FY2024 CHIPS R & D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates
Closed Posted
- Opportunity number
- 2024-NIST-CHIPS-NAPMP-01
- Agency
-
National Institute of Standards and Technology
Department of Commerce
- Applications due
- Award size
- Not on record
Opportunity facts
- Assistance listings
- Funding instrument
- Not on record
- Category
-
- Science and Technology and other Research and Development
- Eligible applicants
-
- Other
Opportunity details come from Grants.gov. Updated .
About this opportunity
This Notice of Funding Opportunity from the Department of Commerce National Institute of Standards and Technology seeks applications for new research and development activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials. Applicants may include organizations other than federal agencies for funding support under the CHIPS Research and Development Program. Awards will focus on advancing semiconductor technologies and enhancing U.S. competitiveness through science, technology, and research and development projects. Applications will be evaluated based on their potential to accelerate development and commercial deployment of foundational semiconductor technologies. Applications are due by July 3, 2024.
Funding will focus on accelerating the development of semiconductor technologies through research and development projects involving advanced packaging substrates and substrate materials. Performance on funded projects is expected to take place within the United States to establish domestic capacity in these areas and help make the U.S. semiconductor industry more competitive globally.
Synopsis
The CHIPS Research and Development Program (CHIPS R & D) aims to advance the development of semiconductor technologies and to enhance the competitiveness of the U.S. semiconductor industry. This is the first Notice of Funding Opportunity under this program. It seeks applications for new research and development (R & D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for producing microelectronics systems.
Files
| File | Type | Posted |
|---|---|---|
| CHIPS NAPMP MATERIALS AND SUBSTRATES NOFO.pdf |
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