F-16 Circuit Card Assembly

The Defense Logistics Agency Aviation is soliciting proposals for the manufacture of F-16 Circuit Card Assemblies under National Stock Number 5998-01-555-5340. This acquisition is restricted to two qualified sources: InDesign (CAGE code 1UQ09) and BAE Systems (CAGE code 94117), with the requirement that the part must be manufactured by one of these qualified sources regardless of which vendor receives the award. The contract is structured as a fixed-price arrangement requiring compliance with various quality standards including ISO 9001-2015, item unique identification (IUID) marking, and comprehensive military packaging standards per MIL-STD-2073-1 and related specifications. The original solicitation was issued on January 30, 2025, with the response deadline subsequently extended to March 21, 2025, at 11:59 PM through Amendment 0001. Offerors must maintain firm pricing for 120 days following submission, and the contract carries a DO-A1 priority rating.

This procurement does not utilize any set-aside designations and is classified under NAICS code 334412 (Bare Printed Circuit Board Manufacturing) with a size standard of 750 employees. The requirement encompasses 49 units of F-16 circuit card assemblies with delivery required by October 31, 2026, allowing for early and partial deliveries at no additional cost to the government. Performance will take place at Hill Air Force Base in Utah, with the contracting operation managed by DLA Aviation - Ogden DLR Procurement Operations. The contract includes deliverables such as a Counterfeit Prevention Plan and requires adherence to stringent preservation, packaging, and marking requirements including specialized handling for electrostatic-sensitive devices and compliance with international phytosanitary measures for wood packaging materials. While specific contract values are not disclosed in the solicitation documents, the procurement represents a specialized defense manufacturing requirement with extended delivery timelines reflecting the complexity of the electronic assemblies.