeronautics and Space Administration Shared Services Center (NASA/NSSC) has issued a Special Notice regarding a sole source contract for a Silicon Wafer Ball Bonder. The notice indicates that NASA intends to award this contract to COOK AND WEIL, INC. under FAR 13.106-1(b)(1)(i), having determined that this company is the sole provider of the required equipment. The procurement will utilize NAICS Code 334515 and follow FAR Part 12 and Part 13 procedures for commercial items and services. Performance will be located at NASA Marshall Space Flight Center (MSFC), and the contract is set aside for small businesses. The equipment specifications include an HB05 TPT Manual Wire Bonder with comprehensive bonding capabilities and associated accessories.

The primary objective of this Special Notice is to inform potential contractors of NASA's intent to proceed with a sole source acquisition while providing an opportunity for other qualified vendors to demonstrate their capabilities. Interested organizations must submit their capabilities and qualifications in writing by 4:00 p.m. Central Standard Time on July 15, 2025, with oral communications not being acceptable. The government retains sole discretion to determine whether to conduct a full and open competition based on the responses received. The required equipment includes a gold wire bonder system with wedge and ball bonding capabilities, a Leica Ivesta 3 microscope, adjustable height heater stage, and comprehensive bond starter kit, with delivery expected within 4-6 weeks of contract award. Only small businesses are eligible to participate in this procurement opportunity, and the NASA Clause 1852.215-84 Ombudsman provision applies to this solicitation.