Maintenance service contract for the FC150 and FC300 flip chip bonders

The National Aeronautics and Space Administration (NASA) has issued a Special Notice for a maintenance service contract for FC150 and FC300 flip chip bonders located at the Goddard Space Flight Center. The contract is specifically targeted for maintenance services of high-precision semiconductor and MEMS device bonding equipment used in the Code 553 Detector Development Lab. NASA's National Shared Services Center (NSSC) is managing this procurement, which is set aside for small businesses. The contract duration will span two years, from 4/30/2025 to 4/29/2027, with a focus on maintaining critical scientific equipment. The procurement will be conducted under NAICS Code 541990 for professional, scientific, and technical services.

NASA intends to issue this contract to JB Technical Support Service LLC as a sole source procurement under FAR 13.106-1(b)(1)(i), having determined they are the exclusive maintenance service provider for these specific equipment types. Interested contractors must submit their capabilities and qualifications in writing by 4:00 p.m. Central Standard Time on 5/30/2025, with the understanding that NASA retains sole discretion on procurement approach. The service contract requires four total service visits: two annual preventative maintenance calls and two emergency calls with a 48-hour response time. Additional service provisions include unlimited phone, email, and remote support, with unused emergency calls eligible for carryover upon contract renewal. The maintenance will be performed at specific locations within Goddard Space Flight Center, and the contract aims to ensure reliable operation of these critical scientific tools through qualified field service engineers.