American Semiconductor, Inc.

Boise, ID

UEI
C1BNR9HJBQK8
CAGE
1WGA8
Primary NAICS
334413 Semiconductor and Related Device Manufacturing
SAM.gov registration
Active through

Company facts

Self-certified in SAM.gov
  • For Profit Organization
Entity structure
Corporate Entity (Not Tax Exempt)
SAM.gov registration date
Physical address
6987 W Targee St, Boise, ID 83709, USA
Founded
2001
Employees
11-50
Estimated annual revenue
$1M-$10M
Industry
  1. Information Technology
  2. Semiconductors & Semiconductor Equipment
  3. Semiconductors
SIC code
36 Electronic & Other Electric Equipment
Profiles

Registration and certifications come from SAM.gov and the SBA; company details from public web sources. Updated .

Contract obligations by fiscal year

Fiscal year Obligated
FY2027 To date $0
FY2026 $744,231
FY2025 $940,474

Top agencies by obligations

Rank Agency Obligated, FY2026–FY2027 Share
1 Defense Advanced Research Projects Agency $744,231

Contract awards

Award Agency Obligated Awarded
D2S-0097 ultra-thin conformal electronic system development and characterization 140D0425C0033 Interior Business Center (DO) $1,684,705
Medical research and development contract army sbir phase II proposal no. A2-8272 titled forewarm: FHE microclimate… W81XWH21C0028 Defense Health Agency $1,099,851
Medical research and development contract army 19.1 sbir PH 1 proposal no. A191-058-0310 titled forewarm: FHE… W81XWH19C0166 Medical Command (Army) $162,376
Flexform-ADC development kit NNJ16HH53P Johnson Space Center $3,950
Enabling flexible materials, devices, and processes FA865014C5010 Air Force Research Laboratory (AFMC) $1,349,974

Latest 5 listed here. See the rest on GovTribe.

Grant awards

Award Agency Obligated Awarded
Flex-3D wafer processing for chip stacking and interconnect DESC0009675 Department of Energy $149,978
New phase i 2010 sbir; title: next-generation detector and imager development; PI: richard hayhurst DESC0004479 Department of Energy $1,699,557
International linear collider pixel array vertex detector development FG0208ER85163 Department of Energy $0

SBA capabilities narrative

From the vendor's SBA profile

American Semiconductor serves the semiconductor and related industries as the leading developer and manufacturer of ultra-thin chip technology and manufacturing. The company invented and supplies Semiconductor-on-Polymer (SoP) wafer level chip scale packaging (WLCSP) for thin device applications that include, but are not limited to, chip-on-flex, protected fan-in, heterogeneous integration and multi-chip packaging. The company provides design, assembly, test and custom engineering services for thin-device technology. As an advanced packaging and assembly provider, American Semiconductor enables reliable high efficiency advanced packaging, assembly and test of thin electronics. Headquartered in Boise, Idaho, American Semiconductor operates a 9,000 square foot facility housing WLCSP fabrication, assembly and test operations.

Quick answers

Is American Semiconductor, Inc. registered in SAM.gov?

Yes. American Semiconductor, Inc.'s SAM.gov registration is active through October 22, 2027.

How much has American Semiconductor, Inc. received in federal contracts?

Federal contracts obligated $940,474 to American Semiconductor, Inc. in fiscal year 2025 and $1,684,705 in fiscal years 2023 through 2027.

What is American Semiconductor, Inc.'s most recent federal award?

American Semiconductor, Inc.'s most recent federal contract award is D2S-0097 ultra-thin conformal electronic system development and characterization (140D0425C0033), from Interior Business Center (DO), on June 11, 2025.

On GovTribe

See American Semiconductor, Inc.'s full federal record

  • Federal contract awards
  • Federal grant awards
  • Funding analysis by agency, NAICS and set-aside
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