Flex-3D wafer processing for chip stacking and interconnect
Ended Project Grant Awarded Last action
- Award ID
- DESC0009675
- Recipient
-
American Semiconductor, Inc. UEI C1BNR9HJBQK8
- Awarding agency
-
Department of Energy
- Obligated
- $149,978
Award facts
- Assistance listing
- 81.049 Office of Science Financial Assistance Program
- Completion date
- Originally
- Place of performance
- Boise, ID 83705, USA
Award details come from USAspending.gov.
Transactions
| Action | Obligated | Date |
|---|---|---|
| Amendment | $0 | |
| Original award | $149,978 |
Quick answers
Who received award DESC0009675?
DESC0009675 was awarded to American Semiconductor, Inc. by Department of Energy on February 19, 2013.
How much is award DESC0009675 worth?
$149,978 has been obligated on DESC0009675.
On GovTribe
See this award's full record
- Every transaction and subaward
- The recipient's other awards and teaming partners
- Similar grant awards
- Ask GovTribe AI about this award