Ion Beam Etch and Ion Beam Deposition system

Closed Pre-Solicitation Posted

This opportunity was awarded. See the award notice from , or the latest solicitation from .

Solicitation number
AMD-SS23-09
Agency
National Institute of Standards and Technology Department of Commerce
Responses due
Set-aside
No set-aside

Opportunity facts

NAICS code
333242 Semiconductor Machinery Manufacturing
PSC
Not on record
Place of performance
Boulder, Colorado 80305, United States

Notice details come from SAM.gov. Updated .

About this opportunity

This pre-solicitation notice seeks an Ion Beam Etch and Ion Beam Deposition system to support research at the National Institute of Standards and Technology's Boulder Microfabrication Facility. The system must be capable of etching and depositing various materials on 150mm wafers with uniformity of 1.5% for deposition and 2% for etching. Respondents must provide documentation of a deployed system meeting these specifications. Responses are due by April 11, 2023 and should be emailed to forest.crumpler@nist.gov, including specifications and capabilities.

There is no set-aside designated. The associated NAICS code is 333242 for semiconductor and other electronic component manufacturing. Companies should include their size classification and socio-economic status in any response. The Boulder Microfabrication Facility requires this system to support its next generation device fabrication, though specific budget or quantity details are not provided.

Notice text

NO SOLICITATION DOCUMENTS EXIST AT THIS TIME

NIST-Boulder has a state-of-the-art research laboratory (the Katharine Blodgett Gebbie Building) to support the most sensitive research done at NIST. Included in this building is a Class 100 microelectronics fabrication facility, called the Boulder Micro-fabrication Facility (BMF).  The BMF requires an Ion Beam Etch and Ion Beam Deposition (IBE/IBD) system in order to fabricate its next generation devices.  The system must be a vacuum chamber with a load lock that can perform ion beam etching of substrates and deposit materials including but not limited to; Germanium (Ge), Magnesium Fluoride (MgF2), Tantalum Pentoxide (Ta2O5), Silicon Nitride (SiNx), Gold (Au), Copper (Cu), Tantalum (Ta), Silicon (Si), Aluminum (Al) and methane-based diamond-like carbon deposition in a manner that is consistent with methods used for (IBE/IBD) in the semiconductor industry.

In order to meet its research requirements, the BMF requires a system that can process on a substrate with lateral dimensions of a 150 mm SEMI spec wafer and that provides uniform etch and deposition rates. 

Minimum Requirements

The tool must provide a deposition uniformity of better than 1.5 % (½ * range/mean) across a substrate with lateral dimensions of a 150 mm SEMI spec wafer that has one SEMI-standard flat at the bottom minus a 5 mm edge exclusion zone around the edge of the wafer and an etch uniformity of better than 2 % (½ * range/mean) across a substrate with lateral dimensions of a 150 mm SEMI spec wafer and one SEMI-standard flat at the bottom minus a 5 mm edge exclusion zone around the edge of the wafer. To meet this criterion, the contractor shall provide documentation of a deployed system, that is the same model in the bid, that can meet these specifications.

NIST is seeking responses from all responsible sources, including large, foreign, and small businesses. Small businesses are defined under the associated NAICS code for this effort, 333242, as those domestic sources with a size standard of 1,500 employees or less. Please include your company’s size classification and socio-economic status in any response to this notice. 

Companies that provide equipment that can meet the stated requirements are requested to email a detailed report describing their products to forest.crumpler@nist.gov no later than the response date for this Sources Sought Notice. The report should include achievable specifications and any other information relevant to your product or capabilities.

Notice history

Notices posted for this opportunity, newest first
Notice Type Posted
Purchase of an Ion Beam Etch and Ion Beam Deposition System Award Award Notice
Purchase of an Ion Beam Etch and Ion Beam Deposition System Latest solicitation Solicitation
Ion Beam Etch and Ion Beam Deposition system This notice · Original Pre-Solicitation

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