Semiconductor Die Bonding and Vacuum Packaging System
Closed Pre-Solicitation Posted
- Solicitation number
- N00173-26-RFI-KN02
- Agency
-
Office of Naval Research
Secretary of the Navy, Department of Defense
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- Not on record
- PSC
- Not on record
- Place of performance
- District of Columbia 20375, United States
Notice details come from SAM.gov. Updated .
About this opportunity
The Naval Research Laboratory, Office of Naval Research, is conducting a sources sought market research effort for a Semiconductor Die Bonding and Vacuum Packaging System with responses due July 1, 2026. This is not a solicitation and carries no financial obligation; NRL remains in planning stages and may modify requirements.
The requirement encompasses an integrated die bonding and vacuum reflow system for semiconductor assembly and packaging, to be provided by a single vendor and installed at NRL-DC. The die bonding system must feature a minimum 36 x 20 inch working area, automated transfer for die ranging from 2 x 2 mm to 25 x 25 mm, placement accuracy of 5 micrometers (3 sigma) between substrate and die fiducial marks, and minimum placement rate of 200 placements per hour. Required capabilities include support for specific Spectrum Semiconductor Materials leadless chip carriers (LCC04442 and LCC08428) and 200 mm diameter silicon wafers, dual-axis vision system for automated alignment, flip-chip bonding capability, automated epoxy dispensing in dot or line patterns, pick-and-place force range of 5–5000 grams, Z-axis motion of 2 inches minimum, rotational range of 400 degrees, and motion resolution down to 0.1 micrometers (X/Y/Z axes) and 0.0005 degrees (theta).
The vacuum reflow furnace must accommodate sample mounting plates up to 4 x 5 inches minimum, operate from 25 degrees Celsius to 450 degrees Celsius with 5-degree Celsius accuracy, support programmable heating rates up to 4 degrees Celsius per second, achieve vacuum pressures of 100 milliTorr or less using dry pump technologies, and support process gas refill in the range of 1–3000 Torr with water-cooled jacket cooling.
Responses must include contact information, CAGE code, PSC code, technical capability statement, and commerciality documentation. Reference RFI N00173-26-RFI-KN02 in all submissions.
Notice text
NOTE: THIS IS NOT A SOLICITATION OR AN INDICATION THAT A CONTRACTUAL COMMITMENT WILL EXIST AS A RESULT OF THIS RFI. This Sources Sought Notice (SSN) is in support of market research and procurement planning being conducted by the Naval Research Laboratory (NRL), Washington, DC. This SSN is for informational and planning purposes only and does not guarantee that this will be competed via SAM.GOV. The Government assumes NO financial responsibility for any costs incurred. A solicitation package is not available at this time.
OBJECTIVE: The intent of this RFI is to gauge industry interest and search for potential sources capable of fulfilling a requirement for Semiconductor Die Bonding and Vacuum Packaging System in accordance with the attached draft specifications. The Government is currently in the planning stages for this procurement and may continue to modify the language within the requirement as necessary. These specifications do not necessarily represent the final specifications.
CONTRACTOR RESPONSE FORMAT: Interested parties, at a minimum, shall supply all of the below required information in a Capability Statement. (Reference RFI N00173-26-RFI-KN02 in your response)
1. CONTACT INFORMATION
a) Company Name and Address
b) Point of Contact for question/clarification
c) Telephone Number and e-mail address
d) Unique Entity ID and CAGE Code
e) PSC Code of the proposed solution (SEE https://psctool.us)
f) Business Size/Socioeconomic Categories
2. TECHNICAL INFORMATION:
a) List of capabilities/resources relevant to the attached specifications.
b.) Any questions/suggestions related to the Specifications
3. COMMERCIALITY OF PROPOSED ITEM
a) Whether item(s) offered/proposed is a commercial item and is customarily used by the general public or non-government entities for the other than Government purposes.
b) Whether the item has been sold, leased, or licensed to the general public, and if so, identify one or more such sales, leases, or licenses to document the commerciality of the item.
c) If the manufacturer of the component, please confirm if Authorized Resellers are available.
ADDITIONAL REQUIREMENT DETAILS:
Responses should be no more than 10 pages and should be emailed to the Contract Specialist at
kevin.nguyen3.civ@us.navy.mil; and to the Contrcting Officer at jamie.l.dixon8.civ@us.navy.mil.
Files
| File | Type | Posted |
|---|---|---|
| Draft Specifications_N00173-26-RFI-KN02.pdf |
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