SATPC0040011 TAB 04 4 SOW.pdf

STATEMENT OF WORK

1. Objective/Requirements

NASA GSFC has a need for packaging support in the form of wire bonding, wafer dicing, flip chip bonding, assembly and other related activities. To keep up with demand and to retain existing flight-specific process knowledge, a packaging engineer familiar with the processes listed above is necessary.

Additionally, it is vital that engineering support be provided which requires minimal training and personnel familiar with NASA GSFC equipment and processes. This will ensure immediate support can be provided for the current work and not impose schedule delays. Utilizing personnel unfamiliar with equipment and processes would require a minimum of 6 months of safety and equipment-specific training. This training will also require current personnel to participate, further impacting ongoing work. It is imperative to have support personnel with knowledge of our existing equipment and processes.

2. Characteristics, Scope, and Specs

The contractor shall perform the following duties:

• Provide junior level engineering labor, to be agreed upon by the government.

• Submit written reports of work performed on a weekly basis.

• Be trained and become more proficient in wire bonding activities. Provide wire bonding support for projects as needed.

• Be trained and become more proficient in wafer dicing activities. Provide wafer dicing support for projects as needed.

• Be trained and become more proficient in packaging assembly activities. Provide packaging assembly support for projects as needed.

• Provide flip chip and die attach support for projects as needed.

• Utilize expertise of flip chip bonding processes to train NASA GSFC personnel on techniques and specialized equipment as needed.

• Train and become proficient working alongside NASA GSFC personnel in support of flight projects and/or R&D projects in the areas of documentation, following work instructions and other lab protocols.

• Maintain the required safety and equipment training to work in labs associated with PRIMA, NGMSA and other projects.

• For the PRIMA project, carry out hybridization of five flight-size microlens arrays with

Kinetic Inductance Detector arrays using flip-chip bonding methods developed to meet the requirements of the PRIMA/FIRESS instrument.

• Provide packaging-related support for other projects as needed and directed by NASA GSFC personnel.

3. Place of Performance

NASA GSFC; Building 11, Labs: S007, S014, S026 and Building 30, Labs: 009K and 200

4. Period of Performance

Work shall be performed from October 1st, 2025 through December 31st, 2026

AI VERBIAGE:

1) Use of Artificial Intelligence (AI) During Contract Performance (SEP 2025) which requires contractors to disclose the use of AI technologies at any time during the fulfillment of the contract. This requirement statement must be included in all contracts (including orders); and

2) Artificial Intelligence (AI) Acquisitions (SEP 2025) which provides additional contractor requirements when the contract is acquiring covered AI systems or services as defined by OMB memo M-25-22. This requirement statement must be included in all contracts (including orders) when acquiring covered AI systems or services. Covered AI systems or services and exceptions are listed below as defined OMB memo M-25-22).