PCB board fabrication and assembly

NASA's Shared Services Center intends to issue a sole source contract to Cirexx International for fabrication and assembly of FPGA interface circuit boards, with capabilities and qualifications due by June 4, 2026 at 3:00 p.m. Central Standard Time. The procurement carries a sole source determination under FAR 12.102(a), and interested organizations may submit written capabilities statements solely to permit the Government to evaluate whether to conduct the procurement on a competitive basis.

Place of performance is NASA Ames Research Center. The requirement involves fabrication and assembly of 150 custom FPGA interface PCBs designed around the Enclustra Mars ZX3 FPGA module. Fabrication requirements include controlled-impedance differential pair routing for Ethernet and USB interfaces within 0.005 inches of accuracy, high-density fine-pitch fabrication suitable for FPGA carrier board applications, and electrical continuity and shorts testing on all boards. Assembly requirements encompass all provided components—FPGA module connectors, Ethernet magnetics, USB connectors, current sense circuitry, and supporting passive components—with inspection and verification of fine-pitch solder joints and high-density interfaces. Vendors must maintain manufacturing consistency across all production units and propose the fastest possible fabrication, assembly, inspection, and delivery schedule. The NAICS code is 334412, Bare Printed Circuit Board Manufacturing; the PSC code is 5999, Miscellaneous Electrical and Electronic Components. Commercial item procedures under FAR Part 12 apply. NASA FAR Supplement Clause 1852.215-84, Ombudsman, is applicable. Kacey Hickman, Procurement Specialist (Kacey.l.hickman@nasa.gov), is the primary point of contact.