Technology for Diffusion-Bonding Process

Closed Pre-Solicitation Posted

This opportunity was awarded. See the award notice from , or the latest solicitation from .

Solicitation number
W56HZV-23-R-0104
Agency
Responses due
Set-aside
HUBZone

Opportunity facts

Notice details come from SAM.gov. Updated .

About this opportunity

This pre-solicitation notice seeks novel bonding techniques to manufacture lightweight armor plates combining titanium and rolled homogeneous armor steel. The Department of the Army Materiel Command TACOM Life Cycle Management Command aims to probe diffusion bonding or other methods meeting performance and weight requirements for ground vehicle armor. Proposals are due December 18, 2023 under a 100% HUBZone set-aside. Evaluation will consider feasibility of the proposed techniques at sufficient scale to enable transition to Army ground systems.

The opportunity carries a HUBZone designation. Relevant codes include PSC 2850 for armor and armor plate and NAICS 332992 for steel product manufacturing from purchased steel. No incumbents or current contractors are named. Depending on results, the agency may perform concept proof and full characterization to establish feasibility for adoption. Quantities and budgets are unspecified at this pre-solicitation stage, which aims to explore bonding techniques for lightweight armor meeting military specifications.

Notice text

This is 100% HubZone set aside to probe the use of diffusion or other novel bonding techniques to manufacture 2-layer armor plates in the form of various grades of titanium backed with RHA or other armor steel for high performance armor lightweighting. Depending on initial results, proof of concept and full system characterization will also be performed to establish feasibility of meeting the performance and weight requirements at sufficient scale to enable transition to ground vehicle systems.

Notice history

Notice Type Posted
Technology for Diffusion-Bonding Process Award Award Notice
Technology for Diffusion-Bonding Process Latest solicitation Solicitation
This notice Pre-Solicitation
Technology for Diffusion-Bonding Process Original Pre-Solicitation

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