Purchase Order 1333ND26PNB030100
- Not listed
- The Department of Commerce's National Institute of Standards and Technology awarded a $946,837 firm fixed price purchase order to Suss Microtec Inc. of Germany. The contract calls for delivery and installation of a wafer bonder capable of substrates from 10mm to 150mm and a lithography aligner compatible with the bonder and achieving sub-micron resolution. Installation at NIST's Center for Nanoscale Science and Technology user facility is required within 60 days of each delivery, along with...
- The Office of Naval Research awarded a purchase order to Cook and Weil, Inc., a small business, for a semi-automatic thermosonic wire bond system valued at $59,595 on September 27, 2024, under a total small business set-aside. Place of performance is Germany. The procurement includes a semi-automatic thermosonic wire bonder capable of ball, wedge, bump, and ribbon bonding, along with a microscope, heater stage, and accessories. The order is priced firm fixed and was evaluated on a lowest price...
- The U.S. Department of Commerce's National Institute of Standards and Technology (NIST) awarded a firm fixed price purchase order to Set North America, LLC, a manufacturing and service organization, for an automatic die bonder system. The $776,490.00 contract supports NIST's Boulder Micro-Fabrication Facility, which requires the die bonder system to build complex hybrid structures for research in areas like integrated photonics, quantum information, sensors, and microfluidics. The purchase order...
- <p>The Department of Commerce National Institute of Standards and Technology (NIST) awarded a firm-fixed-price purchase order contract to Tresky Corp, a for-profit organization, for a Semi-Automatic Die Bonder Station. The contract has a potential value of $158,565.00 and a completion date of March 22, 2024. The contract does not have a set-aside designation. The award was made on September 15, 2023.</p>
- This federal contract award to Finetech, a for-profit organization based in Mesa, Arizona, is for the purchase of an automated flip-chip die bonder and extended warranty, valued at $643,110.00. The contract was awarded by the National Institute of Standards and Technology (NIST), a civilian agency within the Department of Commerce. The original solicitation, NIST-SS24-CHIPS-0021, sought proposals for an automated flip-chip die bonder capable of precision placement and bonding of silicon dies...
- On August 14, 2025, the National Aeronautics and Space Administration (NASA) Shared Services Center awarded a $68,845 firm fixed-price purchase order to Cook and Weil, Inc., a small business based in Morganville, New Jersey, for the procurement of a TPT semi-automatic heavy wire bonder. The contract, which carries an ultimate completion date of October 9, 2025, was awarded without a set-aside designation, despite originating from a total small business set-aside solicitation. Performance will be...
- The National Institute of Standards and Technology issued a purchase order to JB Technical Support Service LLC for $95,325.50 on October 1, 2025, for preventative maintenance and support services for a Flip Chip 150 die bonder. JB Technical Support Service LLC is a self-certified small disadvantaged business. Performance occurs at Boulder, Colorado, with an ultimate completion date of September 30, 2027. The order carries firm fixed-price pricing and no set-aside designation. Services include...
- The National Institute of Standards and Technology (NIST) awarded a $251,993.25 firm fixed-price purchase order to Semiprobe, Inc. (doing business as Semiprobe LLC) for a commercial semi-automatic probe station on April 2, 2026, with completion targeted for June 29, 2026. This contract carries a Total Small Business set-aside designation and will be performed in Boulder, Colorado. The award originated from a special notice (NIST-SS26-CHIPS-44) that NIST posted on December 9, 2025, indicating its...
- This $290,798.30 firm-fixed-price purchase order was awarded by the National Institute of Standards and Technology (NIST) to Technical Communities, Inc., a small business prime contractor, on September 6, 2024. The contract requires the delivery of two 110 GHz extender heads with low-frequency extension and integrated bias tees, as well as two 110 GHz extender head desktop positioners, all from Keysight. These items are needed to support NIST's CHIPS program and on-wafer measurement capabilities...
- The National Institute of Standards and Technology (NIST) awarded a $210,000 firm fixed-price purchase order to Mycronic Inc. on August 13, 2024, for a flying probe substrate test station with modifications to payment terms. The contract, which carries no set-aside designation, supports NIST's materials science and manufacturing research capabilities by providing specialized testing equipment capable of conducting thousands of test points on 3-inch and 150 mm wafers and diced components....
The National Institute of Standards and Technology issued a purchase order to Hesse Mechatronics, Inc. valued at $168,790 for an automatic wire bonder, awarded June 16, 2026, under total small business set-aside. Place of performance is Germany. The procurement calls for a new, fully automatic commercial-grade ball-wedge wire bonder system capable of bonding 256 consecutive bonds on semiconductor chips using gold wire (0.5 to 1 mil diameter) onto 256-pin ceramic packages, with integrated microscope and LCD inspection capability. The system must meet nine specific technical specifications including ability to bond 50 x 50 micrometer pads with 80 micrometer pitch. Delivery is required to NIST in Gaithersburg, Maryland within 16 weeks of award, with installation and operator training for up to two users within two weeks of installation. Payment is 100 percent upon installation, acceptance, and successful system testing. The order includes a minimum one-year warranty and service contract options. Ultimate completion date is October 16, 2026.
Name | Description | Solicitation Number | FederalAgency | Type | PostedDate |
|---|---|---|---|---|---|
Amendment 1 to Automatic Wire Bonder | 1333ND26QNB030043 | Department of Commerce National Institute of Standards and Technology | Solicitation 1/1 | 3/6/26, 2:01 PM |
Mod # | Description | ReasonForModification | Federal Obligation | Date |
|---|---|---|---|---|
| Not listed | Not listed | $168.8k | 6/15/26 |