Amendment 1 to Automatic Wire Bonder
Closed Solicitation Posted
- Solicitation number
- 1333ND26QNB030043
- Agency
- National Institute of Standards and Technology Department of Commerce
- Responses due
- Set-aside
- Total Small Business
Opportunity facts
- NAICS code
- 333242 Semiconductor Machinery Manufacturing
- PSC
- 6640 Laboratory Equipment And Supplies
- Place of performance
- Gaithersburg, Maryland 20899, United States
- Points of contact
-
- Tracy Retterer tracy.retterer@nist.gov (301) 575-8448
- Elizabeth Timberlake elizabeth.timberlake@nist.gov (301) 975-6002
Notice details come from SAM.gov. Updated .
About this opportunity
The National Institute of Standards and Technology (NIST), a bureau of the Department of Commerce, is soliciting quotations for the procurement of one automatic wire bonder system for its Physical Measurement Laboratory's Memory Device Characterization Platform located in Gaithersburg, Maryland. The wire bonder must be a new, commercial-grade, fully automatic system (except for sample loading) capable of completing 256 consecutive bonds on semiconductor chips with 10 x 10 mm die sizes onto 256-pin, 50 x 50 mm ceramic packages using gold wire ranging from 0.5 to 1 mil diameter with wire lengths up to 8 mm. The system must be ball-wedge type, include an integrated microscope with LCD screen for inspection capabilities, and meet nine specific technical specifications including the ability to bond 50 x 50 micrometer pads with 80 micrometer pitch. Award will be made to the lowest-priced, technically acceptable offeror whose proposed equipment meets or exceeds all minimum requirements outlined in the Statement of Work, with quotations requiring firm-fixed-price proposals organized into three volumes: Technical Quotation, Price Quotation, and Terms and Conditions. Quotations must be submitted electronically by 12:00 PM EST on March 20, 2026, with pre-quote inquiries due no later than two business days after the solicitation issuance date (March 8, 2026), and all offerors must maintain active registration in the System for Award Management (SAM.gov) at submission and throughout contract performance.
This procurement is set aside for total small business concerns under NAICS code 333242 (Semiconductor Machinery Manufacturing) with a size standard of 1,500 employees, and no incumbent contractor information is identified in the solicitation. The contract value is not disclosed in the published materials; however, the solicitation includes two contract line items for the wire bonder unit and transportation/delivery expenses. The system must be delivered within 16 weeks of award to NIST in Gaithersburg, Maryland (100 Bureau Drive, Building 301, Gaithersburg, MD 20899) under F.O.B. Destination terms, with installation required within two weeks of delivery and operator training for up to two users within two weeks of installation. Payment is 100 percent upon installation, acceptance, successful testing, and demonstration of system performance, and the contractor must provide a minimum one-year warranty covering defective parts plus service contract options for routine maintenance and repair. All equipment must be new in original manufacturer packaging with complete documentation, and contractors must comply with cybersecurity and privacy requirements consistent with FISMA, OMB Circular A-130, and NIST SP 800-171, including system security plans, secure configuration management, multi-factor authentication, and encryption standards.
Notice text
2 versions
Update #2 · Latest ·
AMENDMENT 1 TO SOLICITATION 1333ND26QNB030043 Due to Vendor Questions:
Vendor Question 1:
Can you let me know if the parts will be held on flat boats or manually placed on the workholder?
NIST Response:
The samples (chips) need to be wire bonder to a 256-pin ceramic package. This ceramic package needs to be affixed to the stage of the bonder for wire bonding.
Vendor Question 2:
Current Equipment: Are you currently using a manual wire bonder? If so, could you specify the make and model?
NIST Response:
No
Vendor Question 3:
Application: What type of bonding applications do you plan to run with the new wire bonder?
NIST Response:
We are looking to bond a 1 cm2 chip inside a 256-pin double-tiered ceramic package and streamline the process
Vendor Question 4:
Bonding Tools: Are there specific bonding tools or configurations required for your applications?
NIST Response:
You will find this information in the Statement of Work.
Vendor Question 5:
Accessories: Will you need additional items such as a microscope, work holders, or any other accessories?
NIST Response:
The tool should contain a scope for inspection and a way to fix the sample piece to the stage.
As described in the attached Combined Synopsis Solicitation, Statement of Work and Applicable Provisions and Clauses
Update #1 ·
As described in the attached Combined Synopsis Solicitation, Statement of Work and Applicable Provisions and Clauses
Attachments
| File | Type | Posted |
|---|---|---|
| Statement of Work.pdf | ||
| Statement of Work.pdf | ||
| Combined Synopsis Solicitation.docx | DOCX document | |
| CSS Provisions and Clauses.docx | DOCX document |
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