Planar Junction Deposition System

The National Institute of Standards and Technology (NIST) is seeking to procure a Planar Junction Deposition System for its Boulder Micro-fabrication Facility through a Request for Quote (RFQ) using simplified acquisition procedures. The system must be compatible with an ISO Class 5 cleanroom and capable of RF or ion-source pre-cleaning, depositing, and co-sputtering on 3-inch and 150mm wafers. Contractors must demonstrate experience supplying and installing at least three similar systems, with specific expertise in multi-cathode co-sputtering. The evaluation will prioritize technical capability and experience over price, with contractors required to have an active SAM registration and complete all necessary representations and certifications. Quotes are due by November 4, 2024, with the government intending to award a single firm-fixed-price purchase order under the Semiconductor Machinery Manufacturing NAICS code 333242.

The solicitation does not include any specific set-aside designations, and no incumbent contractors are mentioned in the documentation. The place of performance is located in Boulder, CO 80305, with specific footprint requirements detailed in the attachments, including space for existing equipment like a 7' x 3' Chase and a 9' x 3' Slide. While a precise award value is not specified, the procurement includes the deposition system, installation, and user training. The system must meet strict physical requirements for transportability through the facility and include automated, computer-controlled operation with recipe storage, comprehensive logging, and a graphical user interface. The contract appears to be for a single unit of the specialized scientific equipment, with the procurement focused on acquiring a precise, high-performance deposition system for advanced research purposes.