Multi-Chip Module Packaging of SiC Pressure Sensors and Electronics
Closed Special Notice Posted
- Solicitation number
- 80NSSC24881222Q
- Agency
- Shared Services Center National Aeronautics and Space Administration
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 334419 Other Electronic Component Manufacturing
- Place of performance
- Cleveland, Ohio 44135, United States
- Points of contact
-
- Tessa Martinez tessa.m.martinez@nasa.gov (228) 813-6962
Notice details come from SAM.gov. Updated .
About this opportunity
The National Aeronautics and Space Administration (NASA) Shared Services Center has published a Special Notice for a sole source requirement for the Multi-Chip Module Packaging of Silicon Carbide (SiC) Pressure Sensors and Electronics. NASA intends to issue a sole source contract to Sienna Technologies, Inc. for these services under the authority of FAR 13.106-1(b)(1)(i), as they have been determined to be the sole provider of this capability.
The purpose of this procurement is to acquire commercial items and services for the packaging of SiC integrated pressure/temperature sensors and SiC amplifier chips onto an aluminum nitride (AlN) circuit board in a Multi-Chip Module configuration. The required services will be performed at the NASA Glenn Research Center. The government has set a deadline of August 23, 2024 for interested organizations to submit their capabilities and qualifications in writing, which will be evaluated to determine if the requirement should be competed. The NAICS code for this procurement is 334419 - Other Electronic Component Manufacturing, and the PSC code is H181-P - Quality Control- Containers, Packaging, And Packing Supplies.
Notice text
**SOLE SOURCE REQUIREMENT** FOR
Multi-Chip Module Packaging of SiC Pressure Sensors and Electronics
Attachments
| File | Type | Posted |
|---|---|---|
| SATPC0036443 Tab 07 Capability Statement SAM.gov.pdf | ||
| SATPC0036443 Tab 04 4 SOW.pdf | ||
| SATPC0036443 Tab 06 RDSS.pdf |
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