Inductively Coupled Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) or High-Definition Plasma Enhanced Chemical Vapor Deposition (HD-PECVD).

Closed Pre-Solicitation Posted

This opportunity was awarded. See the award notice from , or the latest special notice from .

Solicitation number
NIST-SS23-CHIPS-0026
Agency
Responses due
Set-aside
No set-aside

Opportunity facts

Place of performance
Boulder, Colorado 80305, United States

Notice details come from SAM.gov. Updated .

About this opportunity

The National Institute of Standards and Technology seeks information from potential vendors for an inductively coupled plasma enhanced chemical vapor deposition or high-definition plasma enhanced chemical vapor deposition tool capable of depositing silicon dioxide and silicon nitride films between 100nm to 1 micron thick at temperatures as low as 20 degrees Celsius on wafers from 3 to 150mm. Respondents are asked to provide company information, identify equipment that meets specifications, describe customization capabilities, and detail terms, pricing, and services. Responses to this sources sought notice will aid NIST in appropriately soliciting for its thin film deposition requirements in the near future.

No set-aside is designated for this procurement. Responses to the sources sought notice are due by December 6, 2022 and will be considered for market research purposes, though no award will result from this notice. The tool sought falls under NAICS code 333298, Other Industrial Machinery Manufacturing, with an expected PSC code of Q2X. Current contractors were not identified. The notice does not provide budget ranges or quantity details.

Notice text

THIS IS A SOURCES SOUGHT NOTICE.

PLEASE SEE ATTACHMENT NIST-SS23-CHIPS-0026 FOR THE COMPLETE NOTICE DETAILS. 

Files

File Type Posted
NIST-SS23-CHIPS-0026.docx DOCX document

Notice history

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