DMEA Kulicke & Soffa (KnS) Wire Bonder RAPID Pro
Closed Solicitation Posted
- Solicitation number
- HQ072723R0009
- Agency
-
Defense Microelectronics Activity
Department of Defense
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 334519 Other Measuring and Controlling Device Manufacturing
- Place of performance
- McClellan, California 95652, United States
Notice details come from SAM.gov. Updated .
Notice text
MEA is seeking the acquisition of a new Wire Bonder to complete Microcircuit Assembly (MCA) projects within DMEA. The KnS Wire Bonder RAPID Pro allows operators to wire bond die to package, establishing continuity to the desired die circuitry.
Files
| File | Type | Posted |
|---|---|---|
| RFP_HQ072723R0009_Redacted.pdf | ||
| JA 23-3D1_Redacted.pdf |
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