00 1113.pdf
PDF 24 KB Posted
- Attached to
- Lincoln Park Middle School Technology
- Solicitation number
- RFP LPP 270000000043 1
- Issued by
- Michigan
About this file
This is an Advertisement for Bids issued by Lincoln Park Public Schools for the 2026 Technology Bond project at Lincoln Park Middle School in Lincoln Park, Michigan. The project involves renovations and additions to the middle school facility, with Integrated Design Solutions, LLC serving as the Engineering/Technology Designer. Sealed bids for the work will be received until 2:00 PM local time on November 2, 2026, at Lincoln Park Public Schools' central office located at 1650 Champaign Road, Lincoln Park, Michigan 48146, where all bids will be publicly opened and read aloud. Bidding documents have been available for examination since October 12, 2026, at the offices of Integrated Design Solutions, LLC in Troy, Michigan, and electronic specifications may be downloaded from the project website. A mandatory pre-bid conference and building walk-through is scheduled for October 14, 2026, at 3:00 PM local time at the Administration building, with additional walk-throughs available by coordination with the Engineer/Technology Designer.
All bids must be accompanied by a sworn and notarized Familial Relationship Disclosure Statement and an Iran Sanctions Affidavit of Compliance, with the Board of Education rejecting any bids that do not include the required disclosure statement. Bidders are responsible for checking the project website regularly to obtain all addenda, requests for information, and related documents. A bid tabulation summary will be made available following the public opening. The project is funded through the Lincoln Park Public Schools 2026 Technology Bond and is designated as LPPS Bid Package T-002 with IDS Project No. 26122-1001.
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Text version
Lincoln Park Public Schools LPPS Bid Package T-002 2026 Technology Bond Lincoln Park Middle School-1324-26 Lincoln Park Middle School IDS Project No. 26122-1001 Renovations and Addition Lincoln Park, Michigan 48146
ADVERTISEMENT FOR BIDS
00 1113-1
SECTION 00 1113 - ADVERTISEMENT FOR BIDS
DATE: 10/12/2026
PROJECT: Lincoln Park Public Schools
2026 Technology Bond Lincoln Park Middle School, Renovations and Additions LPPS Bid Package T-002 Lincoln Park Middle School- 1324-26
OWNER: Lincoln Park Public Schools
1650 Champaign Rd
ENGINEERING/
TECHNOLOGY
DESIGNER:
Integrated Design Solutions, LLC Architecture, Engineering, Interiors & Technology 1441 W. Long Lake, Suite 200 Troy, MI 48098
(248) 823-2100
(248) 823-2200 fax
BIDS RECEIVED: Until 2:00 PM local time on 11/2/2026, the Owner will receive sealed Bids for the work as set forth in the Bidding Documents at:
Lincoln Park Public Schools
1650 Champaign Rd
At which time and place all bids will be publicly opened and read aloud. A bid tabulation summary will be available.
The Bidding Documents will be on file on and after October 12, 2026, and may be examined at the following locations during regular business hours, Monday through Friday:
The offices of: Integrated Design Solutions, LLC, 1441 W. Long Lake, Suite 200, Troy, MI 48098, (248) 823-2100
Electronic specifications only may be downloaded from: http://cloud.ids-troy.com/bids/bids/LPPS/BP-T002. Bidders are responsible to check the website from time to time to verify they have all addenda, requests for information and other documents related to the Bid.
The Bid must be accompanied by a sworn and notarized Familial Relationship Disclosure Statement. The Board of Education will not accept a Bid that does not include this sworn and notarized disclosure statement.
All Bids must include an Iran Sanctions Affidavit of Compliance.
A pre-bid conference and walk-thru is scheduled for 10/14/2026 @ 3:00pm local time. Bidders shall meet at the Administration building located at 1650 Champaign Rd, Lincoln Park Mi, 48146.
Additional building walk-thrus, if required, shall be coordinated with the Engineer/Technology Designer.
END OF ADVERTISEMENT FOR BIDS
File details come from the government source that posted it. Updated .