Lincoln Park Middle School Technology

Lincoln Park Public Schools is requesting sealed bids for technology renovations and additions at Lincoln Park Middle School under Bid Package T-002, with bids due November 2, 2026 at 2:00 p.m. at the district's central office (1650 Champaign Road, Lincoln Park, Michigan 48146). A mandatory pre-bid conference and building walk-through is scheduled for October 14, 2026 at 3:00 p.m. at the Administration building.

All bids must be accompanied by a sworn and notarized Familial Relationship Disclosure Statement and an Iran Sanctions Affidavit of Compliance; the Board of Education will reject any bid missing the required disclosure statement. Bidding documents have been available for examination since October 12 at Integrated Design Solutions, LLC's office in Troy, Michigan, and electronic specifications may be downloaded from the project website. Bidders are responsible for monitoring the project website for all addenda and requests for information.

The project is funded through the Lincoln Park Public Schools 2026 Technology Bond, with Integrated Design Solutions, LLC serving as the Engineering/Technology Designer. A bid tabulation summary will be made available following the public opening. Additional building walk-throughs may be coordinated directly with the Engineer/Technology Designer.