Wafer Dicing Saw and Water Conditioning/Recycling System

Closed Pre-Solicitation Posted

Solicitation number
FA875123R0008
Agency
Air Force Research Laboratory Air Force Materiel Command, Department of Defense
Responses due
Set-aside
No set-aside

Opportunity facts

NAICS code
333242 Semiconductor Machinery Manufacturing
PSC
3670 Specialized Semiconductor, Microcircuit, And Printed Circuit Board Manufacturing Machinery
Place of performance
Rome, New York 13441, United States

Notice details come from SAM.gov. Updated .

About this opportunity

This notice seeks to procure a semi-automatic wafer dicing saw system and water conditioning/recycling system from Disco Hi-Tec America, Inc. on a sole-source basis. The Department of the Air Force Materiel Command Research Laboratory requires these goods to meet minimum specifications including the ability to dice 300mm wafers, generate and recycle high-purity water, and achieve accuracy of +/- 0.002mm for X-axis and +/- 0.001mm for Z-axis. Responses are due by July 27, 2023 and must provide clear evidence that competition would benefit future procurements. An award is targeted for August 15, 2023.

There is no set-aside designated. The NAICS code is 333242 with a size standard of 1,500 employees. The incumbent and proposed awardee is Disco Hi-Tec America, Inc., located in San Jose, California, as their equipment is the only solution capable of meeting the government's needs. System dimensions shall not exceed 36"x45"x80" weighing 2,800 lbs for the saw and 20"x60"x72" weighing 1,250 lbs for the water unit.

Notice text

This is a Notice of Proposed Contract Action under FAR Part 12 Acquisition of Commercial Items and FAR Part 13 Simplified Acquisition Procedures.  This notice is for information only; a solicitation will not be issued. THIS IS NOT A REQUEST FOR PROPOSALS.  No contract will be awarded on the basis of offers received in response to this notice.  The associated North American Industry Classification System (NAICS) code is 333242 with a size standard of 1,500 employees.

The Government requires procurement of a wafer dicing saw and water conditioning/recycling system.  To meet this requirement the Government intends to negotiate a sole-source award with:

Disco Hi-Tec America, Inc.

5921 Optical CT

San Jose, California

The products to be acquired are essential to the Government's requirements and other companies' products do not meet, or cannot be modified to meet the Government's needs.  Disco Hi-Tec America, Inc. is the only known manufacturer capable of providing a commercial product solution that meets or exceeds the following minimum specifications:
 

  1. Semi-automatic dicing saw system that has the ability to dice standard 300mm (12 in.) wafers.
    • Maximum acceptable dimensions are 36”w x 45”d x 80”h
    • Maximum acceptable weight is 2,800 lbs
       
  2. Must include means to generate high purity (18 MOhm) water from municipal water supply for cutting in addition to cooling water. All water must be recycled and recirculated to minimize waste.
    • Maximum acceptable dimensions are 20”w x 60”d x 72”h
    • Maximum acceptable weight is 1,250 lbs.
       
  3. Y-accuracy to +/- 0.002 mm with the ability to support kerf width less than 20 microns and Z-accuracy to +/- 0.001 mm or better.
     
  4. Anticipated power requirements are 3-phase 200 to 240 VAC (-5 to +10%), power frequency 50/60 Hz.

       5. System installation and training

No responses to a Sources Sought Notice posted to SAM.gov between the dates of 22 June – 07 July 2023 were received, suggesting there are no other sources interested in or capable of fulfilling the Government’s requirement.

This is a notice of proposed contract action and NOT a request for competitive proposals.  However, all responsible sources may submit a capability statement or proposal, which shall be considered by the agency. All inquiries should be sent by email to richard.childres@us.af.mil.

Responses to this notice must be submitted by the date/time listed on the notice. Any response to this notice must show clear and convincing evidence that competition would be advantageous to the Government in future procurements.

Responses received will be evaluated; however, a determination by the Government not to compete the proposed procurement based upon responses to this notice is solely within the discretion of the Government. The Government anticipates an award date on or before 15 August 2023.

A Sole Source Justification will be attached to the subsequent Notice of Award in accordance with applicable regulation.

Notice history

Notices posted for this opportunity, newest first
Notice Type Posted
Wafer Dicing Saw and Water Conditioning/Recycling System This notice · Latest pre-solicitation Pre-Solicitation
Wafer Dicing Saw and Water Conditioning/Recycling System Original Pre-Solicitation

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