SATPC0041305 Tab 04 4 SOW.pdf
PDF 534 KB Posted
- Attached to
- PCB board fabrication and assembly Federal contract opportunity
- Solicitation number
- 80NSSC26934342Q
About this file
This is a Statement of Work for FPGA Interface Board Fabrication and Assembly Production for NASA Ames.
NASA Ames requires fabrication and assembly of 150 custom FPGA interface PCBs designed around the Enclustra Mars ZX3 FPGA module to support advanced embedded systems and avionics development activities. The boards must include high-density FPGA interconnects, controlled-impedance differential routing, Ethernet magnetics integration, USB interfaces, precision power monitoring circuitry, and multiple embedded compute interfaces. PCB fabrication requirements include controlled impedance differential pair routing for Ethernet and USB interfaces within 0.005 inches of accuracy, high-density fine-pitch fabrication suitable for FPGA carrier board applications, fabrication tolerances sufficient to maintain signal integrity and reliable FPGA operation, and electrical continuity and shorts testing on all boards. PCB assembly requirements include assembly of all provided components (FPGA module connectors, Ethernet magnetics, USB connectors, current sense circuitry, and supporting passive components), inspection and verification of fine-pitch solder joints and high-density interfaces, and vendor responsibility for maintaining manufacturing consistency across all production units. Offerors must propose the fastest possible fabrication, assembly, inspection, and delivery schedule for all 150 boards. No response dates, award dates, pricing terms, or other contract terms are specified in this SOW excerpt.
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Statement of Work
FPGA Interface Board Fabrication and Assembly Production
A. Background/History of Requirement:
NASA Ames is conducting advanced embedded systems and avionics development activities involving FPGA-based processing, high-speed communication interfaces, and distributed compute architectures. Key to this work is the development of a custom FPGA interface board capable of supporting Ethernet networking, USB boot/debug functionality, Raspberry Pi integration, and precision power monitoring in a compact embedded system. NASA seeks fabrication and assembly of 150 custom interface PCBs designed around the Enclustra Mars ZX3 FPGA module. These boards will support ongoing research and prototype system development activities related to advanced aerospace electronics and embedded processing architectures.
B. Description of item(s) to be purchased:
The items to be purchased are 150 assembled custom FPGA interface PCBs including fabrication, assembly, inspection, and electrical verification. The boards contain high-density FPGA interconnects, controlled-impedance differential routing, Ethernet magnetics integration, USB interfaces, precision power monitoring circuitry, and multiple embedded compute interfaces.
C. Requirements Specifications:
1. PCB Fabrication
a) Controlled impedance differential pair routing for Ethernet and USB interfaces within .005 inches of accuracy
b) High-density fine-pitch fabrication suitable for FPGA carrier board applications
c) Fabrication tolerances sufficient to maintain signal integrity and reliable FPGA operation
d) Electrical continuity and shorts testing required on all boards
2. PCB Assembly
a) Assembly of all provided components including FPGA module connectors, Ethernet magnetics, USB connectors, current sense circuitry, and supporting passive components
b) Inspection and verification of fine-pitch solder joints and high-density interfaces
d) Vendor responsible for maintaining manufacturing consistency across all production units
3. Period of Performance:
Offerors to propose the fastest possible fabrication, assembly, inspection, and delivery schedule for all 150 boards.
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