Packaging support engineer

NASA's Shared Services Center is soliciting a Packaging Support Engineer to support operations at NASA Goddard Space Flight Center (GSFC). This Special Notice, posted on December 1, 2025, represents a sole-source procurement under FAR 13.106-1(b)(1)(i), with TELTRIUM, INC currently identified as the sole provider. The procurement falls under NAICS code 541611 (Administrative Management and General Management Consulting Services) and PSC code R699 (Support-Administrative: Other). Interested organizations have the opportunity to challenge this sole-source determination by submitting written capabilities and qualifications to demonstrate their ability to perform the work on a competitive basis.

The primary objective of this procurement is to secure junior-level packaging engineering labor to support specialized technical tasks at GSFC from October 1, 2025, through December 31, 2026. Key responsibilities include wire bonding, wafer dicing, packaging assembly, flip chip bonding, and die attach support, with particular emphasis on the PRIMA project involving hybridization of flight-size microlens arrays with Kinetic Inductance Detector arrays. Interested contractors must submit their capabilities and qualifications in writing no later than 3:30 p.m. Central Standard Time on December 4, 2025, to either Cody Guidry (Primary Point of Contact) or Kimberlynn Lancaster (Contracting Officer). The government will evaluate submissions solely to determine whether to proceed with competitive bidding, and the final decision to compete or sole-source this effort remains entirely at the government's discretion. Contractors must demonstrate familiarity with NASA GSFC equipment and processes to minimize training time, and must be prepared to submit weekly written reports and maintain all required safety and equipment training certifications.