American Semiconductor, Inc.
Boise, ID
- UEI
- C1BNR9HJBQK8
- CAGE
- 1WGA8
- Primary NAICS
- 334413 Semiconductor and Related Device Manufacturing
- SAM.gov registration
- Active through
Company facts
- Self-certified in SAM.gov
- Entity structure
- Corporate Entity (Not Tax Exempt)
- NAICS codes registered in SAM.gov
- SAM.gov registration date
- Physical address
- 6987 W Targee St, Boise, ID 83709, USA
- Website
- americansemi.com
- Founded
- 2001
- Employees
- 11-50
- Estimated annual revenue
- $1M-$10M
- Industry
-
- Information Technology
- Semiconductors & Semiconductor Equipment
- Semiconductors
- SIC code
- 36 Electronic & Other Electric Equipment
Registration and certifications come from SAM.gov and the SBA; company details from public web sources. Updated .
Recent federal awards
| Award | Agency | Obligated | Awarded |
|---|---|---|---|
| D2S-0097 ultra-thin conformal electronic system development and characterization | Interior Business Center | $1,684,705 | |
| Medical research and development contract army sbir phase II proposal no. A2-8272 titled forewarm: FHE microclimate… | Defense Health Agency | $1,099,851 | |
| Medical research and development contract army 19.1 sbir PH 1 proposal no. A191-058-0310 titled forewarm: FHE… | Medical Command | $162,376 | |
| Flexform-ADC development kit | Johnson Space Center | $3,950 | |
| Enabling flexible materials, devices, and processes | Air Force Research Laboratory | $1,349,974 |
SBA capabilities narrative
American Semiconductor serves the semiconductor and related industries as the leading developer and manufacturer of ultra-thin chip technology and manufacturing. The company invented and supplies Semiconductor-on-Polymer (SoP) wafer level chip scale packaging (WLCSP) for thin device applications that include, but are not limited to, chip-on-flex, protected fan-in, heterogeneous integration and multi-chip packaging. The company provides design, assembly, test and custom engineering services for thin-device technology. As an advanced packaging and assembly provider, American Semiconductor enables reliable high efficiency advanced packaging, assembly and test of thin electronics. Headquartered in Boise, Idaho, American Semiconductor operates a 9,000 square foot facility housing WLCSP fabrication, assembly and test operations.
Quick answers
What is American Semiconductor, Inc.'s UEI?
American Semiconductor, Inc.'s Unique Entity ID (UEI) in SAM.gov is C1BNR9HJBQK8.
What is American Semiconductor, Inc.'s CAGE code?
American Semiconductor, Inc.'s CAGE code is 1WGA8.
What is American Semiconductor, Inc.'s primary NAICS code?
American Semiconductor, Inc.'s primary NAICS code is 334413 (Semiconductor and Related Device Manufacturing).
Where is American Semiconductor, Inc. located?
American Semiconductor, Inc.'s physical address in SAM.gov is 6987 W Targee St, Boise, ID 83709, USA.
Is American Semiconductor, Inc. registered in SAM.gov?
Yes. American Semiconductor, Inc.'s SAM.gov registration is active through November 12, 2026.
What is American Semiconductor, Inc.'s most recent federal award?
American Semiconductor, Inc.'s most recent federal contract award is D2S-0097 ultra-thin conformal electronic system development and characterization (140D0425C0033), from Interior Business Center, on June 11, 2025.
On GovTribe
See American Semiconductor, Inc.'s full federal record
- Federal contract awards
- Federal grant awards
- Subcontracting relationships
- Funding analysis by agency, NAICS and set-aside
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