Trusted Foundry Access III – Manufacturing
Closed Solicitation Posted
- Solicitation number
- HQ072723R0001
- Agency
- Defense Microelectronics Activity Department of Defense
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 334413 Semiconductor and Related Device Manufacturing
- PSC
- 5962 Microcircuits, Electronic
- Place of performance
- McClellan, California 95652, United States
Notice details come from SAM.gov. Updated .
About this opportunity
The Defense Microelectronics Activity is soliciting proposals for the Trusted Foundry Access III - Manufacturing contract to ensure continued access to secure, state-of-the-art semiconductor foundry services over a ten-year period of performance. The solicitation seeks to provide trusted access to advanced microelectronic Application Specific Integrated Circuits technologies and supporting fabrication processes and services for the Department of Defense and other federal agencies. Proposals are due by May 11, 2023 and must demonstrate the ability to provide fabrication of integrated circuits using technologies including silicon-on-insulator, silicon-germanium, and fin field-effect transistor processes. Evaluation will consider a contractor's ability to meet trusted product flow requirements up to the secret classification level and compliance with export regulations.
There is no set-aside designation for this procurement. The NAICS code is 334413 and PSC code is J001. The total contract ceiling is $3.127 billion to be awarded to multiple contractors. The place of performance is McClellan Park, California. Up to secret classified information and non-SCI National Intelligence will be involved. Current incumbent contractors include IBM and Samsung. Multi-project wafer runs, trusted photomask sourcing, and testing and failure analysis services must be provided over the ten-year period of performance.
Notice text
3 versions
Update #3 · Latest ·
Amendment 0002 extends the response due date by three w eeks from 08 May 2023 to 11 May 2023.
Amendment 0001 extends the response due date by three w eeks from 17 April 2023 to 08 May 2023.
The mission of the Defense Microelectronics Activity (DMEA) is to focus on the warfighter’s needs by researching current and emerging microelectronics issues, leveraging advanced technologies to extend the life of weapon systems, improving reliability, maintainability, and performance, and addressing the problem of diminishing manufacturing sources. An important part of this effort is DMEA’s role in ensuring that the Department of Defense (DoD) has access to a reliable supply chain of Trusted manufacturers of key microelectronics technologies.
DMEA is the program manager for the DoD Trusted Foundry III (TFA3) program. The Trusted Access Program Office (TAPO) is chartered by the United States Government (USG) to find and accredit suppliers of Trusted microelectronics components. TAPO is entrusted to develop and maintain a reliable source of suppliers that give DoD, the Intelligence Community (IC), and other agencies required access to state of the art (SOTA) processes and services.
The purpose of the TFA3 Program is to ensure uninterrupted access to measurably secure, State-of-the-Art semiconductor foundry services over a 10-year period of performance. This contract will continue to provide Trusted access to advanced microelectronic Application Specific Integrated Circuits (ASIC) technologies and supporting fabrication processes and services for the DoD and other federal agencies.
Please see attachments for additional details.
Update #2 ·
Amendment 0001 extends the response due date by three w eeks from 17 April 2023 to 08 May 2023.
The mission of the Defense Microelectronics Activity (DMEA) is to focus on the warfighter’s needs by researching current and emerging microelectronics issues, leveraging advanced technologies to extend the life of weapon systems, improving reliability, maintainability, and performance, and addressing the problem of diminishing manufacturing sources. An important part of this effort is DMEA’s role in ensuring that the Department of Defense (DoD) has access to a reliable supply chain of Trusted manufacturers of key microelectronics technologies.
DMEA is the program manager for the DoD Trusted Foundry III (TFA3) program. The Trusted Access Program Office (TAPO) is chartered by the United States Government (USG) to find and accredit suppliers of Trusted microelectronics components. TAPO is entrusted to develop and maintain a reliable source of suppliers that give DoD, the Intelligence Community (IC), and other agencies required access to state of the art (SOTA) processes and services.
The purpose of the TFA3 Program is to ensure uninterrupted access to measurably secure, State-of-the-Art semiconductor foundry services over a 10-year period of performance. This contract will continue to provide Trusted access to advanced microelectronic Application Specific Integrated Circuits (ASIC) technologies and supporting fabrication processes and services for the DoD and other federal agencies.
Please see attachments for additional details.
Update #1 ·
The mission of the Defense Microelectronics Activity (DMEA) is to focus on the warfighter’s needs by researching current and emerging microelectronics issues, leveraging advanced technologies to extend the life of weapon systems, improving reliability, maintainability, and performance, and addressing the problem of diminishing manufacturing sources. An important part of this effort is DMEA’s role in ensuring that the Department of Defense (DoD) has access to a reliable supply chain of Trusted manufacturers of key microelectronics technologies.
DMEA is the program manager for the DoD Trusted Foundry III (TFA3) program. The Trusted Access Program Office (TAPO) is chartered by the United States Government (USG) to find and accredit suppliers of Trusted microelectronics components. TAPO is entrusted to develop and maintain a reliable source of suppliers that give DoD, the Intelligence Community (IC), and other agencies required access to state of the art (SOTA) processes and services.
The purpose of the TFA3 Program is to ensure uninterrupted access to measurably secure, State-of-the-Art semiconductor foundry services over a 10-year period of performance. This contract will continue to provide Trusted access to advanced microelectronic Application Specific Integrated Circuits (ASIC) technologies and supporting fabrication processes and services for the DoD and other federal agencies.
Please see attachments for additional details.
Attachments
| File | Type | Posted |
|---|---|---|
| HQ072723R0001 0002.pdf | ||
| HQ072723R0001 0001.pdf | ||
| JA_TFA3_GFUS2_Redacted.pdf | ||
| HQ072723R0001.pdf | ||
| Attachment J-01 DD 254 - Draft.pdf | ||
| Attachment J-02 - Offerors Question Submittal Form - TFA3-M.docx | DOCX document |
Notice history
| Notice | Type | Posted |
|---|---|---|
| Trusted Foundry Access III – Manufacturing | Solicitation | |
| Trusted Foundry Access III – Manufacturing | Pre-Solicitation |
On GovTribe
Work this opportunity on GovTribe
- Track it in your pipeline
- Find teaming partners
- Similar opportunities
- Ask GovTribe AI about this opportunity