Direct Bonding for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays
Award Notice Posted
A later notice was posted: the Limited / Sole Source Justification from .
- Solicitation number
- W56KGU26CA004
- Agency
-
ACC Aberdeen Proving Ground
Army Contracting Command, Department of Defense
- Awarded
- to DRS Network & Imaging Systems LLC
- Set-aside
- No set-aside
Opportunity facts
- Contract number
- W56KGU26CA004 Federal contract award
- NAICS code
- Not on record
- PSC
- Not on record
- Place of performance
- Fort Belvoir, Virginia, United States
Notice details come from SAM.gov. Updated .
About this opportunity
The Department of the Army Materiel Command, Army Contracting Command Aberdeen Proving Ground awarded contract W56KGU26CA004 to DRS Network & Imaging Systems LLC for $8.3 million on May 18, 2026, for direct bonding for compound semiconductor for use in dual band infrared focal plane arrays.
The award was made under unrestricted competition with no set-aside applied.
Notice text
Awarded contract W56KGU26CA004 to DRS NETWORK & IMAGING SYSTEMS LLC for 8321532.00 on 2026-05-18.
Notice history
| Notice | Type | Posted |
|---|---|---|
| J&A - Direct Bonding | Limited / Sole Source Justification | |
| This notice | Award Notice |
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