Advanced Oxide Etch Tool

Closed State & local contract opportunity Posted

Solicitation number
ITB-13542
State
Florida
Responses due

Opportunity facts

Jurisdictions
Point of contact

Opportunity details come from vendor.myfloridamarketplace.com. Updated .

About this opportunity

The University of Central Florida (UCF) is soliciting bids for an Advanced Oxide Etch Tool through Invitation to Bid (ITB) 2025-02OC, specifically seeking an Inductively Coupled Plasma etching tool for precision etching of fused silica wafers. The procurement is targeted at acquiring a sophisticated scientific instrument capable of transfer etching analog photoresist profiles into fused silica substrates while maintaining high optical quality at the wafer scale. Detailed technical specifications outline requirements for wafer size, chamber design, power capabilities, gas lines, etch uniformity, and control systems. Bidders must submit electronic proposals via the Bonfire Web Portal by August 28, 2025, at 2:00 PM EST, with bids remaining valid for 120 days after submission. The evaluation criteria will focus on selecting the lowest responsive and responsible bidder, considering factors such as product quality, specification conformity, suitability to university needs, delivery terms, vendor qualifications, and past performance. A pre-bid Zoom meeting is scheduled, and potential bidders must submit any questions by August 14, 2025, at 5:00 PM EST.

The procurement appears to be open to all qualified vendors without specific set-aside designations for disadvantaged enterprises. The contract requires the successful bidder to provide a comprehensive package including the tool, shipping, delivery, installation, training, and a minimum one-year warranty. The system must be new equipment with a delivery date within 6 months of purchase. Vendors must comply with Florida state regulations, provide certificates of good standing, and adhere to university policies regarding background checks, export controls, and public records management. While a specific budget range is not explicitly stated, the complexity and specialized nature of the advanced oxide etch tool suggest a significant investment, likely in the range of several hundred thousand to potentially over a million dollars. The procurement is specific to UCF's needs in Orange County, Orlando, and targets advanced scientific research equipment for high-precision wafer processing.

Opportunity text

The University of Central Florida is soliciting bids for an advanced oxide etch tool for Inductively Coupled Plasma etching of fused silica wafers. Specifically, for the transfer etching of analog photoresist profiles into fused silica substrates without damage for high optical quality elements at the wafer scale. The required specifications are located on the Bid Sheet (pages 13-14).

  • Questions are due August 14, 2025 at 5:00 PM EST
  • Due Date is August 28, 2025 at 2:00 PM EST

Topic: ITB 2025-02OC Opening on 8/28/2025 at 2:00 PM EST

Join Zoom Meeting
https://ucf.zoom.us/j/92945981510?pwd=ciGX2eR6IsKUefKn2UBXE4dzdac0ai.1

Meeting ID: 929 4598 1510
Passcode: 250910

Files

File Type Posted
2025-02OC Advanced Oxide Etch Tool.pdf PDF

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