Tab 04 SOW.pdf
PDF 71 KB Posted
- Attached to
- Silicon Wafer Ball Bonder Federal contract opportunity
- Solicitation number
- 80NSSC25909413Q
About this file
This Statement of Work (SOW) details NASA's requirement for a gold wire bonder and related accessories for a silicon wafer ball bonder. The primary equipment includes an HB05 TPT Manual Wire Bonder with wedge and ball bonding capabilities, featuring a 4.3" TFT display, manual XY stage control, and work area of 200mm round base plate. The package also includes a Leica Ivesta 3 microscope, an adjustable height heater stage, and a comprehensive bond starter kit with wedge tools, capillaries, gold wire, probe needles, and accessories.
The SOW specifies a delivery milestone within 4-6 weeks of contract award, with performance to occur at the vendor's facility. The bonder supports various bonding specifications, including 17-75um wedge bonding, 17-50um ball bonding, and 25x250um ribbon bonding. The equipment comes with a shipping crate measuring L74 x W58 x H63cm and includes additional tools like tungsten wire, tweezers, and a PCB sample substrate. The solicitation is part of NASA/NSSC's procurement process for specialized scientific equipment, with the solicitation number 80NSSC25925909413Q.
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| File | Type | Posted |
|---|---|---|
| Tab 07 Capability Statement.pdf |
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Text version
Statement of Work (SOW) To Provide Ball Bonder To NASA
1. Objective/Requirement
Provide a gold wire bonder and related accessories.
2. Characteristics, Scope and Specifications
1 HB05 - TPT Manual Wire Bonder, Wedge & Ball Bonder
SKU: HB05
- Simple conversion from Wedge to Ball Bonding (Tool and Program)
- 4.3" TFT Display & Multi-Dial Controller
- Separate Manual XY Stage Control & Manual Z-Lever
- Work Area: 200mm Round Base Plate
- 17 - 75u m Wedge Bonding
- 17 - 50um Ball Bonding
- 25 x 250um Ribbon Bonding max
- 2" Wire Spool Holder
- 20 Bonding Parameters Storage Capacity
- Motorized Clamping Mechanism (Able to Feed Wire Up/Down)
- Electronic Wire Clamp for Precise Tail Length Control
- Electronic Ball Size Control
- 63.3 kHz PLL Controlled Transducer
- 0 - 10 Watt Ultrasonic Power
- Programmable Bond Time (0-1 sec.) & Force (200cN max.)
- Built-in Heater Stage Controller
2 Microscope Leica lvesta 3, 6.3x - 11Ox
SKU: H10
- Dual LED llluminator included; 2 x Ocular 20x/12, Leica Microscope Holder
3 Adjustable Height Heater Stage 0 60mm, 250°C
SKU: H26
- 18mm Vertical Travel - Mechanical Clamping and Vacuum
4 Bond Starter Kit for HB05 Wedge & Ball Bonder - Gold
SKU: H69-2G
Includes:
3 pc - H60-21 - Wedge Tool for 25u m Gold Wire 3 pc - H61-2 - Capillary for 25um Gold Wire 1 pc - H70-21 - Gold Wire 25um 100 meter 1 pc - H65 - Probe Needles for Unplugging, 25 pcs
1 pc - H66 - Tungsten Wire for Unplugging, 25 pcs 2 pc - H67 - TPT Tweezers 3 pc - H68-2 - TPT PCB Sample - Substrate
5 Shipping Crate for Bonder (HB05)
SKU: H82-1
Shipping Crate for Bonder: L74 x W58 x H63cm
3. Milestones
Milestone Title Deliverable Schedule
3.1 Delivery equipment Contract awarded (CA)+ 4-6 weeks
4. Place of Performance
Vendor Facility
5. Period of Performance
From CA date until equipment is delivered, a maximum of 6 weeks.
File details come from the government source that posted it. Updated .