SATPC0036443 Tab 04 4 SOW.pdf
PDF 264 KB Posted
- Attached to
- Multi-Chip Module Packaging of SiC Pressure Sensors and Electronics Federal contract opportunity
- Solicitation number
- 80NSSC24881222Q
About this file
This document is a Statement of Work (SOW) for the Multi-Chip Packaging of Silicon Carbide (SiC) Pressure/Temperature Sensors and Amplifier.
The SOW outlines the requirements for packaging SiC integrated pressure/temperature sensors and SiC amplifier chips onto an aluminum nitride (AlN) circuit board in a Multi-Chip Module (MCM) configuration. The AlN circuit board must have a coefficient of thermal expansion closely matching SiC. After the MCM packaging, the customer will test the assembly for functionality up to 600°C and 50 psi pressure. The AlN receptacle must be brazed to a Kovar tube and withstand temperatures up to 700°C. Helium leak testing is required for the AlN/Kovar and AlN/AlN interfaces to limit leakage to 1x10-8 cc/s. The fully packaged MCM on the AlN circuit board must withstand 100 psi with less than 1x10-7 m of deflection. The connecting pins must be nickel with gold plating.
View the file
Other files for this federal contract opportunity
| File | Type | Posted |
|---|---|---|
| SATPC0036443 Tab 07 Capability Statement SAM.gov.pdf | ||
| SATPC0036443 Tab 06 RDSS.pdf |
On GovTribe
Work with this file on GovTribe
- Download the original file
- Contacts named in this file
- Similar government files
- Ask GovTribe AI about this file
Text version
Statement of Work for Mul�-Chip Packaging of Silicon Carbide Pressure/Temperature Sensors and Amplifier
• Silicon Carbide (SiC) integrated pressure/temperature sensors and SiC amplifier chips will be provided to the vendor for atachment to the aluminum nitride (AlN) circuit board (see Fig. 1) in a Mul�-Chip Module (MCM) configura�on.
• The circuit board shall be made of AlN with the coefficient of thermal expansion of not more than 4 ppm/C, closely matching to SiC.
• A�er the MCM packaging, tes�ng up to 600 C and pressure up to 50 psi for 1 hr shall be performed by customer to verify func�onality.
• The AlN circuit board (Fig. 2) and receptacle atached together using either high temperature adhesive sealing glass or brazing.
• The AlN receptacle shall be brazed to Kovar tube and withstand temperature up to 700 C.
• Helium leak tes�ng of the AlN/Kovar and AlN/AlN shall be performed to achieve no more than
1x10-8 cc/s.
• When fully packaged, the MCM AlN circuit board shall withstand 100 psi with deflec�on of less than 1x10-7 µm.
• The connec�ng pins shall be made of nickel and electroplated with gold.
Fig. 1: Header and body Fig. 2: Circuit Board.
Statement C: Distribution authorized to U.S. Government agencies and their contractors; Export Controlled; MAY 6, 2024. Other requests for this document shall be referred to NATIONAL AERONAUTICS AND SPACE ADMINISTRATION/ADVANCED AIR VEHICLE PROGRAM/HYPERSONIC TECHNOLOGY PROJECT/Mary Jo Long-Davis, (216)433-8708.
WARNING – This document contains technical data whose export is restricted by the Arms Export Control Act (Section 2751 of Title 22, U.S.C.) or the Export Control Reform Act of 2018 (Chapter 58 Sections 4801-4852 of Title 50, U.S.C). Violations of these export laws are subject to severe criminal penalties. Disseminate in accordance with provisions of DoD Directive 5230.25 and DoD Instruction 2040.02.
DESTRUCTION NOTICE - For classified documents, follow the procedures in DoD 5200.22-M, National Industrial Security Program Manual, Chapter 5, Section 7. For unclassified, limited documents, destroy by any method that will prevent disclosure of contents or reconstruction of the document.
File details come from the government source that posted it. Updated .