Environmental Testing of Electronic Assemblies Blanket Purchase Agreement (BPA)

The Defense Microelectronics Activity (DMEA) is seeking to establish up to three Blanket Purchase Agreements (BPAs) for comprehensive environmental testing services of electronic assemblies used in Department of Defense programs. The procurement covers a wide range of testing capabilities including vibration, physical shock, thermal cycling, altitude, humidity, salt-fog, electromagnetic interference, and combined environment testing to qualify and validate electronic assemblies to MIL STD or custom specifications. Contractors must possess internal capabilities to perform at least eight of the twenty-seven specified microelectronic test services and be able to provide detailed technical reports within five days of test completion. Proposals will be evaluated based on three key factors: technical capabilities, past performance, and pricing, with vendors required to submit a 5-page technical capability description along with pricing information including labor rates, equipment usage, and materials costs. The proposal submission deadline has been extended to 2:00 PM Pacific on October 20, 2025, following an amendment issued on October 6, 2025.

This solicitation features a local set-aside preference for vendors located within 120 miles of DMEA's McClellan, California facility, though no specific small business set-aside designation is applied. The BPA structure includes a 3-year performance period with a cumulative ceiling of $900,000 and a minimum order requirement of $2,500 per task order. Individual quotes must be provided within 5 business days when requested, with contractors required to initiate services within 15 calendar days of receiving valid orders. The primary place of performance is McClellan Park, California, where DMEA's facility is located at 4234 54th Street. The government will provide necessary engineering drawings, material lists, and technical specifications to support the testing process, with the overarching objective of rapidly validating developmental printed circuit board assemblies and monitoring live device testing for DoD programs.